In contrast to most plastic deformation processes, the shape of a machined component is not uniquely defined by the tooling. Instead, it is affected by complex interactions between tool geometry, material properties, and frictional stresses and is further complicated by tool wear. This chapter covers the mechanics and tribology of metal cutting processes. It discusses the factors that influence chip formation, including tool and process geometry, cutting forces and speeds, temperature, and stress distribution. It reviews the causes and effects of tool wear and explains how to predict and extend the life of cutting tools based on the material of construction, the use of cutting fluids, and the means of lubrication. It presents various methods for evaluating workpiece materials, chip formation, wear, and surface finish in cutting processes such as turning, milling, and drilling. It also discusses the mechanics and tribology of surface grinding and other forms of abrasive machining.

This chapter covers the practical aspects of machining, particularly for turning, milling, drilling, and grinding operations. It begins with a discussion on machinability and its impact on quality and cost. It then describes the dimensional and surface finish tolerances that can be achieved through conventional machining methods, the mechanics of chip formation, the factors that affect tool wear, the selection and use of cutting fluids, and the determination of machining parameters based on force and power requirements. It also includes information on nontraditional machining processes such as electrical discharge, abrasive jet, and hydrodynamic machining, laser and electron beam machining, ultrasonic impact grinding, and electrical discharge wire cutting.

This chapter focuses on the metallurgical factors governing the machinability of stainless steels. It begins by describing the chemistry, cleanliness, structure, processing history, and the cross-section size of the stock of the different grades of stainless steel. This is followed by a general description of the machining behavior of the stainless steel families, namely ferritic, martensitic, austenitic, precipitation hardening, duplex, and super stainless steels. The beneficial effect of controlled inclusions is then discussed. The chapter ends with a section providing information on high-speed tool steel and carbide tooling, along with tool coatings and coolants applicable to stainless steel.

The nitriding process can be applied to various materials and part geometries. This chapter focuses on tool steels, pure irons, low-alloy steels, and maraging steels. Various considerations such as the surface metallurgy requirements of the die, including case depth, compound layer formation, and temperature, are also discussed in this chapter. The chapter also addresses steel selection and surface metallurgy of gears.

The qualities that make superalloys excellent engineering materials also make them difficult to machine. This chapter discusses the challenges involved in machining superalloys and the factors that determine machinability. It addresses material removal rates, cutting tool materials, tool life, and practical issues such as set up time, tool changes, and production scheduling. It describes several machining processes, including turning, boring, planing, trepanning, shaping, broaching, drilling, tapping, thread milling, and grinding. It also provides information on toolholders, fixturing, cutting and grinding fluids, and tooling modifications.

This appendix provides an extensive amount of data corresponding to titanium machining processes, including sawing, turning, drilling, reaming, tapping, broaching, face milling, end milling, slotting, surface grinding, and thermal cutting.

This chapter covers common types of erosion, including droplet, slurry, cavitation, liquid impingement, gas flow, and solid particle erosion, and major types of wear, including abrasive, adhesive, lubricated, rolling, and impact wear. It also covers special cases such as galling, fretting, scuffing, and spalling and introduces the concepts of tribocorrosion and biotribology.

This chapter provides basic concepts and background for customer-related manufacturing processes applied to aluminum products including forming, joining and welding, surface treatments, and machinability. It reviews the selection criteria, key testing regimes, and original equipment manufacturer (OEM) requirements. The chapter also presents examples that demonstrate the importance of choosing the correct alloy and temper to successfully meet the OEM fabrication criteria.

This chapters reviews the various process, material, and post-treatment problems that can occur in nitriding and how to troubleshoot them. The troubleshooting methods discussed relate to gas nitriding, salt bath nitriding, and ion nitriding.

The compound zone that forms on the surface of nitrided steels is often called the white layer. When the nitrided sample is sectioned through the case, and then polished and etched with a standard solution of nital (2 to 5% nitric acid and alcohol), the immediate surface etches out as white in appearance above the nitrided case. This chapter focuses on the methods to control the compound zone, or white layer. It first provides information on a test to determine the presence of the white layer, and discusses the processes involved in the reduction of the compound zone by the two-stage process. Next, it describes other methods for controlling compound zone formation, and, finally, reviews the factors related to the determination of case depth in nitriding.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

Beryllium’s machining characteristics are similar to those of heat-treated cast aluminum and chilled cast iron. Like the other materials, it can be turned, milled, drilled, bored, sawed, cut, threaded, tapped, and trepanned with good results. This chapter explains how these machining operations are conducted and describes the effect of tooling materials, cutting speeds, metal-removal rates, and other variables. It also explains how to assess and remove surface damage caused by machining such as microcracks and twins.

This chapter familiarizes readers with the machining characteristics of titanium and the implementation of machining and shaping processes. It explains why titanium alloys are more difficult to machine than other metals and how it impacts the equipment and procedures that can be used. It describes the basic machining requirements for titanium in terms of tool geometry and materials, machine setup rigidity, cutting speeds and feed rates, and surface conditions, and explains how the requirements are met in practice in milling, turning, drilling, surface grinding, and broaching operations. The chapter also covers chemical and electrochemical machining processes as well as flame cutting.

The scanning acoustic microscope (SAM) is an important tool for development of improved molded and flip chip packages. The SAM used for integrated circuit inspection is a hybrid instrument with characteristics of both the Stanford SAM and the C-scan recorder. This chapter presents the historical development of SAM for integrated circuit package inspection, SAM theory, and analysis considerations. Case studies are presented to illustrate the practical applications of SAM. Other non-destructive imaging tools are briefly discussed, as well as SAM challenges and methods including spectral signature analysis and GHz-SAM.

The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages.

Surface cleanliness requirements depend on which nitrocarburizing process is selected for component treatment. This chapter discusses the processes involved in some of the more commonly used precleaning methods for gas ferritic nitrocarburizing and provides information on the methods used to accomplish enhanced plasma cleaning.

Over the revolutionary era of semiconductor technology, Computer-Aided Design Navigation (CADNav) tools have played an increasingly critical role in silicon debug and failure analysis (FA) in efforts to improve manufacturing yield while reducing time-to-market for integrated circuit (IC) products. This article encompasses the key principles of CADNav for various aspects of semiconductor FA and its importance for improved yield and profitability. An overview of the required input data and formats are described for both IC and package devices, along with key considerations and best practices recommended for fast fault localization, accurate root cause analysis, FA equipment utilization, efficient cross-team collaboration, and database management. Challenges with an FA lab ecosystem are addressed by providing an integrated database and software platform that enable design layout and schematic analysis in the FA lab for quick and accurate navigation and cross-tool collaboration.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.