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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
..., manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130529
EISBN: 978-1-62708-284-6
... that are defined by conversion tables limited to specific categories of materials. That is, different conversion tables are required for materials with greatly different elastic moduli or with different strain-hardening capacity. The most reliable hardness-conversion data exist for steel that is...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280353
EISBN: 978-1-62708-267-9
... companies or institutions active in superalloys are represented. No recommendation is made or implied by this list. Moreover, the changing industry mix may make some parts of this list obsolete. All information compiled April 2001. Sources of collected property data on superalloys are not all that...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... test. Often extra “data collection” or “characterization” tests are applied for a sample of parts. The tests described in this section may be applied at either wafer or package test or both. Figure 1 Typical IC test flow. Trends discussed earlier in...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280011
EISBN: 978-1-62708-267-9
..., may be hard to gather. Some archival collections of tabulated data on superalloys have been made. Computer-based data collections have been produced. Unfortunately, there is little likelihood that these collections can serve as much more than a starting point. The subject of design allowables and...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... failing electrical signature must be confirmed in the lab, even for the “simple” opens and shorts associated with package failures. IV curves should be collected as they provide much more insight into what is wrong with the device. Figure 5 shows curve trace data between bumps A2 and A3 on device...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110262
EISBN: 978-1-62708-247-1
... database administrator (DBA). Having a designated DBA can significantly mitigate the challenges associated with data gathering, automation and scale. Other benefits include efficient data storage and management, database uniformity, having a single point of contact to collect enduser feedback and drive new...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870031
EISBN: 978-1-62708-314-0
... physical and mechanical property data for commercially important high-strength fibers. aramid fibers carbon fibers composite reinforcement glass fibers graphite fibers prepreg ultra-high molecular weight polyethylene fibers woven fabrics REINFORCEMENTS for composite materials can be...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550325
EISBN: 978-1-62708-307-2
... affect impact and tensile strength, shrinkage, thermal expansion, and thermal conductivity. It examines the relationship between tensile modulus and temperature, provides thermal property data for selected plastics, and discusses the effect of chemical exposure, operating temperature, and residual stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550621
EISBN: 978-1-62708-307-2
... Abstract This chapter consists of three parts. The first part provides data and guidelines for selecting materials and processing routes. It compares the basic properties of metals, ceramics, and polymers, identifies important measures of performance, and discusses manufacturing processes and...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... extension of the preceding chapter on design analysis. Statistics is a branch of mathematics dealing with the collection, analysis, and interpretation of data from a sample population of objects or measurements. Statistics refers to gathering numerical data to present information about a subject...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... virtual slices of the 3D reconstruction. Over the past decade, there has been significant development in 3D FIB technology for both data collection and data processing. The ability to probe a relatively large volume (10 - 30 μm 3 ) and characterize features or defects with nanometer level...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
... overall test time budgets, the increase in test-time due to fail data collection needs to be limited relative to the total test-time. A test flow to collect fail data is illustrated in Figure 1 . The scan test content includes a scan-system test to determine if scan-system is functional. After the scan...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
... detection length for short fault isolation by taking advantage of the fact that signals can be collected at additional input-output ports. It discusses how to optimize TDR and TDT data collection, and introduces equations to achieve significant improvement of signal detection length while preserving its...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... important to understand that a closed-loop system may introduce noise into the data (degrading the signal to noise ratio) when collecting data in very small fields of view (e.g., <100nm). It may be advantageous to run in an open loop for small fields of view. As the probe is rastered across the...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440243
EISBN: 978-1-62708-262-4
... requires some definitions. The principles of SPC rely on the science of statistics: the collection and classification of facts from which conclusions can be drawn with a given degree of certainty. Statistics may be used to analyze such data as obtained in coin tossing, throwing dice, measuring dimensions...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... different layers of IC metal interconnects. This data has been collected primarily from silicon process technologies ranging from 180nm to 28nm and includes a wide range of different design types (logic, RF/analog, and power) and a number of semiconductor foundries. Data demonstrates the XY FIB geometries...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780171
EISBN: 978-1-62708-268-6
.... Simply examining the guillotines to determine if they cut or clamped was not adequate, because ANOVA could not be performed on these attributes characteristics. After collecting the output data, the failure analysis team prepared the ANOVA. A Taguchi experiment uses a simplified formula for the sums...