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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780193
EISBN: 978-1-62708-268-6
... Abstract This appendix is a compilation of suggested analysis methods for suspected component failure causes. component failure causes failure analysis Table A.1   Suspected component failure cause Suggested analysis method Nonconforming dimensions Dimensional...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130395
EISBN: 978-1-62708-284-6
... be associated with carbonitriding or due to low density in compaction. Thus, in analyzing the failure, one needs to consider the fact that the cause of the failure may be associated with more than one stage of component production. Failure Analysis Tools The objective of the failure analysis is to relate...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.9781627082846
EISBN: 978-1-62708-284-6
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630281
EISBN: 978-1-62708-270-9
... Abstract This chapter is a compilation of terms and definitions related to component failure analysis. component failure analysis Understanding How Components Fail, Third Edition Donald J. Wulpi Edited by Brett Miller DOI: 10.31399/asm.tb.uhcf3.t53630281 Glossary Copyright © 2013...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180197
EISBN: 978-1-62708-256-3
... Abstract This chapter is a compilation of terms and definitions related to component failure analysis. component failure analysis Selected References Selected References • ASM Materials Engineering Dictionary , Davis J.R. , Ed., ASM International , 1992 • Failure...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780359
EISBN: 978-1-62708-281-5
... Abstract This article reviews various analytical techniques most commonly used in plastic component failure analysis. The description of the techniques is intended to make the reader familiar with the general principles and benefits of the methodologies. The descriptions of the analytical...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... components composite materials electrical components electronic components failure analysis mechanical components metallic components plastic components COMMON FAILURE characteristics exhibited by mechanical and electrical components are the focus of this chapter. Before delving into how...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780147
EISBN: 978-1-62708-268-6
... Abstract In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270019
EISBN: 978-1-62708-301-0
..., external debris, and so on. Analysis at microscopic levels provides information about the nature of inclusions, phases, and surface layers. Several cases of service failures are known to have been caused by the presence of deleterious inclusions from which cracks start in the component and propagate...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630xvi
EISBN: 978-1-62708-270-9
... is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst. design process failure analysis failure analyst manufacturing process Definition of Failure Before we can understand how components fail, it is necessary to define...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... Abstract After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630237
EISBN: 978-1-62708-270-9
... to fractographic evaluation, optical microscopy analysis in elevated-temperature failures is required when conditions are such that a change in metallurgical structure of the failed component occurs ( Ref 1 ). The term elevated temperature needs definition. Normally the useful static strength of a metal...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components. failure analysis light emitting diodes optoelectronic devices product reliability semiconductor lasers...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... . Under high-stress, emergency conditions, human error rates could be as high as 1. The important thing to recognize is that human error rates are relatively high (certainly much higher than component failure rates). Normal Event Probabilities The failure analysis team can determine normal event...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... to be a complete list. When searching for contaminant sources, the failure analysis team should consider the aforementioned as well as other sources unique to the failure being analyzed. Example—Titanium Component Washing Litton Lasers machined lightweight titanium components using conventional machining...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... aluminide) composite, and in polyethylene gas pipeline material ( Ref 12 ). 5.5 Oxide Dating for Failure Analysis In the failure analysis of high-temperature power plant components, the major difficulty encountered is the masking of all fractographic features by the thick layer of the metal oxide...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270003
EISBN: 978-1-62708-301-0
... products are subjected to an aggressive operating environment. failure analysis SERVICE FAILURES of components and structures have been increasingly experienced in several industries, quite often without any warning. Some failures may be trivial, while others may have serious consequences...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Abstract In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610549
EISBN: 978-1-62708-303-4
.... It is not uncommon to find products that have no record of any stress analysis in product design. Even if such calculations were made, the failure analyst may not have access to them. The analyst must answer the questions “Was the component sized properly by the design stress analysis? Did the material have...