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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... associated with diffusion bonding and welding processes. These processes use either deformation or diffusion and limited deformation to produce high-quality joints between both similar and/or dissimilar materials. Specific solid-state welding processes include: Diffusion welding, also commonly referred...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290243
EISBN: 978-1-62708-306-5
... Abstract Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870235
EISBN: 978-1-62708-314-0
... Abstract This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures. adhesive bonding epoxy adhesives surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230441
EISBN: 978-1-62708-298-3
... Abstract This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations...
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Published: 01 November 2019
Figure 59 GHz SAM on Cu-Cu wafer bonded samples for the inspection of the bonding interface and the detection of voids. A: Schematics of Cu-Cu wafer bonded sample. B: Electron micrographs of a cross section through the Cu-pillars and the bonding interface. The pitch of the Cu-pillars is 10 µm. More
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Published: 01 November 2019
Figure 61 Hybrid wafer bonding. The bond interface contains Cu-Cu, Cu-dielectric and dielectric-dielectric interfaces. GHz-SAM was performed through the top wafer (5 µm thickness) for delamination detection. Left: schematic in cross section. Right: illustration of the formation More
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Published: 01 October 2011
Fig. 2.4 Illustrations of the primary bonding mechanisms More
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Published: 01 October 2011
Fig. 2.5 Ionic bonding in NaCl More
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Published: 01 October 2011
Fig. 2.6 Covalent bonding in methane More
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Published: 01 March 2002
Fig. 9.17 Functional description of the TLP bonding process with micrograph showing microstructure across completed joint More
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Published: 01 August 2013
Fig. 1.2 (a) Metallic bonding results from attraction of positive atoms to electron gas. (b) Ionic bonding results from mutual attraction of anions and cations. (c) Covalent bonding involves sharing of electrons to complete outer shells. (d) Van der Waals bonds are the result of statistical More
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Published: 01 June 2016
Fig. 3.9 Concurrent simulation of bonding and rebounding using an adiabatic quasi-two-dimensional model in ABAQUS/Explicit using the Eulerian algorithm. The oxide layer is described by a pressure-dependent yield model, allowing dilation at negligible tensile strength. For this example More
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Published: 01 June 2016
Fig. 3.10 Concurrent simulation of bonding and rebounding for agglomerates of homogeneous and composite copper particles impinging a copper substrate at 320 m/s (1050 ft/s). The homogeneous agglomerate bonds partially to the substrate, while all particles of the composite agglomerate rebound More
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Published: 01 June 2016
Fig. 8.5 Bonding state of aluminum tube and fin coated by cold spray after the brazing process. Source: Ref 8.20 More
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Published: 01 November 2012
Fig. 1 Ionic and covalent bonding. Source: Ref 1 More
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Published: 01 November 2010
Fig. 20.27 Diffusion bonding progression. Source: Ref 9 More
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Published: 01 November 2010
Fig. 20.28 Secondary diffusion bonding of titanium matrix composite (TMC) spars. HIP, hot isostatic pressing More
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Published: 01 November 2010
Fig. 20.29 Methods for making superplastic forming and diffusion bonding (SPF/DB) titanium matrix composite (TMC) reinforced parts More
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Published: 01 January 2015
Fig. 8.61 Optical micrograph showing the excellent bonding of titanium (bottom) to steel (top). Courtesy of Ktech More
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Published: 01 April 2013
Fig. 1 Microstructural bonding due to chemical segregation and mechanical working. Source: Ref 1 More