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cross-wire projection

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290061
EISBN: 978-1-62708-306-5
... embossed projection contact points; (b) addition of pressure after welding current is turned off causes plastic deformation that flattens the projections. Source: Ref 3.4 Projections may be of any practical shape that can properly concentrate the welding current. In cross-wire projection welding...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340413
EISBN: 978-1-62708-427-7
... crossings; solar energy generation; and agriculture and industrial applications. aluminum alloys bridge support columns guardrails light poles solar panels transmission lines Extruded aluminum planks are used for stadium seats (or bleachers) in many sports venues. They may be bolted...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... artifacts. Contrast changes and false color application allow display of selective information and are strong supports for enhanced FA results. Figure 9 Stacked die interconnect analysis. Projection image of extracted volume (center); 3D image of 25 μm diameter Cu-pillar microbump and virtual cross...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060117
EISBN: 978-1-62708-261-7
... can be eliminated. See DIN 7526, now a European standard, EN-10243 (a) . Rotary swaging An incremental metalworking process for reducing the cross-sectional area or otherwise changing the shape of bars, tubes, or wires by repeated radial blows with two or more dies. The work is elongated...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.t53700215
EISBN: 978-1-62708-279-2
... increases, part and die radii must also increase. For DP 600, the minimum part radius should be greater than three times (>3 t ) the metal thickness; whereas the die radius should be greater than five times (>5 t ) the sheet metal thickness. Structural parts such as rails, cross bars, pillars...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 1997
DOI: 10.31399/asm.tb.wip.t65930197
EISBN: 978-1-62708-359-1
... was observed when a bench-type resistance spot welder was being used to join two crossed wires by direct-current welding for an electronic assembly. The measured weld strength was 4 kg (9 lb). After maintenance on the weld head, the cables to the electrodes were accidentally reversed, and the subsequent welds...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740103
EISBN: 978-1-62708-308-9
... line is at the largest cross section of the part, because it is easier to spread metal by forging than to force it into deep die impressions. If the largest cross section coincides with a flat side of a forging, the parting line could be located along the edges of the flat section, thus placing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.tb.msisep.t59220353
EISBN: 978-1-62708-259-4
...), Gaithersburg, MD, USA. Source: Ref 10 Fig. 11.24 (a) Longitudinal cross section of wire rod, presenting elongated manganese sulfide nonmetallic inclusion. The hot working was concluded at 900 °C (1650 °F). Not etched. SEM, BE. (b) EDS x-ray spectrum of the inclusion presented in (a). Fig...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110461
EISBN: 978-1-62708-247-1
... to the electron beam and ensure parallel alignment of the various features of devices in the projected image. For this reason, most diffraction-contrast and HRTEM lattice images of cross-sectioned Si devices are recorded with electron beam direction parallel to the <110> crystallographic axis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090109
EISBN: 978-1-62708-462-8
...), BGA (ball grid array) Chemical etch may remove die(s) below due to its isotropic nature. It is essential that chemicals used must not attack other package components like ball grid array (BGA), bumps, bond wires, surface mount technology (SMT) components, substrate, or other silicon die(s...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... for access depending on a cavity down or up orientation and location of interconnects such as bumps on a flip chip or wire-bonds of which the wire-loops must be avoided during access/thinning. Methodologies for the preparation may require in-situ board level or system module analysis, die repackaging...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270053
EISBN: 978-1-62708-301-0
... of ladders has been attributed to improper riveting of the cross supports to the side rails of the ladder; excessive projection of the legs below the first rung of the ladder; and improper heat treatment of the ladder material resulting in the precipitation of brittle intermetallics along the grain...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smff.t53400233
EISBN: 978-1-62708-316-4
... without striking the bottom of the die. Metal contact is made at only three points in the cross section: the nose of the male die and the two edges of a V-shaped die opening. air cushion An air-actuated die cushion. air draw A draw operation performed in a single-action press with the blank holder...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smff.9781627083164
EISBN: 978-1-62708-316-4
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980323
EISBN: 978-1-62708-342-3
.... They are designed accordingly and built to meet the needs of the operator. 6.1.1 Machinery for Direct Extrusion The design of a direct-extrusion press is determined by the following factors: Product Aluminum and aluminum alloys (light metal) easy to extrude and/or difficult to extrude. Wire, bar...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400087
EISBN: 978-1-62708-258-7
... that the steel was produced by the electric furnace steelmaking process, which uses steel scrap as the melting source. Steel scrap can consist of crushed automobiles, which contain copper wires, zinc alloy die castings, and so on. Sample 3 was produced from a basic oxygen furnace (BOF), where the levels...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... Analysis labs. The relatively more expensive and specialized tools such as Auger, will be rarer. Oxide thickness characterization is of interest in applications such as wire bonding and soldering, which is done on a large scale at many different sites. However, access to a dedicated surface analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.pb.t51230189
EISBN: 978-1-62708-351-5
... into links, fluxed, and heated. A cross section through the joint in a chain link made using braze cored wire is shown in Fig. 5.1 [ Grimwade 2002 ]. The most recent technology used in chain making involves in situ welding of chain by microplasma torch or laser, which dispenses with brazes. Brazes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.9781627083423
EISBN: 978-1-62708-342-3
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870179
EISBN: 978-1-62708-299-0
... of precursor wires and exfoliation of graphite/aluminum plates ( Ref 6 ). Figure 3 shows a transverse cross section of a graphite/6061 aluminum alloy MMC. Fig. 3 Cross section of a graphite/aluminum composite in 6061 alloy matrix. The fibers were precoated with titanium and boron. Fiber bundles were...