This chapter addresses the challenge of selecting an appropriate stress-corrosion cracking (SCC) test to evaluate the serviceability of a material for a given application. It begins by establishing a generic model in which SCC is depicted in two stages, initiation and propagation, that further subdivide into several zones plus a transition region. It then discusses SCC test standards before describing basic test objectives and selection criteria. The chapter explains how to achieve the required loading conditions for different tests and how to prepare test specimens to determine elastic strain, plastic strain, and residual stress responses. It also describes the difference between smooth and precracked specimens and how they are used, provides information on slow-strain-rate testing and how to assess the results, and discusses various test environments and procedures, including tests for weldments. The chapter concludes with a section on how to interpret time to failure, threshold stress, percent survival, stress intensity, and propagation rate data, and assess the precision of the associated tests.

This data set contains the results of rotating-beam reversed-bending fatigue tests for a wide range of aluminum casting alloys. These fatigue curves are the results of tests on individual lots of material considered representative of the respective alloys and tempers.

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

This article discusses the material and engineering issues associated with plastic components subjected to impact. The first part covers the effects of loading rate, temperature, and state of stress on both deformation and mode of failure. It discusses standard impact tests, along with their associated results. A brief discussion on the linear elastic fracture mechanics method is presented, along with an example of its effectiveness as a predictive tool for impact performance. Various issues with a bearing on impact performance, such as processing, chemical attack, and aging, are also described. The second part describes the engineering calculations used to predict the performance of thin plastic beams, plates, and shells. The issue of assuming small displacements for the calculation of plastic structure performance is discussed and its limitations described. An example of the consequence of the very low modulus of elasticity associated with plastics and some plastic design solutions are offered.

This chapter reviews the fundamentals of stress, strain, and deformation and demonstrates some of the tools and techniques used to analyze how materials and structures respond to tension, compression, bending, and shear. It begins with an overview of the behavior of perfectly elastic and plastic materials and viscous substances. It then describes the stress-strain response of two- and three-dimensional solids, explaining how to determine principle stresses and strains using Mohr’s circle and how to derive equivalent stress and strain using the von Mises relationship. It then goes on to analyze the stress state of load-bearing members, pressurized tubes, and pin-loaded lugs, accounting for the effect of geometric discontinuities, such as cutouts, fillets, and holes, as well as cracks. It also explains how finite element methods are used to solve problems involving complex geometric and loading conditions.

Mechanical tests are performed to evaluate the durability of gears under load. The chapter first discusses the processes involved in the computations of stress for test parameters of gear. Next, the chapter reviews the four areas of specimen characterization of a test program, namely dimensional, surface finish texture, metallurgical, and residual stress. The following section presents the tests that simulate gear action, namely the rolling contact fatigue test, the single-tooth fatigue test, the single-tooth single-overload test, and the single-tooth impact test. Finally, the chapter describes the test procedures for surface durability (pitting), root strength (bending), and scoring (or scuffing) testing.

This chapter describes the effect of processing variables on the mechanical properties of beryllium, including tensile and yield strength, fracture toughness, creep and fatigue strength, ductile-to-brittle transition, and notch sensitivity. It also discusses the effects of chemical composition, impurities, and grain size and the use of hydrostatic testing.

This chapter describes the use of standardized tests to determine the susceptibility of aluminum alloys to specific forms of corrosion, including pitting, intergranular corrosion, filiform corrosion, exfoliation corrosion, and stress-corrosion cracking.