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Book Chapter
Component Failure Causes and Suggested Analysis Methods
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780193
EISBN: 978-1-62708-268-6
... Abstract This appendix is a compilation of suggested analysis methods for suspected component failure causes. component failure causes failure analysis Table A.1 Suspected component failure cause Suggested analysis method Nonconforming dimensions Dimensional...
Abstract
This appendix is a compilation of suggested analysis methods for suspected component failure causes.
Book Chapter
Failure Analysis of Powder Metal Steel Components
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130395
EISBN: 978-1-62708-284-6
... be associated with carbonitriding or due to low density in compaction. Thus, in analyzing the failure, one needs to consider the fact that the cause of the failure may be associated with more than one stage of component production. Failure Analysis Tools The objective of the failure analysis is to relate...
Abstract
This chapter reviews failure aspects of structural ferrous powder metallurgy (PM) parts, which form the bulk of the PM industry. The focus is on conventional PM technology of parts in the density range of 6 to 7.2 g/cc. The chapter briefly introduces the processing steps that are essential to understanding failure analysis of PM parts. This is followed by a section on case hardening of PM parts. The methods used for analyzing the failures are then discussed. Some case studies are given that illustrate different failures and the methods of prevention of these failures.
Book
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.9781627082846
EISBN: 978-1-62708-284-6
Book Chapter
Glossary
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630281
EISBN: 978-1-62708-270-9
... Abstract This chapter is a compilation of terms and definitions related to component failure analysis. component failure analysis Understanding How Components Fail, Third Edition Donald J. Wulpi Edited by Brett Miller DOI: 10.31399/asm.tb.uhcf3.t53630281 Glossary Copyright © 2013...
Abstract
This chapter is a compilation of terms and definitions related to component failure analysis.
Book Chapter
Glossary
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180197
EISBN: 978-1-62708-256-3
... Abstract This chapter is a compilation of terms and definitions related to component failure analysis. component failure analysis Selected References Selected References • ASM Materials Engineering Dictionary , Davis J.R. , Ed., ASM International , 1992 • Failure...
Abstract
This chapter is a compilation of terms and definitions related to component failure analysis.
Book Chapter
Characterization of Plastics in Failure Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780359
EISBN: 978-1-62708-281-5
... Abstract This article reviews various analytical techniques most commonly used in plastic component failure analysis. The description of the techniques is intended to make the reader familiar with the general principles and benefits of the methodologies. The descriptions of the analytical...
Abstract
This article reviews various analytical techniques most commonly used in plastic component failure analysis. The description of the techniques is intended to make the reader familiar with the general principles and benefits of the methodologies. The descriptions of the analytical techniques are supplemented by a series of case studies that include pertinent visual examination results and the corresponding images that aided in the characterization of the failures. The techniques covered include Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The article also discusses various analytical methods used to characterize the molecular weight distribution of a polymeric material. It provides information on a wide range of mechanical tests that are available to evaluate plastics and polymers, covering the various considerations in the selection and use of test methods.
Book Chapter
Mechanical and Electronic Failures
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780109
EISBN: 978-1-62708-268-6
... components composite materials electrical components electronic components failure analysis mechanical components metallic components plastic components COMMON FAILURE characteristics exhibited by mechanical and electrical components are the focus of this chapter. Before delving into how...
Abstract
This chapter focuses on common failure characteristics exhibited by mechanical and electrical components. The topic is considered from two perspectives: one possibility is that the system failed because parts were nonconforming to drawing requirements and another possibility is that the system failed even though all parts in the system met their drawing requirements. The common failures discussed in this chapter include those associated with metallic components, composite materials, plastic components, ceramic components, and electrical and electronic components.
Book Chapter
Failure Analysis of Capacitors and Inductors
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110587
EISBN: 978-1-62708-247-1
... Abstract Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis...
Abstract
Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.
Book Chapter
Design Analysis
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780147
EISBN: 978-1-62708-268-6
... Abstract In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can...
Abstract
In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.
Book Chapter
Failure Analysis Methodology
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270019
EISBN: 978-1-62708-301-0
..., external debris, and so on. Analysis at microscopic levels provides information about the nature of inclusions, phases, and surface layers. Several cases of service failures are known to have been caused by the presence of deleterious inclusions from which cracks start in the component and propagate...
