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ball grid arrays

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... to ceramic cavity devices, injection molded parts, and ball grid arrays. backside preparation ball grid arrays ceramic cavity devices injection molded parts milling optics polishing thinning This tutorial will assist the analyst in making decisions on backside thinning and polishing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440243
EISBN: 978-1-62708-352-2
... and Symbols A A BGA c C CSP CTE DCA DNL E F G G H HAZ g h K K k M MEMS MCM ppm P PADS PCB PTFE Q R RH atomic weight area ball grid array crack length concentration chip-scale package coefficient of thermal (linear) expansion; see also direct chip attach dip-and-look test internal energy or Young s modulus...
Image
Published: 01 November 2019
Figure 60 BGA mounted and electrically connected to the floating endpoint sensor plate. Nylon screws provide a constant gentle down pressure to hold the balls in contact with the plate while a recessed cavity is designed to securely hold the part in a BGA or Land Grid Array (LGA) capable mount More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... with a proven spatial resolution of 50 nm. To evaluate if the workflow is also applicable to multi-chip packages, a 3D test device was selected that was originally designed to qualify silicon in a standard FCBGA (Flip-Chip Ball Grid Array). The package consists of two memory dies (die thickness 725 μm...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110603
EISBN: 978-1-62708-247-1
... of leads) or undergo reballing (in the case of ball grid array (BGA) type interconnects) to provide a new finish. Refurbishing is often carried out in conjunction with relabeling to sell used parts as new parts. Refurbishing is also carried out to hide defects that arise during reclamation of parts from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... Spectroscopy Oxide Thickness Measurement on BGA and QFP for Solderability Assessment Introduction This chapter is an application of Auger Electron Spectroscopy (AES) where the oxide thickness is measured and related to solderability testing for evaluation of ball grid array (BGA) and quad flat...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Time-Domain Reflectometry is a useful tool for finding electrical anomalies in FCBGA (Flip-chip Ball Grid Array) samples. The technique is able to isolate an open, short or resistance shift to at least the laminate, bumps or chip by contacting a BGA (Ball Grid Array) Input/Output (I/O) bump...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... and TT-SAM, respectively. The use of TT-SAM became widely adopted in the late 1990’s when packages comprised of multiple thin layers emerged, such as Ball Grid Array (BGA) packages and thin chip-scale packages (CSPs), which often are 1 mm or less in thickness. The echoes from thin layers can...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2020
DOI: 10.31399/asm.tb.bpapp.t59290009
EISBN: 978-1-62708-319-5
.... (a) Nickel. (b) Cobalt-chromium alloy. (c) Tungsten carbide. In sequence, these powders were fabricated by vapor reaction, gas atomization, and mechanical attritioning. Powder production is a substantial industry, resulting in a wide array of compositions, purities, particle sizes, particle shapes...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440189
EISBN: 978-1-62708-352-2
... imaging device. (b) Close-up view of a single solder ball. The imaging device utilizes a 16 by 128 array of 33 μm (1.3 mil) diameter solder bumps for the interconnects. Each pixel is connected to its own amplifier and processing circuitry electronics. Courtesy of CERN Fig. 5.12 An array...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.fdsm.t69870237
EISBN: 978-1-62708-344-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.t60400109
EISBN: 978-1-62708-258-7
..., if examining a square grid of perpendicular lines, the grid at the center (axis) would represent the proper spacing, but near the edge of the image, the lines become curved and no longer represent the true grid spacing. This can be seen in Fig. 5.22 where it is greatly exaggerated. Distortion is produced...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.t62440145
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2004
DOI: 10.31399/asm.tb.ps.9781627083522
EISBN: 978-1-62708-352-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420363
EISBN: 978-1-62708-310-2
...% of industrially important metals crystallizing into one of these two structures. Simple Cubic System Two types of graphical depictions of a simple cubic system are shown in Fig. A.15 , namely, the point model and the hard ball model. Although the hard ball model, with the outermost electron shells...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280091
EISBN: 978-1-62708-267-9
... are now at issue with forging increments of greater than 10,000 lb (~4550 kg) being routinely manufactured. Deformation and Metal Removal in an AGT Disk Forging Figure 6.5 schematically illustrates the steps in the production of a simple AGT disk. The schematic is overlaid with grid lines...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.fdsm.9781627083447
EISBN: 978-1-62708-344-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... to measure the Coriolis force. The structure is built with SOI and etched with the Bosch etch, as the lines on the side of the structure indicate in Figure 6 . The array of holes is to allow for the release etch. Note the height of the structure ~20μm. Since the capacitor plates are laterally oriented...