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data analysis
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Image
Published: 30 June 2023
Fig. 9.16 Fatigue crack growth testing and data analysis. (a) Crack length measurement, (b) calculation of crack growth rate, and (c) analysis of da/dN versus stress intensity range.
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Image
in Role of Advanced Circuit Edit for First Silicon Debug
> Microelectronics Failure Analysis<subtitle>Desk Reference</subtitle>
Published: 01 November 2019
Figure 18 Histogram of the deposition data from analysis of 4 process technology nodes (180nm, 65nm, 45nm, 28nm). [28]
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Image
Published: 01 September 2005
Image
Published: 30 April 2020
Fig. 3.18 Pressure-volume-temperature data taken via thermomechanical analysis. Such data are valuable in developing constitutive equations, as used in computer simulations. These data are fit to polynomial equations to provide density for the solid or liquid versus temperature and pressure
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Image
in Irradiation-Assisted Stress-Corrosion Cracking[1]
> Stress-Corrosion Cracking: Materials Performance and Evaluation
Published: 01 January 2017
Fig. 6.13 Comparison of D-STEM analysis data ( Ref 6.45 ) from commercial-purity type 348 and high-purity type 348 stainless steels irradiated to various fluences in a BWR. These data generally agree with the AES data in Fig. 6.12 on the identical materials. Source: Ref 6.1
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Published: 01 December 2004
Fig. 6.3 Weibull analysis of fatigue data for A357.0-T6 aluminum alloy castings with and without Densal II HIP. Source: Ref 6
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Published: 01 March 2006
Fig. 3.5 Analysis by Manson ( Ref 3.8 ) using data of Coffin and Tavernelli ( Ref 3.7 ) to demonstrate the validity of an elastic line even for highly hardening or softening material. (a) Cold-worked copper. (b) Annealed copper
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
..., manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure...
Abstract
Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180061
EISBN: 978-1-62708-256-3
... Abstract Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding...
Abstract
Statistics, data analysis, root cause analysis, and problem-solving processes play a key role in failure investigations. This chapter explains how to collect failure investigation data, how to build and maintain a database for company-related failures, and how to use corresponding statistics including type of failure, material, and root cause. It describes the purpose and benefits of conducting a root cause analysis and the factors, namely relative failure importance and company value, that determine when an investigation should be performed. The chapter also discusses the four-step problem-solving process as it applies to failure investigation, how to assemble an investigation team, and the details of organization and planning. It concludes with a case history of the Firestone 500 steel-belted tire failure, stressing the importance of a systematic approach to failure investigations.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060001
EISBN: 978-1-62708-355-3
... curves, true stress and strain, and test methodology and data analysis. • Hosford W.F. , Overview of Tensile Testing , Tensile Testing , Han P. , Ed., ASM International , 1992 , p 1 – 24 • Mumford P.M. , Test Methodology and Data Analysis , Tensile Testing...
Abstract
Tensile tests are performed for several reasons related to materials development, comparison, selection, and quality control. The properties derived from tensile tests are used in selecting materials for engineering applications. Tensile properties often are used to predict or estimate the behavior of a material under forms of loading other than uniaxial tension. This chapter provides a brief overview of tensile specimens and test machines, stress-strain curves, true stress and strain, and test methodology and data analysis.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870351
EISBN: 978-1-62708-314-0
... amorphous thermoplastics are very sensitive to solvents, especially paint strippers that contain methylene chloride. Testing should be conducted after exposure to the various fluids that the composite can be exposed to in service. 13.15 Data Analysis Design allowables for composite materials usually...
Abstract
This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780171
EISBN: 978-1-62708-268-6
... analysis team calculates the mean of the entire group. The failure analysis team calculates the column sum of the squares by finding the difference between the mean of each group and the mean of the entire group, squaring the result, multiplying the result by the number of data points in each group...
