This appendix is a compilation of suggested analysis methods for suspected component failure causes.

A systematic procedure for minimizing risks involved in heat treated steel components requires a combination of metallurgical failure analysis and fitness for service with respect to safety and reliability based on risk analysis. This chapter begins with an overview of heat treat processing of steels. This is followed by sections on various aspects of heat treatment design and heat treating practices for minimizing distortion. Influence of design, steel grade, and condition is then illustrated in the examples of failures due to heat treatment. A procedure is analyzed to improve the performance of the design process of a component. A heat-transfer model, coupling with a phase transformation model, a thermomechanical model, and a thermochemical model, is also considered. The chapter further provides information on the failure aspects of and heat treatment procedures applied to welded components. It ends with a section on risk-based approach applicable to heat treated steel components.

This chapter presents various case histories that illustrate a variety of failure mechanisms experienced by the high-strength steel components in aerospace applications. The components covered are catapult holdback bar, AISI 420 stainless steel roll pin, main landing gear (MLG) lever, inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts.

This chapter is a brief account of various factors pertinent to the development of an engineering component. The discussion covers the disciplines and interactions of design development, engineering of component design, validation of design and process analysis, and matrix of design and manufacturing elements.

Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.

This chapter reviews failure aspects of structural ferrous powder metallurgy (PM) parts, which form the bulk of the PM industry. The focus is on conventional PM technology of parts in the density range of 6 to 7.2 g/cc. The chapter briefly introduces the processing steps that are essential to understanding failure analysis of PM parts. This is followed by a section on case hardening of PM parts. The methods used for analyzing the failures are then discussed. Some case studies are given that illustrate different failures and the methods of prevention of these failures.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.

In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

This chapter provides an overview of the possible mechanisms of failure for heat treated steel components and discusses the techniques for examining fractures, ductile and brittle failures, intergranular failure mechanisms, and fatigue. It begins with a description of the general sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of the fracture mechanism.

This chapter focuses on what can cause a system to fail and addresses the challenge in approaching a system failure. It then examines the steps involved in the four-step problem-solving process: defining the problem, identifying all potential failure causes and evaluating the likelihood of each, identifying the potential solutions, and identifying the best solution. The chapter concludes by describing the responsibilities of a failure analysis team.

This chapter briefly outlines some of the basic aspects of failure analysis, describing some of the basic steps and major concerns in conducting a failure analysis. A brief review of failure types from fracture, distortion, wear-assisted failure, and environmentally assisted failure (corrosion) is also provided.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

The management of a failure analysis (FA) laboratory requires a broad range of activities to optimize the efficiency of the operation. The purpose of this article is to stimulate readers to consider the various aspects of FA laboratory operations and their respective business management requirements. The various aspects include: staffing, laboratory organization, lab design and operations, strategic development, financial management, and metrics and measurements. References for further reading and examples of resource materials are also included.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

Failure analysis of steel welds may be divided into three categories. They include failures due to design deficiencies, weld-related defects usually found during inspection, and failures in field service. This chapter emphasizes the failures due to various discontinuities in the steel weldment. These include poor workmanship, a variety of hydrogen-assisted cracking failures, stress-corrosion cracking, fatigue, and solidification cracking in steel welds. Hydrogen-assisted cracking can appear in four common forms, namely underbead or delayed cracking, weld metal fisheyes, ferrite vein cracking, and hydrogen-assisted reduced ductility.

A system failure occurs when a system does not do what it is supposed to do when it is supposed to do it, or it does something it is not supposed to do. This chapter provides a basic understanding of how failures occur, how systems operate, and the types of failures, namely intermittent and inadvertent system failures.