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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290207
EISBN: 978-1-62708-306-5
...Abstract Abstract This chapter presents a comprehensive coverage of mechanical fastening methods. It begins with a discussion on the advantages and disadvantages of mechanical fastening followed by sections providing information on mechanically fastened joints and the selection of the correct...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2006
DOI: 10.31399/asm.tb.ex2.t69980001
EISBN: 978-1-62708-342-3
... extrusion and indirect extrusion. It then briefly defines hydrostatic extrusion and the conform process. The history coverage addresses early patents for extrusion of lead at the turn of the 17th century up through the major process innovations in the 20th century. References References [Bau 82...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030360
EISBN: 978-1-62708-282-2
... in the Appendix to this article, which reviews in greater detail the commonly used inspection techniques in the petroleum and petrochemical industries.) Competence assurance of inspection personnel Inspection coverage Inspection periodicity Inspection anomaly criteria Assessment of fitness...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860035
EISBN: 978-1-62708-338-6
... Fig. 4.5 Single circuit repeated for axisymmetric coverage Fig. 4.1 Development of band pattern with winding circuits Fig. 4.2 Simple dwell method of pipe winding Fig. 4.3 Advanced method of pipe winding Fig. 4.4 Geodesic path on a curved surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
.... , “ The behavior and Testing Implications of CMOS IC Logic Gate Open Circuits, ” Proc ITC. , 1991 , pp. 302 - 310 . 10.1109/TEST.1991.519522 [12] Maxwell P. , Aitken R. , Johansen V. and Chiang I. , “ The Effectiveness of I DDQ , Functional and Scan Tests: How Many Fault Coverages Do...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050335
EISBN: 978-1-62708-311-9
... is that the quench hole area should be a minimum of 5 to 10% of the area being quenched. As case depth and part diameter increase, the area of coverage needs to be increased. Rule of thumb for the basic minimum area is shown in Figure A4.2 , which indicates the amount of flow that can be applied depending on hole...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110506
EISBN: 978-1-62708-247-1
... provide an important standardization to the testing and FA strategy. As a minimum, a classical memory fault model should be used to determine the fault coverage obtained. [2] This should include the following: Address fault Stuck-at fault Bridging fault Transition fault n-cell...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2001
DOI: 10.31399/asm.tb.secwr.t68350195
EISBN: 978-1-62708-315-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860065
EISBN: 978-1-62708-338-6
... provided the ± fiber patterns at full surface coverage. There was some migration of the resin to the lower parts of the winding. When the winding process was 5 min or less and the resin cure to B-stage was less than ½ h, the resin movement did not allow air introduction at the top or increase wall...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870333
EISBN: 978-1-62708-314-0
... as ultrasonics or x-ray, thermographic inspection is a relatively fast, noncontact, single-sided process that has a wide coverage area. It can be used to detect delaminations, impact damage, water ingression into honeycomb, inclusions, and density variations. In thermography ( Fig. 12.17 ), it is first necessary...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720183
EISBN: 978-1-62708-305-8
... (200 °F); penetrants that have lower flash points constitute a potential fire hazard A high degree of wettability Low viscosity to permit better coverage and minimum dragout Ability to penetrate discontinuities quickly and completely Sufficient brightness and permanence of color Chemical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.t55030045
EISBN: 978-1-62708-282-2
... Microscopic organisms also tend to settle nonuniformly on metal surfaces. In some cases, they form discrete colonies; in other cases, they form biofilms with nominally complete coverage of the immersed surface. In the latter case, however, the distribution of organisms within the biofilm is usually extremely...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780336
EISBN: 978-1-62708-281-5
... that any evidence of a microbial process implies material biodegradability. For example, when interpreting data obtained by Ref 6 , the growth is measured as the percentage area covered by fungi without considering whether 100% fungal coverage represents a loss of any of the initial material mass...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
...-effective to perform FA directly on a wafer. Since typical test coverage on wafer-level testing is close to 99% [1] especially in the digital cores, the chance of discovering critical defects is high. Therefore, a wafer-level failure analysis process can contribute to accelerate the technology...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440001
EISBN: 978-1-62708-262-4
... as to obtain specific conditions and/or properties.” Heating for the sole purpose of hot working (as in forging operations) is excluded from this definition. Heat treatments sometimes used for nonmetallic products are also excluded from coverage by this definition. Importance of Heat Treatment...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220001
EISBN: 978-1-62708-341-6
... and uniform coverage. Induction heating is widely used in sintering of carbide preforms because it can provide the necessary high temperature (2550 °C, or 4620 °F) in a graphite retort or susceptor with atmosphere control. Other preforms of ferrous and nonferrous metals can be sintered in a similar manner...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110643
EISBN: 978-1-62708-247-1
... adding multiplexers in most logic paths – the added delay is usually insignificant (or zero) thanks to automated logic optimization. After a scan path is inserted, test patterns that achieve 100% coverage of all stuck-at faults (equivalent to a short between a signal node and a power rail) and stuck-open...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780001
EISBN: 978-1-62708-268-6
... Mind mapping Fault-tree analysis All of these approaches for identifying potential failure causes are good ones, but fault-tree analysis is preferred in many cases for its systematic coverage. After the failure analysis team has identified all potential failure causes, the team focus should...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... can often be identified quickly in 2D imaging mode if their approximate location is known. Several example 2D images are shown in Figure 5 to prove this. At a normal view angle, Figure 5(a) shows a die attachment voids on the backside of a semiconductor inside an IC-case. Void size, coverage...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2013
DOI: 10.31399/asm.tb.mfub.t53740325
EISBN: 978-1-62708-308-9
... coverage of the substrate. Processes for thermal spray coatings can be classified into two categories, arc processes and gas combustion processes, depending on the means of achieving the heat for melting of the consumable material during the spraying operation. The characteristics of the various...