This chapter focuses on the transfer of energy between the power supply and the induction heating coil. The most efficient transfer requires that the induction heated load and coil be matched to the power supply and that the electrical circuit containing these elements be properly tuned. The chapter describes these procedures, including the processes involved in tuning induction heating circuits and load matching, impedance matching by means of a transformer, and tuning used for specific types of power supplies.

This chapter discusses the basic components in an induction heat treating system. It describes the design and operating characteristics of power supplies, load-matching transformers, tuning capacitors, power regulators, controllers, process monitors, and diagnostic systems. It also provides information on fixtures and work-handling devices, quench systems, and load matching and tuning procedures.

Besides the induction coil and workpiece, the induction generator (source of ac power) is probably the most important component of an overall induction heating system. Such equipment is typically rated in terms of its frequency and maximum output power (in kilowatts). This chapter addresses the selection of power supplies in terms of these two factors as well as the operational features of different types of sources. The six different types of power supplies for induction heating applications covered in this chapter are line-frequency supplies, frequency multipliers, motor-generators, solid-state (static) inverters, spark-gap converters, and radio-frequency power supplies. The chapter discusses the design and characteristics of each of the various types of power supplies.

This appendix is a glossary of terms related to induction heat treating.

This chapter provides a brief review of the scientific and technological developments leading to the widespread use of induction heat treating and its many applications in industry.

Coil design for induction heating has been developed and refined over time based on the theoretical principles applied in practice to several simple inductor geometries such as the classical solenoidal coil. This chapter reviews the fundamental considerations in the design of inductors and describes some of the most widely used coils and common design modifications. Specialty coil designs for specific applications are also discussed. The chapter concludes with sections devoted to coil fabrication and design of power-supply leads.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

Specific heat and thermal expansion are closely related. Following a discussion on thermal expansion theory, methods of measurement techniques are presented along with their advantages and disadvantages. The results of the measurements are then summarized for three classes of materials: metallics, nonmetallics, and composites. Because predicting thermal expansion values for unmeasured or novel materials is useful, the chapter also describes the means of making educated guesses for low-temperature values. A short discussion on how thermal expansion data can be used is followed by a section describing where such data can be found.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

The conversion of feedstock into a shape involves the application of heat and pressure, and possibly solvents. This chapter discusses the operating principle, advantages, limitations, and applications of such shaping processes, namely additive manufacturing, cold isostatic pressing, die compaction, extrusion, injection molding, slip casting, slurry processes, and tape casting. Information on equipment setup, requirements, and the various factors influencing these processes are described. In addition, the chapter provides information on novel approaches and processing costs applicable to these shaping processes.

Laser Voltage Probing (LVP) is a key enabling technology that has matured into a well-established and essential analytical optical technique that is crucial for observing and evaluating internal circuit activity. This article begins by providing an overview on LVP history and LVP theory, providing information on electro-optical effects and free-carrier effects. It then focuses on commercially available continuous wave LVP systems. Alternative optoelectronic imaging and probing technologies for fault isolation, namely frequency mapping and laser voltage tracing, are also discussed. The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP.