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In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.

X-ray imaging systems have long played a critical role in failure analysis laboratories. This article begins by listing several favorable traits that make X-rays uniquely well suited for non-destructive evaluation and testing. It then provides information on X-ray equipment and X-ray microscopy and its application in failure analysis of integrated circuit (IC) packaging and IC boards. The final section is devoted to the discussion on nanoscale 3D X-ray microscopy and its applications.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

Passive components can be broadly divided into capacitors, resistors, and inductors. Failure analysis of these components helps determine the root cause and improve the overall quality and reliability of the electronic systems. This article describes different failure analysis approaches used for these components. It discusses different types of capacitors along with their constructions and failure modes. The types include tantalum, aluminum electrolytic, multi-layered ceramics, film, and super capacitors. The article then provides a discussion on the two common types of inductors, namely, common mode choke coil and surface mount powder choke coil.

This chapter presents the Unified Numbering System (UNS) for metals and alloys.

This chapter describes the ways in which aluminum has been applied to recreation, with special attention on how its usage has changed the nature of these pursuits. It discusses the usage of aluminum in a variety of sports and sport vehicles.