This appendix contains a table listing cross-references of standard SAE carbon and low-alloy steels to selected chemically similar steels.

This appendix consists of a table listing cross reference to non-AISI and AISI steels of various countries, namely France, Germany, Italy, Japan, Sweden, the United Kingdom, and the United States.

This appendix serves as a cross reference to chemically similar titanium alloys and the various designations by which they are known.

This appendix contains a cross-reference to steels, which was developed to help the Heat Treater cross-index chemically similar specifications. The specifications are listed alpha-numerically by country of origin.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

This appendix contains a list of formula symbols related to the extrusion process.

This chapter provides perspective on the physical dimensions associated with the microstructure of steel and the instruments that reveal grain size, morphology, phase distributions, crystal defects, and chemical composition, from which properties and behaviors derive. The chapter also reviews the definitions and classifications used to identify and differentiate commercial steels, including the AISI/SAE and UNS designation systems.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

This chapter is a detailed account of the tensile testing procedure used for evaluating metals and alloys. The discussion covers the stress-strain behavior of metals determined by tensile testing, properties determined from testing, test machines for measuring mechanical properties, and general procedures of tensile testing. Three distinct aspects of standard test methods for tension testing of metallic materials are discussed: test piece preparation, geometry, and material condition; test setup and equipment; and test procedure.

This chapter discusses the methodology of the tensile test and the effect of some of the variables on the tensile properties. The methodology and variables discussed are shape of the item being tested, method of gripping the item, method of applying the force, determination of strength properties other than the maximum force required to fracture the test item, ductility properties to be determined, speed of force application or speed of elongation, and test temperature. The chapter presents the definitions of the basic terms and their units, along with discussions of basic stress-strain behavior and the differences between related terms, such as stress and force and strain and elongation. It considers the parts of a tensile test, namely, test-piece preparation, geometry, and material condition; test setup and equipment; and test procedures. The chapter provides information on post-test measurements and describes the effect of strain concentrations and strain rate on tensile properties.

This appendix contains figures that illustrate specimen orientation and crack plane codes for rolled plate, drawn bars, and hollow cylinders.

Analyzing the structure of composite materials is essential for understanding how the part will perform in service. Assessing fiber volume variations, void content, ply orientation variability, and foreign object inclusions helps in preventing degradation of composite performance. This chapter describes the optical microscopy and bright-field illumination techniques involved in analyzing ply terminations, prepreg plies, splices, and fiber orientation to provide the insight necessary for optimizing composite structure and performance.