Search Results for committee

This article presents best practices for the metallographic preparation of specimens produced via thermal spray coating methods. It outlines typical metallographic preparation process flow, highlighting important considerations for obtaining a clear and representative specimen suitable for characterization via examination techniques, such as optical or electron microscopy. The process flow includes preliminary resin infiltration, sectioning, mounting, grinding, and polishing. To aid in the identification and resolution of common issues during subsequent specimen analysis, the article presents common issues, along with causes and mitigation strategies. It describes the processes involved in the interpretation of the thermal spray coating microstructure.

Thermal barrier coatings (TBCs) are applied using thermal spray coating (TSC) processes to components that are internally cooled and operated in a heated environment. The TSC microstructures are prone to interactions with common metallographic procedures that may result in artifacts and misinterpretation of the TSC microstructure. This article aims to aid in identifying metallographic TSC artifacts, specifically in the air plasma spray zirconia-based TBC, including both of its common constituents, the bond coating and the top coating. Artifacts that result from specific sectioning and mounting practices, as well as from different polishing times, are presented. Additionally, the article discusses the factors in optical microscopy and scanning electron microscopy that affect microstructure interpretation.

Abradable coatings (such as Ni-4Cr-4Al/bentonite) are used throughout jet engines, primarily as sacrificial coatings into which moving components wear. This article presents the Accepted Practice for sample preparation of abradable coatings for metallographic analysis, based on round robin testing by several laboratories.

Molybdenum thermal spray coatings are used in aerospace and other industries for wear resistance applications. Metallographic sample preparation of molybdenum coatings presents unique challenges. The purpose of the investigation described in this article is to determine Accepted Practices for sample preparation to better understand the process related microstructures of thermal spray molybdenum powders. The committee followed a round robin approach to assess metallographic sample preparation by a variety of laboratories. The article summarizes the results of the committee’s work.

This article, prepared under the auspices of the ASM Thermal Spray Society Committees on Accepted Practices, describes a procedure for evaluating residual stresses in thermal spray coatings, which is an extension of the well-known layer removal method to include the Young’s modulus and Poisson’s ratio properties of the thermal spray coating material and the substrate. It presents questions and answers that were selected to introduce residual stresses in thermal spray coatings. The article describes equipment and the laboratory procedure for the modified layer removal method and provides the description of the residual stress specimen. It also describes the procedures for applying or installing bonded resistance strain gages, the dimensions of the test specimen, the procedure for removing layers, and the method for interpreting the data to evaluate residual stresses. The spreadsheet program, “ MLRM for Residual Stresses ,” is available as a supplement to this document.

This article addresses critical aspects in bond testing of thermal spray coatings and provides step-by-step guidance for obtaining representative and reproducible test results based on ASTM C633 and other applicable industry standards. It clarifies details of ASTM C633 requirements and provides examples of the best practice confirmed by hundreds of tests performed worldwide, adopted by numerous industrial standards, and requested to comply with international technical standardization and certification organizations such ISO, AS, SAE, and Nadcap.

In 1924, the American Society for Testing and Materials (ASTM) organized the symposium "Corrosion and Heat Resisting Alloys, and Electrical Resistance Alloys." It was the beginning of a major role that ASTM played in the history of stainless steel. This chapter provides information on the papers presented at the 1924 symposium. It also describes the role of ASTM in stainless steel standardization after the 1924 symposium.

This chapter reviews the general principles involved in codifying standards and describes the historical development of materials testing standards. It provides information on the standards related to the Brinell, Vickers, Rockwell, and Knoop methods as well as those for the instrumented indentation test and hardness conversions.

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

This appendix provides information on organizations that issue specifications and standards related to titanium and its alloys.

This chapter presents the Unified Numbering System (UNS) for metals and alloys.

This chapter presents the history of stainless steel and provides an overview of the key concepts discussed in this book. This book covers a broad spectrum of historical events, many of which have not been touched upon in other works on stainless steel. It includes the discoveries of the various metallic elements that are used in the various alloys of stainless steel and discusses numerous experiments conducted during the 19th century with iron-base alloys containing chromium and carbon.

Corrosion can be defined as a chemical or electrochemical reaction between a material, usually a metal, and its environment that produces a deterioration of the material and its properties. This chapter describes the effects and economic impact of corrosion in major industrial plants. The emphasis in this chapter, as well as in other chapters in this book, is on aqueous corrosion, or corrosion in environments where water is present. The chapter describes the classification of various forms of corrosion based on the nature of the corrodent, mechanism of corrosion, and appearance of the corroded metal. It discusses five primary methods of corrosion control, namely, material selection, coatings, inhibitors, cathodic protection, and design. Examples of the opportunities in corrosion control and the means to implement a program to capitalize on those opportunities are presented in a table. The chapter concludes with varied sources of information pertaining to corrosion and corrosion prevention.

This chapter provides information on the biennial International Wear of Materials Conference, which is the inspiration for this book. It reviews the fundamentals of tribology, tribosystems, and related terminology. The glossary at the end of this chapter is intended to familiarize readers with some of the fundamental tribology terms that will be repeated throughout this book.

This chapter briefly lays out the challenges associated with electrical fault isolation (EFI) brought on by continued transistor scaling and increasing package complexity. It also identifies high-priority issues and areas of technology that must be addressed for EFI tools and techniques to remain effective.

This appendix contains bibliographies related to the history of stainless steel.

This appendix is a timeline of events related to the discovery, development, and commercialization of stainless steels.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.