The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

Temperature is a critical process parameter in the heat treatment and forging of steel and must be accurately measured to properly control it. This appendix discusses the operating principles of thermocouples and infrared pyrometers, describing the various types as well as advantages and applications.

This chapter includes a comprehensive set of definitions used in powder-binder processing.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

The orientation of the devices within a package determine the best chosen approach for access to a select component embedded in epoxy both in package or System in Package and multi-chip module (MCM). This article assists the analyst in making decisions on frontside access using flat lapping, chemical decapsulation, laser ablation, plasma reactive ion etching (RIE), CNC based milling and polishing, or a combination of these coupled with optical or electrical endpoint means. This article discusses the general characteristics, advantages, and disadvantages of each of these techniques. It also presents a case study illustrating the application of CNC milling to isolate MCM leakage failure.

The conversion of feedstock into a shape involves the application of heat and pressure, and possibly solvents. This chapter discusses the operating principle, advantages, limitations, and applications of such shaping processes, namely additive manufacturing, cold isostatic pressing, die compaction, extrusion, injection molding, slip casting, slurry processes, and tape casting. Information on equipment setup, requirements, and the various factors influencing these processes are described. In addition, the chapter provides information on novel approaches and processing costs applicable to these shaping processes.

This chapter is intended to identify materials, processes, and designs that will lead to great advances in powder-binder forming technologies. It discusses some of the structures obtained through these advances in powder-binder technologies such as binder jetting and extrusion-based additive manufacturing, including bound-metal deposition and fused-filament fabrication: oxidation-resistant high-temperature alloys, anisotropic structures, submicrometer-scale structures, surface hard materials, and artist metallic clays. Some of the advances discussed include the developments in process involving plastics, emulsions, ceramics, and porous structures and foams. Improvements in the design processes have led to the development of functional structures, controlled porosity, and bioinspired structures.

This chapter discusses the advantages, limitations, and applications of various aluminum casting processes, namely green sand casting process, air set or no-bake molding process, vacuum molding process, evaporative foam casting process, and die casting process. The processes covered also include gravity permanent molding, low-pressure permanent molding, counter pressure, squeeze casting, investment casting, rapid prototype casting, cast forge hybrid, and semisolid metal processes.

This chapter discusses the application of investment casting to nickel- and cobalt-base superalloys. It describes the production of polycrystalline and single crystal castings, the materials normally used, and the part dimensions and tolerances typically achieved. It explains how patterns, molds, and shells are produced, discusses the practice of directional solidification, and examines an assortment of turbine components cast from nickel- and cobalt-base alloys. The chapter also addresses casting problems such as inclusions, porosity, distortion, core shift, and leaching and explains how to avoid them.

This chapter provides helpful guidelines for selecting a surface treatment for a given application. It identifies important design factors and applicable treatments for common design scenarios, materials, and operating conditions. It explains why heat treatments and finishing operations may be required before or after processing and how to estimate or predict coating thickness, case depth, hardness, and the likelihood of distortion. It also addresses related issues and considerations such as part handling and fixturing, surface preparation and cleaning requirements, processability, aesthetics, and the influence of design features.

The chapter covers various aspects of biotribology in the context of dental care, orthopedic implants, haptics, eyewear, and stents and fixation devices. It also addresses the issue of biocompatibility and the effects of friction and contact pressure on skin.

This chapter covers the practices and procedures used for shape casting metals and alloys. It begins with a review of the factors that influence solidification and contribute to the formation of casting defects. It then describes basic melting methods, including induction, cupola, crucible, and vacuum melting, and common casting techniques such as sand casting, plaster and shell casting, evaporative pattern casting, investment casting, permanent mold casting, cold and hot chamber die casting, squeeze casting, semisolid metal processing, and centrifugal casting.

This chapter presents a glossary of foundry terms.

This chapter introduces the key powder fabrication attributes to assist in the identification of the right powders for an application. First, it describes the characteristics of engineering powders such as particle size distribution, powder shape and packing density, surface area, powder flow and rheology, and chemical analysis. The chapter then describes the general categories of powder fabrication methods, namely mechanical comminution, electrochemical precipitation, thermochemical reaction, and phase change and atomization. It provides information on the two largest contributors to powder price, namely raw material cost and conversion cost. The applicability of various processes to specific material systems is mentioned throughout this chapter.

This chapter provides guidelines and insights on the selection of materials, coatings, and treatments for friction and wear applications. It begins with a review of the system nature of tribological effects, the subtleties of friction, and the selection idiosyncrasies of the material systems and lubricants covered in prior chapters. It then presents a systematic approach for selecting tribomaterials, using an automotive fan motor as an example.

Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

Prior to forging, it is often necessary to preform billet stock to achieve adequate material distribution. This chapter discusses the equipment used for such operations, including transverse rolling machines, electric upsetters, ring-rolling mills, horizontal presses, and rotary (orbital) and radial forging machines. It describes their basic operating principles as well as advantages and disadvantages.