Search Results for contact angle

Fig. 1.17 Effect of contact angle on fillet formation and joint filling. Low contact angles tend to be preferred when external fillets can form. In other geometries, higher contact angles result in lower stress concentrations. More

Fig. 1.12 Effect of contact angle on fillet formation and joint filling. Low contact angles tend to be preferred when external fillets can form. In other geometries, higher contact angles result in lower stress concentrations. More

Fig. 1.16 Contact angle of copper-silicon brazes of different composition on vitreous carbon substrates demonstrating the effect of driving force of alloying on wetting rate and the dependence of the equilibrium wetting angle on the reaction product, which is the same in the three cases More

Fig. 1.18 Wettability index (defined as the product of the contact angle and spread area [ Feduska 1959 ]) of silver-base brazes on 316L stainless steel, heated in vacuum for 5 min. Palladium additions clearly have a beneficial effect on wetting and spreading by the braze, despite widening More

Fig. 4.34 A lap joint showing step height, H , fillet radius, R , and contact angle, θ More

Fig. 7.6 Variation of contact angle for gold-silicon alloys on silicon carbide at 1200 °C (2190 °F) as a function of alloy composition in relatively high- and low-oxygen partial pressure atmospheres (the silicon-rich end of the curve is derived by extrapolation because silicon is not molten More

Fig. 7.7 The dependence of the equilibrium contact angle of selected molten metals on titanium carbide as a function of the carbon content of the substrate. In all cases, the contact angle decreases as the carbon deficiency in the titanium carbide, with respect to its stoichiometric value More

Fig. 7.8 The equilibrium contact angle, measured by the sessile drop technique, for molten metals on titanium carbide as a function of the titanium content of the braze. Test temperatures used were 1150 °C (2100 °F) for gold-, copper-, and tin-base alloys and 1050 °C, or 1920 °F for silver More

Fig. 7.14 Wettability (contact angle) and room temperature strength of alumina brazed with copper containing varying amounts of titanium, prepared by brazing in vacuum at 1150 °C (2100 °F) for 15 min More

Fig. 7.23 Variation in contact angle with brazing time for Ag-27Cu-2Ti on Si 3 N 4 . Adapted from Loehman [1988] More

Figure 18 Comparison of 3-axis vs. 5-axis grinding. (Top) In 3-axis the contact angle is invariant and cannot follow the shape of a curved die, producing “saw teeth” that are several microns in size. (Bottom) 5-axis control changes the contact angle to follow the curved shape and yields a well More

Fig. 7.3 Contact angle θ for a liquid droplet on a solid surface: (a) θ > 90°, (b) θ < 90 °, and (c) θ = 0°. γ SL is the solid-liquid surface energy, γ SV is the solid-vapor surface energy, and γ LV is the liquid-vapor surface energy. Source: Ref 7.3 , p 4 More

Fig. 3.30 The contact angle is illustrated for a classic horizontal sessile drop of liquid resting on the solid. The contact angle, θ, represents the balance of the surface energy vectors as illustrated, leading to a mathematical relation between surface energies. More

Fig. 3.33 Contact angle relation to droplet diameter for a constant droplet volume of 0.01 mL. Measuring the droplet diameter is often more accurate than measuring the contact angle. More

Fig. 1.11 Contact angle of copper-silicon brazes of different composition on vitreous carbon substrates demonstrating the effect of driving force of alloying on wetting rate and the dependence of the equilibrium wetting angle on the reaction product. Adapted from Landry, Rado More

Fig. 1.13 Effect of nonwettable surface features on the contact angle of solder on copper. Data of Yost, Hosking, and Frear [1993] augmented by the authors. Lead-tin solder wetted onto a copper surface containing embedded nonwettable particles 10–20 μm (400–800 μin.) in diameter (RMA flux More

Fig. 1.15 Contact angle of lead-tin solder on copper as a function of wetting time, using an inert flux and low superheat. There are four distinct stages of wetting, the last being the equilibrium contact angle that is obtained using more typical process parameters. More

Fig. 3.16 Contact angle for In-48Sn solder on four metal substrates, after heating for 5 min at 250 °C (482 °F), as a function of oxygen partial pressure. Adapted from Preuss, Adolphi, and Werner [1994 ] More

Fig. 4.35 A lap joint showing step height, H , fillet radius, R , and contact angle, θ More

Fig. 5.20 Relationships among spread ratio, spread factor, and contact angle More