Induction heating, in most applications, is used to selectively heat only a portion of the workpiece that requires treatment. This chapter covers the basic principles, features, and metallurgical aspects of induction heating. The discussion includes the conditions required for induction heating and quenching, the use of magnetic flux concentrators to improve the efficiency of surface heating, and the quenching systems used for induction hardening. The discussion also provides information on time-temperature dependence in induction heating, workpiece distortion in induction surface hardening, residual stresses after induction surface hardening and finish grinding, and input and output control of steel for induction surface hardening of gears.

This chapter covers the emerging practice of quantitative microscopy and its application in the study of the microstructure of metals. It describes the methods used to quantify structural gradients, volume fraction, grain size and distribution, and other features of interest. It provides examples showing how the various features appear, how they are measured, and how the resulting data are converted into usable form. The chapter also discusses the quantification of fracture morphology and its correlation with material properties and behaviors.

Hardness tests provide valuable information about the quality of materials and how they are likely to perform in different types of service. This chapter covers some of the most widely used hardness testing methods, including Vickers, Rockwell, and Brinell tests, Shore scleroscope and Equotip hardness tests, and microindentation tests. It describes the equipment and procedures used, discusses the factors that influence accuracy, and provides hardness conversion equations for different types of materials. It also explains how hardness testing sheds light on anisotropy, machinability, wear, fracture toughness, and tensile strength as well as temperature effects, residual stress, and quality control.

This chapter concentrates almost exclusively on inspection techniques related to pressure vessels and pipework. The discussion covers the general aspects associated with inspection and the key factors relevant to it. In addition, the chapter addresses processes involved in data collection and management, namely data acquisition, reporting, trending, reviewing, and auditing. Capabilities and limitations of in-service inspection techniques are discussed in the Appendix to this chapter.

This chapter discusses the operating mechanism, applications, advantages, and limitations of Brinell hardness testing, Rockwell hardness testing, Vickers hardness testing, Scleroscope hardness testing, and microhardness testing. In addition, the general precautions and selection criteria to be considered are described and details of equipment setup provided.

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter focuses on some of the facts of mechanical properties of metals that must be understood to successfully undertake the task of failure analysis. The discussion begins by describing the causes and effects of elastic and plastic deformation followed by a section describing the effects of temperature variations on mechanical properties, both in tension and in compression. The nonlinear behavior of gray cast iron caused by the graphite flakes is then described. Finally, the effect of stress concentrations on high-strength metals is considered.

This chapter discusses the advantages and disadvantages of producing titanium parts using powder metallurgy (PM) techniques. It compares the typical properties of wrought, cast, and PM titanium alloy products, addresses various manufacturing challenges, and describes several consolidation and shaping processes along with associated property data.

This chapter provides an overview of a computational method, called CALPHAD, used for the study of phase equilibria in multicomponent systems. It describes the thermodynamic models and calculation techniques employed in the software and explains how it applies to complex alloys used in industry. It also provides examples showing how CALPHAD has been used to determine the formability of metallic glass, calculate the dilation of stainless steel during phase transformation, and predict the beta transus and approach curves of commercial titanium alloys.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

The ability to accurately assess the remaining life of components is essential to the operation of plants and equipment, particularly those in service beyond their design life. This, in turn, requires a knowledge of material failure modes and a proficiency for predicting the near and long term effects of mechanical, chemical, and thermal stressors. This chapter presents a broad overview of the types of damage to which materials are exposed at high temperatures and the approaches used to estimate remaining service life. It explains how operating conditions in power plants and oil refineries can cause material-related problems such as embrittlement, creep, thermal fatigue, hot corrosion, and oxidation. It also discusses the factors and considerations involved in determining design life, defining failure criteria, and implementing remaining-life-assessment procedures.

This chapter addresses in-service monitoring and corrosion testing of weldments. Three categories of corrosion monitoring are discussed: direct testing of coupons, electrochemical techniques, and nondestructive testing techniques. The majority of the test methods for evaluating corrosion of weldments are used to assess intergranular corrosion of stainless steels and high-nickel alloys. Other applicable tests evaluate pitting and crevice corrosion, stress-corrosion cracking, and microbiologically influenced corrosion. Each of these test methods is reviewed in this chapter.

A successful heat treating operation is determined by the ability to satisfy the customer's quality requirements consistently and economically. This chapter reviews the steps that are important to produce quality parts in heat treating with a brief practical explanation of each. The steps include selecting proper material and design of the part being treated; determining whether the process is capable of heat treatment; using statistical process control, control charting, and in-process inspection and testing; and applying statistical quality control and final testing (sampling) to verify the results.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.

This chapter discusses the most common causes and contributing factors for external corrosion and stress-corrosion cracking on oil and natural gas pipelines, as well as describes procedures for prevention, mitigation, detection, assessment, and repair. The forms of external corrosion covered include differential cell corrosion, microbiologically influenced corrosion, and stray current corrosion.