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backside preparation

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... Abstract The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat...
Image
Published: 01 November 2019
Figure 11 From D. Barton, et al. “FLIP-Chip and “Backside” Sample Preparation Techniques” More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... Signal Image Mapping (ESIM), and E-beam Device Perturbation (EDP) [1] . Both cross-section and plan view TEM samples can be prepared from backside silicon removed units with no impact on throughput or degradation in image quality. Introduction Large scale semiconductor manufacturing companies...
Image
Published: 01 November 2019
Fig 15 Beam can be blocked by metal contact (left); using special sample preparation, we can embed the sample, and polish off backside, allowing full beam access from the backside while preserving the top contact (right). More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110144
EISBN: 978-1-62708-247-1
... and using an interferometer to map the remaining silicon thickness (RST) variation. This map is then applied to correct the irregular contour of the die and can be added accumulative to each subsequent die layer enabling adaptive correction. Please refer to the “Backside Preparation and Optics” section...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... defects and short-circuit defects and current paths. Laser methods are applicable from the frontside of ICs as well as from the backside. With proper sample preparation for optical access, laser-based FA methods can require only a few minutes to a few hours to localize defects. A better understanding...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... handled during sample preparation. This method is particularly ideal for the devices that requires backside emission analysis. Figure 8 Milling and repackaging process for backside emission analysis on the failing die in MCP devices. IR Inspection on Wafer Level CSPs WLCSP is the fastest...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
..., polyimide etc. Refer to fig. 5a . Once the top Copper layer exposed, there are couple ways to prepare for the wet chemical etch, e.g. using a diluted nitric acid (HNO 3 ) or mixture of ammonium hydroxide NH 4 OH + hydrogen peroxide (H 2 O 2 ) and etc. [5] Immerse the sample into the chemical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... A prerequisite step to CE is sample preparation to expose target ROIs and facilitate navigation between multiple tools. With every node progression, the number of BEOL layers increase. The only feasible method to access front-end-of-line (FEOL) components is through the backside of the chip. A combination...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... application specific integrated circuit (ASIC) or view alignment structures in a flipchip packaged device through the remaining backside silicon prepared from a few hundreds of microns down to 0-3µm thick. The resolution (on the order of 200nm) and contrast are adequate to enable viewing of recognizable...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... be blocked by metal contact (left); using special sample preparation, we can embed the sample, and polish off backside, allowing full beam access from the backside while preserving the top contact (right). Simple Characterization Techniques Electroluminescence Images Electroluminescence...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110042
EISBN: 978-1-62708-247-1
... olive oil for some relief from reflection, and also as a quick and dirty means of smoothing a rough or poorly prepared silicon surface. Doped Silicon Backside Thinning Heavily doped silicon is much less transparent than undoped silicon because of band-gap shifts and because of free carrier...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
.... The location of die level defects or defects in the micropillars (connections close to the top die in a 2.5D/3D module) would not be identified without sample preparation to reduce the terahertz travel distance from the laminate (failing, reference, substrate, substrate with interposer, etc). This will however...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
...) in Integrated Circuits (ICs) in full electrical operation. Optical CFI is performed in Near Infra Red (NIR) as the typical signal access is through chip backside. Complementary optical CFI techniques use scanning external light emitters and detect either signal stimulation in the IC or electro-optical...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... option of 1154nm offered by some vendors, which splits the difference! Waveform Acquisition Process An illustration of how LVP is implemented into a confocal LSM is presented in Fig. 6 . A focused CW IR laser beam is raster scanned over the backside of an exposed die. The reflected light is sent...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... need to determine device failure. If these issues are not accommodated properly, achieving any type of meaningful results will be much more difficult if not impossible. The outline for the topics discussed in this paper are as follows: Sample Preparation for Transistor Probing and Copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030043
EISBN: 978-1-62708-349-2
... 2000 … 10 … 1000 9 2500 … 8 … 1200 6 Fig. 3.9 Cross sections of 120-grit silicon carbide paper that was polished using diamond polishing compound. (a) Unused paper. Bright-field illumination, 50× objective. (b) After the preparation of one sample. A more uniform surface can...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
... is not cleanroom compatible and not ideal for sensitive surfaces or for any surface analysis preparation. Tabletop Back Scribing Method (Mechanical, Manual) This tool allows one to scribe the backside of the sample while viewing the frontside. The platform-integrated multi -faceted diamond tip can be set...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870307
EISBN: 978-1-62708-314-0
... Abstract This chapter covers basic machining and assembly operations, with an emphasis on hole preparation for mechanical fasteners. It describes manual, power feed, and automated drilling techniques as well as reaming and countersinking. It discusses various types of fasteners, including...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
... any preparation expense. LIT is also applicable for backside inspection and for detecting subsurface heat sources. Its spatial resolution can be improved down to 1 µm by applying a solid immersion lens. By using LIT, some defects can be localized which are not visible in laser-based techniques...