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copyright
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Published: 01 December 2008
Fig. 1 The Chrysler building with its famous bright stainless details. Copyright © iStockphoto.com /Steven Allen. Used with permission
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Published: 01 November 2023
Fig. 3 Embedded multi-die interconnect bridge architecture. Copyright 2016 IEEE ( Ref 2 )
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Published: 01 November 2023
Fig. 7 Differential TSV on CoWoS interposer. Copyright 2021 IEEE ( Ref 6 )
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Published: 01 November 2023
Fig. 12 Different 3D IC package configurations. Copyright 2022 IEEE ( Ref 10 )
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Published: 01 November 2023
Fig. 19 Bump crack imaging at 0.7 μm/voxel. Copyright 2022 IEEE ( Ref 11 )
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Published: 01 November 2023
Fig. 22 Ptychographic laminography imaging of a 22 nm chip. Copyright IEEE ( Ref 14 )
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Published: 01 November 2023
Fig. 36 MCM topology with passive interposers. Copyright 2021 IEEE ( Ref 33 )
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Published: 01 November 2023
Fig. 38 Boundary scan architecture for interposer and TSV testing. Copyright 2015 IEEE ( Ref 36 )
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Published: 01 November 2023
Fig. 39 Ring oscillator with N number of TSVs. Copyright 2014 IEEE ( Ref 38 )
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Published: 01 November 2023
Fig. 41 Voltage detect circuit used by leakage defect detection. Copyright 2021 IEEE ( Ref 39 )
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Published: 01 November 2023
Fig. 42 Proposed BIST for TSV pre-bond test. Copyright 2021 IEEE ( Ref 40 )
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Published: 01 November 2023
Fig. 44 Sequence of screen test. Copyright 2021 IEEE ( Ref 33 )
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Published: 01 November 2023
Fig. 46 P1838 components for 3D IC. Copyright 2021 IEEE ( Ref 46 )
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in Systems-Level: Development and Challenges of Solid Immersion Lens
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 3 Schematic diagram (a) and photo image (b) of a doublet SIL. Copyright 2020 IEEE ( Ref 7 )
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in Systems-Level: Development and Challenges of Solid Immersion Lens
> Electronic Device Failure Analysis Technology Roadmap
Published: 01 November 2023
Fig. 4 Two methods for aberration correction. Copyright 2018 IEEE ( Ref 8 )
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Published: 01 June 2010
Fig. 3 Harry Brearley. Source: Copyright. Sheffield Industrial Museums Trust. Reprinted with permission
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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110678
EISBN: 978-1-62708-247-1
... includes significant contributions from Ryan Ong, is a compilation of terms that have been addressed in the previous proceedings of the International Symposium for Testing and Failure Analysis (ISTFA). ASTM definitions have been reprinted, with permission, from the ASTM Standards, copyright American...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1996
DOI: 10.31399/asm.tb.phtpclas.9781627083539
EISBN: 978-1-62708-353-9
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