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Book Chapter
Adhesive Bonding
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290243
EISBN: 978-1-62708-306-5
... Abstract Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing...
Abstract
Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing information on the theory of adhesion. The chapter then describes the considerations for designing adhesively bonded joints and for testing or characterizing adhesive materials. The following section covers the characteristics of the most important synthetic adhesive systems and five groups of adhesives, namely structural, hot melt, pressure sensitive, water based, and ultraviolet and electron beam cured. The chapter ends with a discussion on some general guidelines for adhesive bonding and the basic steps in the adhesive bonding process.
Book Chapter
Adhesive Bonding
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870235
EISBN: 978-1-62708-314-0
... Abstract This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures. adhesive bonding epoxy adhesives surface...
Abstract
This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 2009
DOI: 10.31399/asm.tb.bcp.t52230441
EISBN: 978-1-62708-298-3
... Abstract This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations...
Abstract
This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations of different adhesives, and surface preparation requirements. It explains how adhesives are applied and cured and how curing times and temperatures affect bonding strength. It also discusses the use of bolts and rivets and the different types of joints that can be made with them.
Book Chapter
Solid-State Welding and Bonding
Available to PurchaseSeries: ASM Technical Books
Publisher: ASM International
Published: 01 November 2011
DOI: 10.31399/asm.tb.jub.t53290137
EISBN: 978-1-62708-306-5
... associated with diffusion bonding and welding processes. These processes use either deformation or diffusion and limited deformation to produce high-quality joints between both similar and/or dissimilar materials. Specific solid-state welding processes include: Diffusion welding, also commonly referred...
Abstract
Solid-state welding processes are those that produce coalescence of the faying surfaces at temperatures below the melting point of the base metals being joined without the addition of brazing or solder filler metal. This chapter discusses solid-state welding processes such as diffusion welding, forge welding, roll welding, coextrusion welding, cold welding, friction welding, friction stir welding, explosion welding, and ultrasonic welding.
Image
Well-sintered 316L (etched) revealing interparticle bonding, twin boundarie...
Available to Purchase
in Sintering and Corrosion Resistance
> Powder Metallurgy Stainless Steels: Processing, Microstructures, and Properties
Published: 01 June 2007
Fig. 5.21 Well-sintered 316L (etched) revealing interparticle bonding, twin boundaries, rounded pores, and precipitate-free grain boundaries
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Image
Well-sintered 434L (etched) revealing interparticle bonding, rounded pores,...
Available to Purchase
in Sintering and Corrosion Resistance
> Powder Metallurgy Stainless Steels: Processing, Microstructures, and Properties
Published: 01 June 2007
Fig. 5.22 Well-sintered 434L (etched) revealing interparticle bonding, rounded pores, and precipitate-free grain boundaries
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Image
Photograph of multiplace induction coil used for adhesive bonding of rotors...
Available to Purchase
in Special Applications of Induction Heating
> Elements of Induction Heating: Design, Control, and Applications
Published: 01 June 1988
Fig. 11.10 Photograph of multiplace induction coil used for adhesive bonding of rotors to shafts Source: Lindberg Cycle-Dyne, Inc.
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Image
Bonding of aluminum/polyethylene joints (such as for toothpaste tubes) with...
Available to Purchase
in Special Applications of Induction Heating
> Elements of Induction Heating: Design, Control, and Applications
Published: 01 June 1988
Fig. 11.16 Bonding of aluminum/polyethylene joints (such as for toothpaste tubes) with a high-frequency induction coil and ferrite flux modifier
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Image
Schematic illustration of metallic bonding. Courtesy, John Wiley & Sons...
Available to PurchasePublished: 01 March 2006
Fig. A.2 Schematic illustration of metallic bonding. Courtesy, John Wiley & Sons, Inc.
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Image
Amorphous or dual-resin bonding. PEEK, polyetheretherketone; PEI, polyether...
Available to PurchasePublished: 01 November 2010
Fig. 6.16 Amorphous or dual-resin bonding. PEEK, polyetheretherketone; PEI, polyetherimide
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Image
Published: 01 November 2010
Fig. 18.2 Trade study example. SPF/DB, super plastic forming/diffusion bonding
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Image
Secondary diffusion bonding of titanium matrix composite (TMC) spars. HIP, ...
Available to PurchasePublished: 01 November 2010
Fig. 20.28 Secondary diffusion bonding of titanium matrix composite (TMC) spars. HIP, hot isostatic pressing
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Image
Methods for making superplastic forming and diffusion bonding (SPF/DB) tita...
Available to PurchasePublished: 01 November 2010
Fig. 20.29 Methods for making superplastic forming and diffusion bonding (SPF/DB) titanium matrix composite (TMC) reinforced parts
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Image
Superplastic forming and diffusion bonding of titanium. (a) Schematic of th...
Available to PurchasePublished: 01 August 2005
Fig. 1.9 Superplastic forming and diffusion bonding of titanium. (a) Schematic of the steps involved. (b) Typical three-sheet titanium alloy component formed superplastically and diffusion bonded. (c) Cross section through a diffusion-bonded joint in titanium alloy, made at 980 °C (1795 °F
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Image
GHz SAM on Cu-Cu wafer bonded samples for the inspection of the bonding int...
Available to Purchase
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 59 GHz SAM on Cu-Cu wafer bonded samples for the inspection of the bonding interface and the detection of voids. A: Schematics of Cu-Cu wafer bonded sample. B: Electron micrographs of a cross section through the Cu-pillars and the bonding interface. The pitch of the Cu-pillars is 10 µm.
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Image
Hybrid wafer bonding. The bond interface contains Cu-Cu, Cu-dielectric and ...
Available to Purchase
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 61 Hybrid wafer bonding. The bond interface contains Cu-Cu, Cu-dielectric and dielectric-dielectric interfaces. GHz-SAM was performed through the top wafer (5 µm thickness) for delamination detection. Left: schematic in cross section. Right: illustration of the formation
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