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backside nano-probing techniques

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
...Abstract Abstract This article presents methods that enable one to consistently, uniformly and quickly remove substrate silicon from units without imparting damage to the structure of interest. It provides examples of electron beam probing and backside nano-probing techniques. The electron beam...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110335
EISBN: 978-1-62708-247-1
... (NIBL). ” Nano Letters 11 , no. 10 ( 2011 ): 4443 – 4347 . 10.1021/nl202447n [20] Giannuzzi Lucille A. , Introduction to Focused Ion Beams: Instrumentation, Theory, Techniques and Practice . Springer Science & Business Media , 2004 . [21] Cantoni Marco , and Holzer...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... - 595 . 10.1007/s10854-013-1522-6 [100] Tan S. , Hallstein R. , Livengood R. H. , Prakasam H. , Patel L , Nastasescu O. , Scheffler C. , “ Exploring Neon GFIS Nano-Machining Applications in Circuit Edit ,” EIPBN abstract 2015 https://eipbn.omnibooksonline.com...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
... the International Symposium for Testing and Failure Analysis (ISTFA) , ( 2013 ) [36] Alder B. , “ Advantages of Electro-Optical Voltage Probing (EOP) using a Digitizer ” Contactless Optical/Nano-Probing EFA User Group session at the International Symposium for Testing and Failure Analysis (ISTFA...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... using squid and gmr sensors for failure analysis . In Proceedings of the Nano-Technology Symposium , 2017 . [41] Vallett D. et al . Magnetic current imaging revisited . EDFAS Magazine , 16 ( 4 ): 26 – 34 , 2014 . [42] Failure Analysis Work Flow for Electrical Shorts in Triple...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110285
EISBN: 978-1-62708-247-1
... , “ Combining the Nano-Probing Technique with Mathematics to Model and Identify Non-Visual Failures ” ISTFA 2007: Proceedings of the 33rd International Symposium for Testing and Failure Analysis , pp. 214 - 218 , November 4-8, 2007 . [7] Su Jie , Liang Sanan , Wen Yoyo , Yang May...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... advanced FinFET circuit with fin level resolution, ” Proc. ISTFA 2018 , pp. 345 – 348 , 2018 . [21] Schlangen R. , et al. , “ Functional IC Analysis Through Chip Backside With Nano Scale Resolution - E-Beam Probing in FIB Trenches to STI Level. ” Proc. ISTFA 2006 , pp. 376 - 381 , 2006...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
.... The benefits include site-specificity, precise control over the amount of material removed, nanometer range in uniformity control allows the analyst to perform nano-probing and transistor level characterization. [12] Comparing with regular gallium (Ga) FIB the Xe FIB interacts with inert Xe atoms...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... , 2006 ). [3] Tilli M. , Motooka T. , Airaksinen V-M. , Franssila S. , Paulasto-Krockel M. , and Lindroos V. , eds. Handbook of Silicon Based MEMS Materials and Technologies (Micro and Nano Technologies) , 2nd Ed ., Elsevier ( Boston , 2015 ). [4] Ghodssi...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110402
EISBN: 978-1-62708-247-1
.... cleaving cross-sectioning indenting sample cleaning sample handling sample mounting sample preparation scribing The Wafers and Dies Reasons for Sample Preparation References References [1] AZO Nano . ( 2018 , April 25 ) Retrieved January 22 , 2019 from www.azonano.com...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.9781627083232
EISBN: 978-1-62708-323-2