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curing time
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Image
Published: 01 December 2003
Fig. 17 Variation of glass transition temperature ( T g ) with cure time and temperature. Source: Ref 23
More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230441
EISBN: 978-1-62708-298-3
... of different adhesives, and surface preparation requirements. It explains how adhesives are applied and cured and how curing times and temperatures affect bonding strength. It also discusses the use of bolts and rivets and the different types of joints that can be made with them. adhesive bonding...
Abstract
This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations of different adhesives, and surface preparation requirements. It explains how adhesives are applied and cured and how curing times and temperatures affect bonding strength. It also discusses the use of bolts and rivets and the different types of joints that can be made with them.
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
Figure 2-9 Some cold-mounting defects and their cause and remedy. (Courtesy of Buehler Ltd.) Epoxides: DEFECT CAUSE REMEDY Cracking Insufficient air cure prior to oven cure. Increase air cure time. Oven cure temperature too high. Decrease oven cure temperature
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Image
Published: 01 December 1984
pressure during fluid state. Burst Too short a cure period. Lengthen cure period. Insufficient pressure. Apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure. Use proper molding pressure. Insufficient time at cure
More
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780131
EISBN: 978-1-62708-268-6
... and many adhesives have a specified cure time, which refers to how long the joined surfaces should remain immobile prior to being loaded. Cure times are a function of temperature and perhaps other environmental conditions. Subjecting the joined surfaces to loads prior to the cure time can induce either...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.pnfn.t65900167
EISBN: 978-1-62708-350-8
... fluid state. Burst Too short a cure period; insufficient pressure Lengthen cure period; apply sufficient pressure during transition from fluid state to solid state. Unfused Insufficient molding pressure; insufficient time at cure temperature; increased surface area of powdered materials...
Abstract
Examining and evaluating the nitrided case is generally accomplished by hardness testing and microscopic examination. This chapter discusses both characterization methods, as well as sample preparation. The chapter also discusses the processes involved in the etching of the sample after microhardness testing and provides practices that contribute to the safe preparation of specimens. Examples of nitrided case microstructures, using optical light microscopy, are also presented.
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