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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090001
EISBN: 978-1-62708-462-8
... and techniques to remain effective. 3D packages fault isolation transistor scaling Today’s technology is fast growing, and with the adoption of new paradigms such as 5G, artificial intelligence, augmented reality, metaverse, blockchains, quantum computing, and autonomous driving...
Abstract
This chapter briefly lays out the challenges associated with electrical fault isolation (EFI) brought on by continued transistor scaling and increasing package complexity. It also identifies high-priority issues and areas of technology that must be addressed for EFI tools and techniques to remain effective.
