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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290243
EISBN: 978-1-62708-306-5
... Abstract Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870235
EISBN: 978-1-62708-314-0
... Abstract This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures. adhesive bonding epoxy adhesives surface...
Book Chapter

By Alfred Goldberg
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230441
EISBN: 978-1-62708-298-3
... Abstract This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... associated with diffusion bonding and welding processes. These processes use either deformation or diffusion and limited deformation to produce high-quality joints between both similar and/or dissimilar materials. Specific solid-state welding processes include: Diffusion welding, also commonly referred...
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Published: 01 June 2007
Fig. 5.21 Well-sintered 316L (etched) revealing interparticle bonding, twin boundaries, rounded pores, and precipitate-free grain boundaries More
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Published: 01 June 2007
Fig. 5.22 Well-sintered 434L (etched) revealing interparticle bonding, rounded pores, and precipitate-free grain boundaries More
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Published: 01 June 1988
Fig. 11.10 Photograph of multiplace induction coil used for adhesive bonding of rotors to shafts Source: Lindberg Cycle-Dyne, Inc. More
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Published: 01 June 1988
Fig. 11.16 Bonding of aluminum/polyethylene joints (such as for toothpaste tubes) with a high-frequency induction coil and ferrite flux modifier More
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Published: 01 March 2006
Fig. A.2 Schematic illustration of metallic bonding. Courtesy, John Wiley & Sons, Inc. More
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Published: 01 November 2010
Fig. 6.16 Amorphous or dual-resin bonding. PEEK, polyetheretherketone; PEI, polyetherimide More
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Published: 01 November 2010
Fig. 18.2 Trade study example. SPF/DB, super plastic forming/diffusion bonding More
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Published: 01 November 2010
Fig. 20.27 Diffusion bonding progression. Source: Ref 9 More
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Published: 01 November 2010
Fig. 20.28 Secondary diffusion bonding of titanium matrix composite (TMC) spars. HIP, hot isostatic pressing More
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Published: 01 November 2010
Fig. 20.29 Methods for making superplastic forming and diffusion bonding (SPF/DB) titanium matrix composite (TMC) reinforced parts More
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Published: 01 August 2005
Fig. 1.9 Superplastic forming and diffusion bonding of titanium. (a) Schematic of the steps involved. (b) Typical three-sheet titanium alloy component formed superplastically and diffusion bonded. (c) Cross section through a diffusion-bonded joint in titanium alloy, made at 980 °C (1795 °F More
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Published: 01 November 2019
Figure 59 GHz SAM on Cu-Cu wafer bonded samples for the inspection of the bonding interface and the detection of voids. A: Schematics of Cu-Cu wafer bonded sample. B: Electron micrographs of a cross section through the Cu-pillars and the bonding interface. The pitch of the Cu-pillars is 10 µm. More
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Published: 01 November 2019
Figure 61 Hybrid wafer bonding. The bond interface contains Cu-Cu, Cu-dielectric and dielectric-dielectric interfaces. GHz-SAM was performed through the top wafer (5 µm thickness) for delamination detection. Left: schematic in cross section. Right: illustration of the formation More
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Published: 01 June 2008
Fig. 1.3 Primary bonding mechanisms More
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Published: 01 June 2008
Fig. 1.4 Ionic bonding in NaCl More
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Published: 01 June 2008
Fig. 1.5 Covalent bonding in methane More