Search Results for artificial intelligence

This chapter briefly lays out the challenges associated with electrical fault isolation (EFI) brought on by continued transistor scaling and increasing package complexity. It also identifies high-priority issues and areas of technology that must be addressed for EFI tools and techniques to remain effective.

This chapter assesses the potential impact of neural networks on package-level failure analysis, the challenges presented by next-generation semiconductor packages, and the measures that can be taken to maximize FA equipment uptime and throughput. It presents examples showing how neural networks have been trained to detect and classify PCB defects, improve signal-to-noise ratios in SEM images, recognize wafer failure patterns, and predict failure modes. It explains how new packaging strategies, particularly stacking and disintegration, complicate fault isolation and evaluates the ability of various imaging methods to locate defects in die stacks. It also presents best practices for sample preparation, inspection, and navigation and offers suggestions for improving the reliability and service life of tools.

This chapter discusses the setup and use of a transmission electron detector in a typical scanning electron microscope (SEM). It describes the arrangement and function of the primary components in the detector, following the signal path from the sample to a micromirror array where it is directed by the user to either a CMOS sensor (to record diffraction patterns) or a photomultiplier tube (to observe real-space images). The chapter discusses some of the nuances of digital imaging and diffraction and includes examples in which transmission electron detectors are used to analyze gold films, carbon nanotubes, zeolite sheets, and monolayer graphene. It also describes emerging techniques, including four-dimensional STEM, thermal diffuse scattering, energy filtering, aberration correction, and atomic resolution imaging.

This chapter provides information on the biennial International Wear of Materials Conference, which is the inspiration for this book. It reviews the fundamentals of tribology, tribosystems, and related terminology. The glossary at the end of this chapter is intended to familiarize readers with some of the fundamental tribology terms that will be repeated throughout this book.

This chapter gives a brief review of the development of additive manufacturing (AM) and the appeal of different of different AM methods.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

Recent trends in electronic packaging, including the growing use of 3D designs and heterogeneous integration, are greatly adding to the complexity of isolating faults in semiconductor products. This chapter reviews the latest IC packaging and integration solutions and assesses the readiness level of fault isolation tools and techniques. It examines the capabilities, limitations, and optimization potential of x-ray tomography and magnetic field imaging, describes various approaches for optical fault isolation, and compares and contrasts pre-OFI sample preparation methods. The chapter also explains how time-domain and electro-optical terahertz pulse reflectometry are used to find shorts and opens in ICs and how challenges related to heterogenous integration may be met through design for testability (DFT) and built-in self-test (BIST) accommodations and the use of passive interposers.

This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.

Aluminum alloy products offer architectural and building solutions that exploit the benefits inherent in this metal: light weight, excellent durability, low maintenance, and thermal management opportunities. This chapter discusses the major applications for aluminum building products and related competitive materials. The commonly used alloys and tempers and their performance benefits are outlined for extruded profiles, rolled sheet and foil, and die cast products.

This chapter discusses how aluminum and other alloying constituents are added to prepare a furnace charge for the melting process, and how it is cast into billets of various aluminum alloys. Fundamental aspects of billet casting are covered to give an overview of the casting process. The melting practice is discussed, as well as grain refining and degassing. Charge material, grain refining, degassing, filtration of melt, casting systems, and casting variables are discussed. The chapter concludes with a discussion of casting defects.

The tensile test provides a relatively easy, inexpensive technique for developing mechanical property data for the selection, qualification, and utilization of metals and alloys in engineering service. The tensile test requires interpretation, and interpretation requires a knowledge of the factors that influence the test results. This chapter provides a metallurgical perspective for such interpretation. The topics covered include elastic behavior, anelasticity, damping, proportional limit, yield point, ultimate strength, toughness, ductility, strain hardening, and yielding and the onset of plasticity. The chapter describes the effects of grain size on yielding, effect of cold work on hardness and strength, and effects of temperature and strain-rate on the properties of metals and alloys. It provides information on true stress-strain relationships and special tests developed to measure the effects of test/specimen conditions. Finally, the chapter covers the characterization of tensile fractures of ductile metals and alloys.

This chapter assesses the state of 3D printing among automakers, medical device manufacturers, and construction companies.

Forging is a deformation process achieved through the application of compressive stresses. During the stroke, pressures and velocities are continuously changing and the initial lubricant supply must suffice for the duration of the operation. Lubricant residues and pickup products also change with time, further complicating the analysis of friction and wear. This chapter provides a qualitative and quantitative overview of the mechanics and tribology of forging in all of its forms. It discusses the effects of friction, pressures, forces, and temperature on the deformation and flow of metals in open-die, closed-die, and impression-die forging and in back extrusion and piercing operations. It presents various ways to achieve fluid-film lubrication in upset forging processes and examines the cause of barreling, defect formation, and folding in the upsetting of cylinders, rings, and slabs. It also explains how to evaluate lubricants, friction, and wear under hot, cold, and warm forging conditions and how to extend die life and reduce defects when processing different materials.

This chapter outlines the step-by-step processes by which materials are selected in order to prevent or control corrosion and includes information on materials that are resistant to the various forms of corrosion. The various forms of corrosion covered are general (uniform) corrosion, localized corrosion, galvanic corrosion, intergranular corrosion, stress-corrosion cracking, hydrogen damage, and erosion-corrosion. In addition, the economic importance of cost-effective materials selection is also considered.

This chapter familiarizes readers with the methods used to quantify the effects of fatigue on component lifetime and failure. It discusses the development and use of S-N (stress amplitude vs. cycles to failure) curves, the emergence of strain-based approaches to fatigue analysis, and important refinements and modifications. It demonstrates the use of approximate equations, including the method of universal slopes and the four-point correlation technique, which provides reasonable estimates of elastic and plastic lines from information obtained in standard tensile tests. It also discusses high-cycle, low-cycle, and ultra-high cycle fatigue and presents several models that are useful for fatigue life predictions.

This chapter covers the mechanics and tribology of sheet metalworking processes, including shearing, bending, spinning, stretching, deep drawing, ironing, and hydroforming. It explains how to determine friction, wear, and lubrication needs based on process forces, temperatures, and strains and the effects of strain hardening on workpiece materials. It presents test methods for evaluating process tribology, describes lubrication and wear control approaches, and discusses the factors, such as surface roughness, lubricant breakdown, and adhesion, that can lead to galling and other forms of wear. It also provides best practices for selecting, evaluating, and applying lubricants for specific materials, including steels, stainless steels, and aluminum and magnesium alloys.

In contrast to most plastic deformation processes, the shape of a machined component is not uniquely defined by the tooling. Instead, it is affected by complex interactions between tool geometry, material properties, and frictional stresses and is further complicated by tool wear. This chapter covers the mechanics and tribology of metal cutting processes. It discusses the factors that influence chip formation, including tool and process geometry, cutting forces and speeds, temperature, and stress distribution. It reviews the causes and effects of tool wear and explains how to predict and extend the life of cutting tools based on the material of construction, the use of cutting fluids, and the means of lubrication. It presents various methods for evaluating workpiece materials, chip formation, wear, and surface finish in cutting processes such as turning, milling, and drilling. It also discusses the mechanics and tribology of surface grinding and other forms of abrasive machining.