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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
..., manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870351
EISBN: 978-1-62708-314-0
... Abstract This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110010
EISBN: 978-1-62708-247-1
... a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
...’ position and view multiple angles to make real-time observations. Some manufacturers have also provided integration to CAD design data to allow live overlay on 3D X-ray images for direct comparison and defect analysis [10] . During the past decade, the increasing complexity and 3D nature of...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780075
EISBN: 978-1-62708-268-6
... records to show that the products and materials they used met all requirements. The failure analysis team should review the inspection records in areas related to the hypothesized failure causes. The data may show that requirements were not met, but the product continued through production as if it...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
... semiconductor technologies and provided critical data from initial concept to technology development as well as from manufacturing to failure analysis. Following is a discussion of some of the SPM modes of operation and their applications to semiconductor device analysis. Detailed discussions of...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110499
EISBN: 978-1-62708-247-1
... localization techniques complete the toolset in the fifth part. Diagnostic procedures both in product development and in mass production have three steps. Firstly, electrical data from measurement is obtained that is analyzed and that leads secondly to a localization of defects. The third step is the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... manipulate samples’ position and view multiple angles to make real-time observations. Some manufacturers have also provided integration to CAD design data to allow live overlay on 3D X-ray images for direct comparison and defect analysis [20] . Most X-ray equipment manufacturers now provide 3D models...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
... benefit the user gets from using layout in diagnosis. Correlating the diagnosis result with other data, like inline inspection or layout image overlays has proven to increase the failure analysis success. Early papers describing successful case studies are [34 , 35] . The principle behind this...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... analyzer cam be stopped, and the transistor curve data saved for analysis. The primary transistor characterization method is the Id vs Vgs, step Vds characterization. Finding the transistor threshold voltage (Vt) and drive current at nominal operating voltages is of the most importance to an analyst...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation...
Series: ASM Technical Books
Publisher: ASM International
Published: 23 January 2020
DOI: 10.31399/asm.tb.stemsem.9781627082921
EISBN: 978-1-62708-292-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... to corroborate the data and give confidence to the analysis path set forth to determine root cause. Once a destructive analysis has begun, there is no way back and limited opportunity to re-measure and recreate fail data. The sample will change form as it is mechanically or FIB (Focus Ion Beam...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... requires that analysts keep an open mind and a willingness to revisit earlier conclusions if the original diagnosis does not pan out. A humble attitude is a useful asset in failure analysis. Too often analysts sweep conflicting data under the carpet. Often those seeming contradictions are trying to tell...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... approaches the saturation effect for B < 1 (see eq. 1 ). eq. 1 E D X   r a t i o   = A *   O x i d e   t h i c k n e s s     [ n m ] B . By minimizing the sum of squared residuals, the two variables A and B will be fitted to the experimental data...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... defect, or it may be due to a particular transistor or interconnect line. The failure is probably sensitive to temperature, V DD , or clock frequency. Traditional approaches would examine test data and simulation results. This approach is inefficient, and failure analysis with these techniques have been...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110032
EISBN: 978-1-62708-247-1
... decision element; and the aggregation of this data to a decision point. The decision elements may be subdivided hierarchically as needed to establish the appropriate granularity of the elements. The process may be done by hand for the case of three or fewer alternatives but is best done using a spreadsheet...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110434
EISBN: 978-1-62708-247-1
... to publish data claiming the presence of trace elements in a sample when the trace element peaks were actually silicon escape peaks. Characteristic x-ray peaks can be identified using tables such as Table 2 . Most x-ray analysis programs will also have automated software for peak identification...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130111
EISBN: 978-1-62708-284-6
... corrosion also can be important damage factors in failure analysis. For a complete evaluation, the sequence of stages in the investigation and analysis of failure, as detailed in Ref 5 , is as follows (Ref 2) : Collection of background data and selection of samples Preliminary...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... looking for the failure there. After several months without making any progress, the McDonnell Douglas engineers and scientists decided to re-examine the test data. When they did this, they made two critical discoveries. The problem only appeared at cold temperatures, and both the laser beam and the...