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data analysis

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Published: 30 June 2023
Fig. 9.16 Fatigue crack growth testing and data analysis. (a) Crack length measurement, (b) calculation of crack growth rate, and (c) analysis of da/dN versus stress intensity range. More
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Published: 01 November 2019
Figure 18 Histogram of the deposition data from analysis of 4 process technology nodes (180nm, 65nm, 45nm, 28nm). [28] More
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Published: 01 September 2005
Fig. 4 Weibull analysis with RCF test data More
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Published: 30 April 2020
Fig. 3.18 Pressure-volume-temperature data taken via thermomechanical analysis. Such data are valuable in developing constitutive equations, as used in computer simulations. These data are fit to polynomial equations to provide density for the solid or liquid versus temperature and pressure More
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Published: 01 January 2017
Fig. 6.13 Comparison of D-STEM analysis data ( Ref 6.45 ) from commercial-purity type 348 and high-purity type 348 stainless steels irradiated to various fluences in a BWR. These data generally agree with the AES data in Fig. 6.12 on the identical materials. Source: Ref 6.1 More
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Published: 01 December 2004
Fig. 6.3 Weibull analysis of fatigue data for A357.0-T6 aluminum alloy castings with and without Densal II HIP. Source: Ref 6 More
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Published: 01 March 2006
Fig. 3.5 Analysis by Manson ( Ref 3.8 ) using data of Coffin and Tavernelli ( Ref 3.7 ) to demonstrate the validity of an elastic line even for highly hardening or softening material. (a) Cold-worked copper. (b) Annealed copper More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
..., manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180061
EISBN: 978-1-62708-256-3
... Abstract Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060001
EISBN: 978-1-62708-355-3
... curves, true stress and strain, and test methodology and data analysis. • Hosford W.F. , Overview of Tensile Testing , Tensile Testing , Han P. , Ed., ASM International , 1992 , p 1 – 24 • Mumford P.M. , Test Methodology and Data Analysis , Tensile Testing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870351
EISBN: 978-1-62708-314-0
... amorphous thermoplastics are very sensitive to solvents, especially paint strippers that contain methylene chloride. Testing should be conducted after exposure to the various fluids that the composite can be exposed to in service. 13.15 Data Analysis Design allowables for composite materials usually...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780171
EISBN: 978-1-62708-268-6
... analysis team calculates the mean of the entire group. The failure analysis team calculates the column sum of the squares by finding the difference between the mean of each group and the mean of the entire group, squaring the result, multiplying the result by the number of data points in each group...
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Published: 01 June 1988
Fig. 7.4 Tomographic reconstruction of the ultrasonic velocity-temperature distribution in a solid bar: (a) schematic velocity-temperature curve for a uniformly heated bar, (b) schematic illustration of equipment setup, and (c) diagram illustrating method of data analysis. From R. Mehrabian More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060251
EISBN: 978-1-62708-355-3
... of the Ring Test Method 2 Data Analysis <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13)</xref> Method 3 The Split-Hopkinson Pressure bar Technique <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13)</xref> Tensile Loading Techniques <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
.... Comprehensive data is now available due to the massive expansion of semiconductor content and a corresponding affinity for data collection across the world. With more data available for appraisal and analysis, the semiconductor industry is front and center utilizing artificial intelligence (AI), machine...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... samples’ position and view multiple angles to make real-time observations. Some manufacturers have also provided integration to CAD design data to allow live overlay on 3D X-ray images for direct comparison and defect analysis [10] . During the past decade, the increasing complexity and 3D nature...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... of the preceding chapter on design analysis. Statistics is a branch of mathematics dealing with the collection, analysis, and interpretation of data from a sample population of objects or measurements. Statistics refers to gathering numerical data to present information about a subject. Probability is another...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... is the greatly increased computer processing requirements relative to those of binary systems. A 256 × 256 pixel image array with up to 256 different values per pixel will require over 65,000 8-bit storage locations for analysis. At a speed of 30 images per second, the data processing requirement becomes very...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060163
EISBN: 978-1-62708-355-3
...) Recommended Procedures for High-Temperature Tensile Testing of Ceramics and CMCs Monolithic Ceramics and Low-Toughness CMCs High-Toughness CMCs and other Ceramics with High Strains to Failure Specialized Materials (Such as Heat-Exchanger Tubes) Recommended Procedures for Data Analysis Strain...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040083
EISBN: 978-1-62708-300-3
... Abstract This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements...