This chapter discusses the formation and growth of various integrated steel companies from 1901 to 1959, namely the United States Steel Corporation, Bethlehem Steel Corporation, and a few of the notable smaller steel companies. The chapter discusses labor unrest and the growth of organized labor in the steel industry in the twentieth century.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.

This chapter describes some of events and developments that helped drive the commercialization of beryllium and its acceptance as an engineering material. It traces the growth of the domestic beryllium industry from its origins in the 1920s to the present time, and provides a status update on the primary beryllium producers throughout the world.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

This chapter discusses the rise of steel minimills in the late 1960s through the leadership of F. Kenneth Iverson and Gerald Heffernan. The discussion covers the development of processes for flat products, flanged beams, and railroad rails. The chapter also covers the growth of the minimill industry along with the consolidation of the industry into large corporations. The chapter ends by providing information on novel processes developed for making iron.

This chapter is a detailed account of the history of development of titanium and its modern applications in the aerospace market. It begins by discussing the attempts made to produce titanium metal. This is followed by a discussion on the invention of a process for making titanium by William Kroll. Various studies on the properties on titanium and research programs related to the production of titanium sponge and titanium metal products are then described. The chapter concludes with a discussion of titanium use in jet engines.

This chapter is an account of the various events that led to the decline of the integrated steel industry during the 1950s. These include the steel strike of 1959, the improvements in technology and increase in imports since 1950s, widespread closures of steel companies, the decline of the minimill industry, and the rapid growth of Mittal Steel.

Structural steels are used for components such as I-beams and automobile frames. This chapter focuses on processing these steels to attain a fine primary ferrite grain size to develop high strength. It first reviews the concepts and principles of recrystallization in plastically deformed metals. The chapter reviews the concepts of annealing of cold worked metals. It then looks at hot working and the grain size associated with it. Additionally, the chapter reviews the methods of strengthening in the steels that rely mainly on reduction in the primary ferrite grain size. It discusses basic methods used to develop a small austenite grain size, and hence a small primary ferrite grain size. Then, the chapter covers the processes involved in the precipitation hardening of the ferrite. Finally, it examines some commercial thermomechanical processes used on structural steels, namely hot deformation and controlled cooling.

This chapter describes joining by forming processes including riveting, clinching, crimping, and dieless joining techniques. It also discusses the fatigue behavior of clinched joints and the results of fatigue tests that compare clinched and spot welded joints.

This appendix contains bibliographies related to the history of stainless steel.

This chapter provides an overview of the production and use of titanium and its significance as an engineering material. It begins by identifying important deposits and ores and assessing current and future production capacities and how they align with global consumption trends. It then describes the physical and mechanical properties of pure titanium and numerous grades of wrought titanium alloys and explains how they compare with other aerospace materials in terms of processing complexity and cost. The chapter also includes information on extractive metallurgy, current and emerging processes, product forms, and related costs.

This chapter provides a detailed discussion of salt bath nitrocarburizing. Process variations discussed include low-cyanide salt bath ferritic nitrocarburizing, salt bath nitrocarburizing plus post treatment, and the Kolene Nu-Tride process.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

The vast majority of beryllium products are manufactured from blocks, forms, or billets of compacted powder that are machined or worked into shape. This chapter describes the metalworking processes used, including rolling, forming, forging, extrusion, drawing, and spinning. It covers the qualitative and quantitative aspects of each process and provides examples showing how they are implemented and the results that can be achieved. The chapter also discusses the issue of beryllium’s low formability and describes some of the advancements that have been made in near-net shape processing.

Beryllium’s machining characteristics are similar to those of heat-treated cast aluminum and chilled cast iron. Like the other materials, it can be turned, milled, drilled, bored, sawed, cut, threaded, tapped, and trepanned with good results. This chapter explains how these machining operations are conducted and describes the effect of tooling materials, cutting speeds, metal-removal rates, and other variables. It also explains how to assess and remove surface damage caused by machining such as microcracks and twins.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

Moore's Law has driven many degree circuit features below the resolving capability of optical microscopy. Yet the optical microscope remains a valuable tool in failure analysis. This article describes the physics governing resolution and useful techniques for extracting the small details. It begins with the basic microscope column and construction. The article discusses microscope adjustments, brightfield and darkfield illumination, and microscope concepts important to liquid crystal techniques. It also discusses solid immersion lenses, infrared and ultraviolet microscopy and concludes with laser microscopy techniques such as thermal induced voltage alteration and external induced voltage alteration.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.