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Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130087
EISBN: 978-1-62708-284-6
.... The term damage is often preferable to the term failure , because damage is a technical term that is very clear and has a specific meaning, generally related to the physical condition of the component. The term failure , on the other hand, has many more philosophical connotations. It is possible...
Abstract
This chapter reviews various ways to classify failure categories and summarizes the basic types, causes, and mechanisms of damage, with particular consideration given to whether the likelihood of the types of damage can or cannot be influenced by the heat treating of steel parts. The classical organization for types of damage (failures) is as follows: deformation, fracture, wear, corrosion or other environmental damage, and multiple or complex damage. The chapter also provides some examples of lack of conformance to specification that may at first look like the heat treater did something wrong, but where other contributing factors made it difficult or impossible for the heat treater to meet the specification.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130043
EISBN: 978-1-62708-284-6
... sources of failure can be attributed to material imperfections. For wrought products, this could be related to segregation, inclusions, porosity, laps, and seams. For castings, these imperfections could be cold shuts, inclusions, shrinkage, voids, and porosity. Forgings can have laps, seams, segregation...
Abstract
This chapter provides an overview of the possible mechanisms of failure for heat treated steel components and discusses the techniques for examining fractures, ductile and brittle failures, intergranular failure mechanisms, and fatigue. It begins with a description of the general sources of component failure. This is followed by a section on the stages of a failure analysis, which can proceed one after the other or occur at the same time. These stages of analysis are collection of background data, preliminary visual examination, nondestructive testing, selection and preservation of specimens, mechanical testing, macroexamination, microexamination, metallographic examination, determination of the fracture mechanism, chemical analysis, exemplar testing, and analysis and writing the report. The chapter ends with a discussion on various processes involved in the determination of the fracture mechanism.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
..., while visible degradation on the top surface from corrosion is generally easily visible with optical microscopy. [28] Passive optoelectronics usually have failure mechanisms caused by package-related failures. Examples include the shifting of optical fibers that couple the light in, delamination...
Abstract
Optoelectronic components can be readily classified as active light-emitting components (such as semiconductor lasers and light emitting diodes), electrically active but non-emitting components, and inactive components. This chapter focuses on the first category, and particularly on semiconductor lasers. The discussion begins with the basics of semiconductor lasers and the material science behind some causes of device failure. It then covers some of the common failure mechanisms, highlighting the need to identify failures as wearout or maverick failures. The chapter also covers the capabilities of many key optoelectronic failure analysis tools. The final section describes the common steps that should be followed so as to assure product reliability of optoelectronic components.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780081
EISBN: 978-1-62708-268-6
... the gap. Aerojet built the dispenser fuse to a U.S. government design. The company flight-tested and dropped two dispensers each month for lot-acceptance testing. After beginning initial production, Aerojet experienced no dispenser failures during the first several months of lot-acceptance testing...
Abstract
This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot, aging, and supplier changes. The chapter presents an example of a cluster bomb failure to explain how the failure analysis team found and corrected the failure cause.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780093
EISBN: 978-1-62708-268-6
... measurements, setting up measuring equipment, and performing complex mathematical calculations. For these reasons, it is generally a good idea to witness failure-analysis-related inspections, question assumptions made during the inspection to ensure concurrence on the approach, and understand what the...
Abstract
After the fault-tree, a failure-cause identification method has identified potential failure causes and the failure analysis team has prepared a failure mode assessment and assignment (FMA&A). The team knows specifically what to search for when examining components and subassemblies from the failed system. There are numerous techniques and technologies available for examining and analyzing components and subassemblies, which are categorized as follows: optical approaches, dimensional inspection and related approaches, nondestructive test approaches, mechanical and environmental approaches, and chemical and composition analysis for assessing material characteristics. This chapter is a detailed account of the working principle and the steps involved in these techniques and technologies.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780075
EISBN: 978-1-62708-268-6
... the item in the failed system may be an inspection escape). The failure analysis team may find sloppiness or errors in the inspection documentation, again suggesting an inspection escape. Inspection records: In a manner similar to that described previously, most companies retain their inspection...
Abstract
A product pedigree describes its design and how it was built and shows that it was built in accordance with the drawings and other documentation defining the product configuration. Evaluating the pedigree of a failed product can help to rule in or rule out hypothesized failure causes. This chapter describes various areas that can be examined by the failure analysis team to assess the pedigree of the failed system. If the failure analysis team suspects product pedigree anomalies it should confirm conformance through independent means.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
..., but it puts that knowledge in perspective and provides direction. This article reviews normal transistor operation and then relates it to electronic behavior in the presence of defects, such as bridges and opens. These electronic principles are then applied to an inexpensive CMOS failure analysis...
Abstract
Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130133
EISBN: 978-1-62708-284-6
... Abstract This article presents six case studies of failures with steel forgings. The case studies covered are crankshaft underfill; tube bending; spade bit; trim tear; upset forging; and avoidance of flow through, lap, and crack. The case studies illustrate difficulties encountered in either...
Abstract
This article presents six case studies of failures with steel forgings. The case studies covered are crankshaft underfill; tube bending; spade bit; trim tear; upset forging; and avoidance of flow through, lap, and crack. The case studies illustrate difficulties encountered in either cold forging or hot forging in terms of preforge factors and/or discontinuities generated by the forging process. Supporting topics that are discussed in the case studies include validity checks for buster and blocker design, lubrication and wear, mechanical surface phenomenon, forging process design, and forging tolerances. Wear, plastic deformation processes, and laws of friction are introduced as a group of subjects that have been considered in the case studies.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280323
EISBN: 978-1-62708-267-9
... phases, and how these processes contribute to microstructural changes as a function of time, temperature, and applied stress. It also describes several failure examples and discusses related issues, including damage recovery, refurbishment, and repair. microstructure gas turbine components...
