This appendix is a compilation of suggested analysis methods for suspected component failure causes.

This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.

Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.

After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.

In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.

This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.

This chapter identifies the primary causes of service failures and discusses the types of defects from which they stem. It presents more than a dozen examples of failures attributed to such causes as design defects, material defects, and manufacturing or processing defects as well as assembly errors, abnormal operating conditions, and inadequate maintenance. It also describes the precise usage of terms such as defect, flaw, imperfection, and discontinuity.

This appendix focuses on procedures, techniques, and precautions associated with the investigation and analysis of metallurgical failures that occur in service. It describes the steps of an orderly failure analysis from collecting and examining samples to performing mechanical and nondestructive tests, preparing and examining fractographs and micrographs, determining failure mode, writing the report, and developing follow-up recommendations. It also examines the fundamental mechanisms of failure, why they occur, and how to identify them by their characteristic features.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

Corrective action means the implementation or modification of things designed to eliminate or reduce failure causes. This chapter addresses developing potential solutions and selecting the best solution. It discusses the special operations that should be used only as temporary or interim corrective actions to overcome design, process, and other failure causes. The chapter concludes by describing the process of corrective action implementation.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter discusses the importance of failure analysis and the role it plays in a society driven by technological advancement. It explains why failure rates are highest in the early and later stages of the life of any product and shows the extent to which failure rates increase when products are subjected to an aggressive operating environment.

Elevated-temperature failures are the most complex type of failure because all of the modes of failures can occur at elevated temperatures (with the obvious exception of low-temperature brittle fracture). Elevated-temperature problems are real concerns in industrial applications. The principal types of elevated-temperature failure mechanisms discussed in this chapter are creep, stress rupture, overheating failure, elevated-temperature fatigue, thermal fatigue, metallurgical instabilities, and environmentally induced failure. The causes, features, and effects of these failures are discussed. The cooling techniques for preventing elevated-temperature failures are also covered.

This chapter is a brief bibliography of content sources that provide information related to the subject matter of the book.

This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot, aging, and supplier changes. The chapter presents an example of a cluster bomb failure to explain how the failure analysis team found and corrected the failure cause.