Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This chapter discusses the use of electron microscopy in metallographic analysis. It explains how electrons interact with metals and how these interactions can be harnessed to produce two- and three-dimensional images of metal surfaces and generate crystallographic and compositional data as well. It discusses the basic design and operating principles of scanning electron microscopes, transmission electron microscopes, and scanning transmission electron microscopes and how they are typically used. It describes the additional information contained in backscattered electrons and emitted x-rays and the methods used to access it, namely wavelength and energy dispersive spectroscopy and electron backscattering diffraction techniques. It also describes the role of focused ion beam milling in sample preparation and provides information on atom probes, atomic force microscopes, and laser scanning microscopes.

This chapter discusses the engineering significance of steel and briefly describes its chemical composition, crystal structure, Fe-C phases, and associated characterization techniques.

This chapter presents abbreviations and symbols used for soldering.

Thermal barrier coatings (TBCs) are applied using thermal spray coating (TSC) processes to components that are internally cooled and operated in a heated environment. The TSC microstructures are prone to interactions with common metallographic procedures that may result in artifacts and misinterpretation of the TSC microstructure. This article aims to aid in identifying metallographic TSC artifacts, specifically in the air plasma spray zirconia-based TBC, including both of its common constituents, the bond coating and the top coating. Artifacts that result from specific sectioning and mounting practices, as well as from different polishing times, are presented. Additionally, the article discusses the factors in optical microscopy and scanning electron microscopy that affect microstructure interpretation.

This appendix is a compilation of terms and definitions related to light microscopy of carbon steels.

This chapter describes the phases and constituents present in iron-carbon steels in near-equilibrium conditions. It explains how to use phase diagrams to predict and manage the development of ferrite, austenite, cementite, and pearlite through controlled cooling. It discusses the transformations, grain structure, and properties associated with each phase and identifies the primary stabilizing elements. It includes several micrographs revealing various microstructural features and describes the processing route by which they were achieved. It explains how to estimate the volume fraction of iron-carbon phases in equilibrium and how to determine the amount of each phase that must be present to reach a desired composition. The chapter also discusses the phases associated with hypo- and hyper-eutectoid steels and presents more than a dozen micrographs, identifying important structural features along with cooling conditions and sample preparation procedures.

This chapter reviews the fundamentals of classical nucleation theory, with application examples. The discussion covers the basic subjects of nucleation, spontaneous nucleation in solution, nucleation by inoculation, and nucleation in solids.

With cold work, mechanical strength (measured either by yield strength or ultimate tensile strength) increases and ductility (measured by elongation, reduction of area, or fracture toughness) normally decreases. This chapter discusses the mechanisms that produce these changes and the factors that influence them. It explains how cold working increases dislocation density and how that affects the stress-strain characteristics of steel, particularly the onset of deformation. It describes the effects of deformation on ferrite, austenite, cementite, and pearlite, and how to optimize their microstructure for various applications through controlled deformation. It also provides information on subcritical annealing, the examination and control of texture, the use of optical microscopy to monitor the effects of recrystallization, and the effect of cold working on threaded fasteners, nails, and filaments used to manufacture cords.

Most steels that are hardened are subjected to a subcritical heat treatment referred to as tempering. Tempering improves the toughness of as-quenched martensitic microstructures but lowers strength and hardness. This chapter describes the microstructural changes that occur during tempering and their effect on the mechanical properties of steel. It also discusses the effect of alloying elements and the formation of oxide colors.

The chapter covers various aspects of biotribology in the context of dental care, orthopedic implants, haptics, eyewear, and stents and fixation devices. It also addresses the issue of biocompatibility and the effects of friction and contact pressure on skin.

This chapter presents definitions of terms related to the metallurgy and metallographic study of irons and steels.

This chapter examines two important strengthening mechanisms, martensitic and bainitic transformations, both of which occur under nonequilibrium cooling conditions. It explains how time-temperature-transformation diagrams are constructed and how they are used to understand and control the formation of martensite and bainite in steel and other alloys. It describes the morphology of both types of structures, the factors that influence their formation, how they respond to tempering processes, and their effect on mechanical properties and behaviors. It also discusses the role of transformation hysteresis in shape memory alloys.

This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies that have helped drive the further proliferation of MEMS devices in the marketplace. It then shows some examples of the top MEMS applications and quickly discusses the fundamentals of their workings. The next section describes common failure mechanisms along with techniques and challenges in identifying them. The chapter also provides information on the testing of MEMS devices. It covers the two common challenges in sample preparation for MEMS: decapping, or opening up the package, without disturbing the MEMS elements; and removing MEMS elements for analysis. Finally, the chapter discusses the aspects of failure analysis techniques that are of particular interest to MEMS.

This appendix provides supplemental information on the metallurgical aspects of atomic structure, the use of dislocation theory, heat treatment processes and procedures, important engineering materials and strengthening mechanisms, and the nature of elastic, plastic, and creep strain components. It also provides information on mechanical property and fatigue testing, the use of hysteresis energy to analyze fatigue, a procedure for inverting equations to solve for dependent variables, and a method for dealing with the statistical nature of failure.