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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290243
EISBN: 978-1-62708-306-5
... Abstract Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870235
EISBN: 978-1-62708-314-0
... Abstract This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures. adhesive bonding epoxy adhesives surface...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230441
EISBN: 978-1-62708-298-3
... Abstract This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... associated with diffusion bonding and welding processes. These processes use either deformation or diffusion and limited deformation to produce high-quality joints between both similar and/or dissimilar materials. Specific solid-state welding processes include: Diffusion welding, also commonly referred...
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Published: 01 June 2008
Fig. 1.3 Primary bonding mechanisms More
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Published: 01 June 2008
Fig. 1.4 Ionic bonding in NaCl More
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Published: 01 June 2008
Fig. 1.5 Covalent bonding in methane More
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Published: 01 June 2008
Fig. 1.6 Van der Waals bonding between two dipoles More
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Published: 01 November 2011
Fig. 6.1 Sequence of metallurgical stages in the diffusion bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain-boundary diffusion of atoms to the voids More
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Published: 01 November 2011
Fig. 6.3 Typical diffusion bonding equipment. Source: Ref 6.1 More
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Published: 01 November 2011
Fig. 6.4 Schematic of four-sheet superplastic forming/diffusion bonding (SPF/DB) process More
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Published: 01 November 2011
Fig. 6.11 Bond shear strength versus surface exposure/reduction in cold roll bonding. Source: Ref 6.8 More
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Published: 01 November 2011
Fig. 10.16 Amorphous or dual-resin bonding. PEEK, polyetheretherketone; PEI, polyetherimide. Source: Ref 10.5 More
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Published: 01 June 2007
Fig. 5.21 Well-sintered 316L (etched) revealing interparticle bonding, twin boundaries, rounded pores, and precipitate-free grain boundaries More
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Published: 01 June 2007
Fig. 5.22 Well-sintered 434L (etched) revealing interparticle bonding, rounded pores, and precipitate-free grain boundaries More
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Published: 01 April 2004
Fig. 1.32 Temperature/pressure curve for diffusion bonding of gold, for a process time of 1 h. The line on the graph differentiates between joints of acceptable (above) and unsatisfactory (below) tensile joint strength after fabrication. More
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Published: 01 April 2004
Fig. 1.33 Temperature/pressure curve for diffusion bonding of indium, for a process time of 1 h. Good-quality joints are obtained from the conditions above the boundary line and lesser-quality or no joint from those below. More
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Published: 01 April 2004
Fig. 5.12 An array of exceptionally small flip-chip solder bumps ready for bonding. Each is mounted on a pedestal of polyamide for functional reasons. Solder bumps of this dimension can only be realized using semiconductor processing techniques. 5000×. Courtesy of BAE Systems More
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Published: 01 December 2008
Fig. 3.18 I-S bonding in a solid solution of γFe-interstitial (I)-substitutional (S). (a) Classification of interstitial sites. (b) Numerical distribution. (c) Trap ratio related to temperature. f 1 S = n S / n . More
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Published: 01 June 2016
Fig. 3.9 Concurrent simulation of bonding and rebounding using an adiabatic quasi-two-dimensional model in ABAQUS/Explicit using the Eulerian algorithm. The oxide layer is described by a pressure-dependent yield model, allowing dilation at negligible tensile strength. For this example More