Abstract
After the failure analysis team hypothesizes failure causes, prepares a failure mode assessment and assignment, and evaluates all potential failure causes, it may find in some cases that several causes are still suspect but cannot be confirmed. In this situation, an experiment is necessary to confirm or rule out suspected causes. This chapter discusses two predominant methods for doing this, namely analysis of variance (ANOVA) and Taguchi methods (a more powerful technique based on ANOVA).
Image
in Fundamentals of Process Control
> Elements of Induction Heating: Design, Control, and Applications
Published: 01 June 1988
Fig. 7.4 Tomographic reconstruction of the ultrasonic velocity-temperature distribution in a solid bar: (a) schematic velocity-temperature curve for a uniformly heated bar, (b) schematic illustration of equipment setup, and (c) diagram illustrating method of data analysis. From R. Mehrabian
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Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060251
EISBN: 978-1-62708-355-3
... of the Ring Test Method 2 Data Analysis <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13)</xref> Method 3 The Split-Hopkinson Pressure bar Technique <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13)</xref> Tensile Loading Techniques <xref rid="t51060251-ref13" ref-type="bibr">(Ref 13...
Abstract
High strain rate tensile testing is used to understand the response of materials to dynamic loading. The behavior of materials under high strain rate tensile loads may differ considerably from that observed in conventional tensile tests. This chapter discusses the processes involved in determining strain rate effects in tension by conventional tensile tests and covers expanding ring tests, flat plate impact tests, split-Hopkinson pressure bar tests, and rotating wheel tests.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090131
EISBN: 978-1-62708-462-8
.... Comprehensive data is now available due to the massive expansion of semiconductor content and a corresponding affinity for data collection across the world. With more data available for appraisal and analysis, the semiconductor industry is front and center utilizing artificial intelligence (AI), machine...
Abstract
This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... samples’ position and view multiple angles to make real-time observations. Some manufacturers have also provided integration to CAD design data to allow live overlay on 3D X-ray images for direct comparison and defect analysis [10] . During the past decade, the increasing complexity and 3D nature...
Abstract
X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... of the preceding chapter on design analysis. Statistics is a branch of mathematics dealing with the collection, analysis, and interpretation of data from a sample population of objects or measurements. Statistics refers to gathering numerical data to present information about a subject. Probability is another...
Abstract
Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
... is the greatly increased computer processing requirements relative to those of binary systems. A 256 × 256 pixel image array with up to 256 different values per pixel will require over 65,000 8-bit storage locations for analysis. At a speed of 30 images per second, the data processing requirement becomes very...
Abstract
Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060163
EISBN: 978-1-62708-355-3
...) Recommended Procedures for High-Temperature Tensile Testing of Ceramics and CMCs Monolithic Ceramics and Low-Toughness CMCs High-Toughness CMCs and other Ceramics with High Strains to Failure Specialized Materials (Such as Heat-Exchanger Tubes) Recommended Procedures for Data Analysis Strain...
Abstract
This chapter describes tensile testing of advanced ceramic materials, a category that includes both noncomposite, or monolithic, ceramics and ceramic-matrix composites (CMCs). The chapter presents four key considerations that must be considered when carrying out tensile tests on advanced monolithic ceramics and CMCs. These include effects of flaw type and location on tensile tests, separation of flaw populations, design strength and scale effects, and lifetime predictions and environmental effects. The chapter discusses the advantages, problems, and complications of four basic categories of tensile testing techniques as applied to ceramics and CMCs. These categories are true direct uniaxial tensile tests at ambient temperatures, indirect tensile tests, tests where failure is presumed to result from tensile stresses, and high-temperature tensile tests.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 February 2005
DOI: 10.31399/asm.tb.chffa.t51040083
EISBN: 978-1-62708-300-3
... Abstract This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements...
Abstract
This chapter discusses the role of inverse analysis in providing input data for finite element simulations of metal forming processes. It describes the basic procedures for determining flow stress and friction by inverse analysis and for comparing experimental measurements with corresponding computed data. It also includes an example in which flow stress and friction were measured in compressed aluminum rings and the results used to verify the accuracy of predicted values.
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