Abstract
This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.
Book Chapter
Why Perform Failure Analysis?
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630xvi
EISBN: 978-1-62708-270-9
... is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst. design process failure analysis failure analyst manufacturing process Definition of Failure Before we can understand how components fail, it is necessary to define...
Abstract
Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.
Book Chapter
Analytical Equipment
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... Abstract After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components...
Abstract
After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.
Book Chapter
Elevated-Temperature Failures
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630237
EISBN: 978-1-62708-270-9
... to fractographic evaluation, optical microscopy analysis in elevated-temperature failures is required when conditions are such that a change in metallurgical structure of the failed component occurs ( Ref 1 ). The term elevated temperature needs definition. Normally the useful static strength of a metal...
Abstract
Elevated-temperature failures are the most complex type of failure because all of the modes of failures can occur at elevated temperatures (with the obvious exception of low-temperature brittle fracture). Elevated-temperature problems are real concerns in industrial applications. The principal types of elevated-temperature failure mechanisms discussed in this chapter are creep, stress rupture, overheating failure, elevated-temperature fatigue, thermal fatigue, metallurgical instabilities, and environmentally induced failure. The causes, features, and effects of these failures are discussed. The cooling techniques for preventing elevated-temperature failures are also covered.
Book Chapter
Failure Analysis and Reliability of Optoelectronic Devices
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components. failure analysis light emitting diodes optoelectronic devices product reliability semiconductor lasers...
Abstract
Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.
Book Chapter
Fault-Tree Analysis Quantification
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... . Under high-stress, emergency conditions, human error rates could be as high as 1. The important thing to recognize is that human error rates are relatively high (certainly much higher than component failure rates). Normal Event Probabilities The failure analysis team can determine normal event...
Abstract
Quantifying a fault-tree analysis is a useful tool for assessing the most likely causes of a system failure. This chapter addresses fault-tree analysis event probabilities and ranking of failure causes based on these probabilities. Failure rates, failure-rate sources, probability determinations, mean times between failure, and related topics are also discussed. The discussion covers the practices observed in fault-tree analysis quantification and processes involved in calculating the probability of the top undesired event.
Book Chapter
Contaminants
Available to PurchaseBook: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780141
EISBN: 978-1-62708-268-6
... to be a complete list. When searching for contaminant sources, the failure analysis team should consider the aforementioned as well as other sources unique to the failure being analyzed. Example—Titanium Component Washing Litton Lasers machined lightweight titanium components using conventional machining...
Abstract
Contaminants can be a cause of numerous types of system failures. There are numerous techniques for confirming contaminant presence. When the presence of a contaminant is suspected, the failure analysis team must find and eliminate the contaminant source, which can be obvious or quite subtle. This chapter summarizes a few commonly encountered contaminant sources to stimulate the reader's thinking about potential contaminant sources. A case study of titanium component washing at Litton Lasers is presented to illustrate how the presence of contaminants leads to a system failure.
Book Chapter
Advanced Techniques of Failure Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... aluminide) composite, and in polyethylene gas pipeline material ( Ref 12 ). 5.5 Oxide Dating for Failure Analysis In the failure analysis of high-temperature power plant components, the major difficulty encountered is the masking of all fractographic features by the thick layer of the metal oxide...
Abstract
This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.
Book Chapter
Failure Analysis: Why and for Whom?
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270003
EISBN: 978-1-62708-301-0
... products are subjected to an aggressive operating environment. failure analysis SERVICE FAILURES of components and structures have been increasingly experienced in several industries, quite often without any warning. Some failures may be trivial, while others may have serious consequences...
Abstract
This chapter discusses the importance of failure analysis and the role it plays in a society driven by technological advancement. It explains why failure rates are highest in the early and later stages of the life of any product and shows the extent to which failure rates increase when products are subjected to an aggressive operating environment.
Book Chapter
Non-destructive Techniques for Advanced Board Level Failure Analysis
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... Abstract In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall...
Abstract
In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.
Book Chapter
The Failure Analysis Process
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610549
EISBN: 978-1-62708-303-4
.... It is not uncommon to find products that have no record of any stress analysis in product design. Even if such calculations were made, the failure analyst may not have access to them. The analyst must answer the questions “Was the component sized properly by the design stress analysis? Did the material have...
Abstract
This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.
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