Abstract
This chapter discusses the failure of superalloy components in high-temperature applications where they are subject to the effects of microstructural changes, melting, and corrosion. It explains how overheating can deplete alloying elements and alter the composition and distribution of phases, and how these processes contribute to microstructural changes as a function of time, temperature, and applied stress. It also describes several failure examples and discusses related issues, including damage recovery, refurbishment, and repair.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... about the need for analysis capabilities to understand failure mechanisms associated with these integrated circuits. As these parts grew in popularity, the requirement for failure analysis grew. During the late 1960’s many companies began taking the first steps toward establishing what we now know as a...
Abstract
Education and training play an important role if the failure analyst is to be successful in his or her work. This article discusses the history of training activities in the failure/product analysis discipline and describes where this area is heading. It provides information on three areas of education and training that should be given to the analyst for him or her to be successful developing and fielding modern semiconductor components: analysis process, technology, and technique training.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130311
EISBN: 978-1-62708-284-6
... Abstract This chapter focuses on the failure aspects of tool steels. The discussion covers the classification, chemical composition, main characteristics, and several failures of tool steels and their relation to heat treatment. The tool steels covered are hot work, cold work, plastic mold, and...
Abstract
This chapter focuses on the failure aspects of tool steels. The discussion covers the classification, chemical composition, main characteristics, and several failures of tool steels and their relation to heat treatment. The tool steels covered are hot work, cold work, plastic mold, and high-speed tool steels.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
... issue. The ever-increasing complexity of the semiconductor fabrication process demands a commensurate increase in product team member collaboration, in turn requiring an understanding of related disciplines. To this end, it is important that failure analysis personnel understand basic concepts of...
Abstract
This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
... reflects that not all at-speed failures identified during testing, and subsequently diagnosed, are actual, physical defects. The Freescale test case summarized below is a good example of companies using the convenience and performance of at-speed diagnosis for design optimization, timing analysis, timing...
Abstract
In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110262
EISBN: 978-1-62708-247-1
... and fabless companies rely on FA results to build defect pareto charts and identify problems that have the most impact to manufacturing yield ramp. Figure 2 Typical IC manufacturing time to market cycle Time to market can be shortened by finding root cause failures earlier and...
Abstract
Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... related damage; defects due to aging; no traceability; unknown pedigree Scrapped parts Source: part manufacturers, testing companies, contract manufacturers Attributes: internal quality problems such as missing die or bond wires; die contamination; part termination damage Reclaimed parts...
Abstract
Most of the counterfeit parts detected in the electronics industry are either novel or surplus parts or salvaged scrap parts. This article begins by discussing the type of parts used to create counterfeits. It discusses the three most commonly used methods used by counterfeiters to create counterfeits. These include relabeling, refurbishing, and repackaging. The article presents a systematic inspection methodology that can be applied for detecting signs of possible part modifications. The methodology consists of external visual inspection, marking permanency tests, and X-ray inspection followed by material evaluation and characterization. These processes are typically followed by evaluation of the packages to identify defects, degradations, and failure mechanisms that are caused by the processes (e.g., cleaning, solder dipping of leads, reballing) used in creating counterfeit parts.
Book Chapter
Book: Systems Failure Analysis
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780157
EISBN: 978-1-62708-268-6
... distribution characteristics to determine the probability of being above or below any particular value. In the failure analysis context, the normal distribution and its related probability distribution function are extremely important. Suppose the failure analysis team collects the range of outputs...
Abstract
Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 May 2018
DOI: 10.31399/asm.tb.hma.t59250187
EISBN: 978-1-62708-287-7
... the trial, they found that for a period in the 1920s when dividends were $25 million, the top executives received bonuses of $14 million. The press and Wall Street condemned the secret bonus plan, both for the extreme bonuses and for the company’s failure to reveal this information to the shareholders...
Abstract
This chapter discusses the formation and growth of various integrated steel companies from 1901 to 1959, namely the United States Steel Corporation, Bethlehem Steel Corporation, and a few of the notable smaller steel companies. The chapter discusses labor unrest and the growth of organized labor in the steel industry in the twentieth century.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 May 2018
DOI: 10.31399/asm.tb.hma.t59250207
EISBN: 978-1-62708-287-7
... exposed industrywide problems and failures that had existed for many years. Among them were poor labor relations, delayed modernization, an unbalanced product mix, and inconvenient mill locations in relation to the market. Other problems included steady price increases to cover union contracts rather than...
Abstract
This chapter is an account of the various events that led to the decline of the integrated steel industry during the 1950s. These include the steel strike of 1959, the improvements in technology and increase in imports since 1950s, widespread closures of steel companies, the decline of the minimill industry, and the rapid growth of Mittal Steel.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 May 2018
DOI: 10.31399/asm.tb.hma.t59250129
EISBN: 978-1-62708-287-7
... William Kroll. Various studies on the properties on titanium and research programs related to the production of titanium sponge and titanium metal products are then described. The chapter concludes with a discussion of titanium use in jet engines. jet engines metal products titanium titanium...
Abstract
This chapter is a detailed account of the history of development of titanium and its modern applications in the aerospace market. It begins by discussing the attempts made to produce titanium metal. This is followed by a discussion on the invention of a process for making titanium by William Kroll. Various studies on the properties on titanium and research programs related to the production of titanium sponge and titanium metal products are then described. The chapter concludes with a discussion of titanium use in jet engines.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... voltage scaling. In addition, defects causing more subtle electrical fail types (e.g., timing-related failures) are becoming more common in future technologies. Rising test costs may force new testing methods to become adopted. These rising costs are caused by the trends listed above, their impact on...
Abstract
This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.