Brazes for carat gold jewelry must meet or exceed the fineness/caratage of the component piece parts of the assembly in order for it to meet the national fineness/caratage standards and marking or hallmarking regulations for jewelry. This chapter concentrates on brazes for gold jewelry. It provides understanding of the metallurgy of gold jewelry alloys and includes a discussion of brazes for carat gold jewelry. The chapter also provides information on traditional gold jewelry brazes, the target properties of filler metals for carat gold jewelry and describes the characteristics of novel 22 carat gold solders.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

This chapter presents an overview of families of brazing alloys that one is likely to encounter in a manufacturing environment. It discusses the metallurgical aspects of brazing and includes a survey of brazing alloy systems. A discussion of deleterious and beneficial impurities is provided with examples. The chapter also describes the application of phase diagrams to brazing.

This chapter presents an overview and survey of solder alloy systems. Extensive reference is made to phase diagrams and their interpretation. The chapter describes the effect of metallic impurities on different solders. The chapter concludes with a review of the key characteristics of eutectic alloys and of the factors most effective at depressing the melting point of solders by eutectic alloying.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.