Fig. 25.11 Passive current density, i pass , and corrosion current density, i corr , as a function of solution pH for S-200D beryllium. A minimum in i pass and i corr exists between a pH of 4.5 and 10.7. Source: Hill et al. 1998 More

Figure 5 Current density image from backside scanning decreasing the current from 1 mA to 25 µA for a 5 µm thinned down die. Images courtesy of M. Hechtl, Infineon. More

Fig. 5.35 Effect of test environment and charging current density on the failure time of stressed C-ring specimens of alloy 625 (59% cold rolled + 500 °C, or 930 °F, for 50 h) and Hastelloy G (59% cold rolled+ 260 °C, or 500 °F, for 250 h). Room temperature; 100% yield stress. Source: Ref More

Fig. 5.39 Interrelationships among cathodic current density, grain-boundary sulfur composition, and fracture mode in straining electrode tests of nickel. Source: Ref 5.174 More

Figure 4 Current density image from backside scanning decreasing the separation distance from 200 µm to 5 µm . Images courtesy of M. Hechtl, Infineon. More

Figure 14 Nano-scale current density image using MR sensor of a test serpentine structure on a wafer. Metal trace width is 250 nm , while spacing is 400 nm . Current is overlaid on optical image. Higher resolution images in the insets are overlaid on SEM images. More

Figure 16 (Left) Magnetic image of an MCM device. (Center) Current density obtained by applying the standard inverse to the magnetic image on the left. The image has been slightly rotated to allow alignment with CAD layout shown on the right. More

Figure 17 Current density images of shorts in a flip-chip device at (a) the die, (b) the interconnect, and (c) the package. More

Figure 28 Current density images from the four acquired scans overlaid with the optical device images showing abnormal current patterns. Bright yellow current color means the current is closer to the top surface, while darker orange color means current is farther away from the surface. More

Figure 27 GMR-based MCI image of power supply short current density from 5 µm ultra-thin silicon surface [34] . More

Figure 7 X-ray image of packaged lead frame superimposed with current density image shows the location of short (red arrow). [7] More

Figure 2-24 Schematic illustrating the classic current density versus voltage relationship for electropolishing solutions. More

Fig. 3.13 Diffusion overpotentials as a function of current density. Overpotentials become very large as the current density approaches the limiting current density. More

Fig. 3.18 Illustration of the effect of exchange current density on the polarization curve for oxygen reduction in aerated environments of pH = 0.56 and PO 2 = 0.2 atm. Curves converge to the same diffusion limit and are identical when the hydrogen ion reduction is the dominant reaction. More

Fig. 7.9 Distribution of current density over an iron surface exposed to 1 mM NaCl + 1 mM Na 2 SO 4 at the times shown. Surface area 0.07 cm 2 . Source: Ref 25 More

Figure 13.12 Critical current density, J c , vs. magnetic field, H , for several high-field superconductors. More

Figure 13.14 Relative critical current density vs. temperature for Nb–Ti wire. Each curve corresponds to a constant value of the magnetic field ( Hampshire, Sutton, and Taylor, 1969 ). More

Figure 13.15 Relative critical current density vs. temperature at constant magnetic field for Nb 3 Sn wire conductors ( Iwasa and Montgomery, 1975 ). More

Figure 13.16 Relative critical current density vs. temperature at constant magnetic field for V 3 Ga wire ( Iwasa and Montgomery, 1975 ). More

Figure 13.46 Relative critical current density, J c / J cm as a function of intrinsic strain, ϵ 0 , for different magnetic fields, evaluated using Eq. 13.19 and the typical set of scaling parameters for multifilamentary Nb 3 Sn shown in the figure ( Ekin, 1980a ). More