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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... Abstract Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting...
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Published: 01 November 2019
Figure 16 (a) Small sample cleaving pliers. (b) 6″ cleaving pliers. More
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Published: 01 November 2019
Figure 14 3-point cleaving. A pin provides the stress point when downward force is symmetrically applied equidistant from the weak point. Note the weak point is on the top and the pin is underneath. More
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Published: 01 November 2019
Figure 15 Cleaving over an edge. (a) Lay the scribe mark with the sample parallel to the ruler edge; (b) Using forefingers, push on either side of the scribe mark to initiate the cleave. More
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Published: 01 November 2019
Figure 2 Photoresist on silicon, cleaved and imaged in SEM. More
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Published: 01 November 2019
Figure 3 Copper bumps prepared in cross-section (A) post cleave (B) after broad ion beam milling. More
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Published: 01 November 2019
Figure 11 Copper film on (100) silicon cleaved after making a short scribe shows mirror finish edge. More
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Published: 01 November 2019
Figure 12 8″ wafer cleaved at 45 degrees to the notch. More
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Published: 01 November 2019
Figure 13 Sample cleaved at 45 degrees to (100) plane using a long scribe. More
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Published: 01 November 2019
Figure 17 (a) The portion of the sample to be used is positioned between the tweezers and the sample edge is scribed along the desired cleave line. The analyst then presses firmly on the top of sample. (b) The sample is cleaved in two pieces along the desired scribe line. More
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Published: 01 November 2019
Figure 5 The short scribe is used for crystalline materials while the long scribe is used for amorphous materials or to cleave counter to a crystal plane. More
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Published: 01 November 2019
Figure 12 Example of sample with logic diagnostic scan failure. The AOI in the red box shows the failing net. The sample is recommended to cleave along the longest length direction. More
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Published: 01 November 2019
Figure 4 Weak points made by diamond scribers. a) microline indent made by an indent and cleaving system; b) handheld scribe, free hand; c-e) various scribes using a ruler as a straight edge. More
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Published: 01 November 2019
Figure 6 Cross-section of glass substrate showing: (a) the side of the substrate where the weak point was placed, (b) the area of the initiation scribe, and (c) the area away from the weak point where the cleave was allowed to propagate. More
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Published: 01 November 2019
Fig 22 Plan view EBIC shows a top view of a stripe after aging. Defects originate at cleaving cracks at the bottom, and travel up and to the left. Once the defects cross the stripe, they quickly cause catastrophic failure. A drawing of this laser is also shown in figure 4 (after [4] ). More
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Published: 01 November 2019
Figure 7 Types of scribers and scribing tips. a) Handheld scribers with 4-6” handles. b) Tip of diamond pen style scriber c) Wedge shaped diamond indenter from a tool with integrated weak point and cleaving d) Sharp tip from handheld diamond scribe (large lines shown on the scale are in mm More
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Published: 01 November 2012
Fig. 14 Microvoid coalescence in an aluminum-silicon alloy (A380) loaded in tension. (a) Fracture surfaces consist of cleaved particles (i.e., silicon) and ridged fracture of the aluminum. Original magnification: 200×. (b) Higher-magnification (1440×) view of boxed region. (c) Fractured More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850712
EISBN: 978-1-62708-260-0
... min. Use solution d at 800°C for 30 min. Use solution e at 50-100°C for 24 h. Use solution f at 500°C for 1 min or 800°C for 10 min. Use solution g at 600°C for 60 min. Use solution h at 800°C for 10-60 min. Etch at 120°C for 20-60 min (Ehman and Austerman). Immerse cleaved surface 15 s, rinse in HC1...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
...] For sample preparation, the sample is first cleaved near to the defect location for the purpose to reduce the process time. High accuracy cleaving tool with combining micro-line indentation technology can easily reach to the precision of +/−10μm near to the AOI are useful in this step, shown in Fig. 12...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
..., this reference surface is typically the top layer of the die. In actuality, the angle of the section can be whatever the analyst needs it to be. Polishing vs. Cleaving A cross-section done on any kind of polishing wheel is referred to a “polished section”. Cleaving is a type of sectioning done on brittle...