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This chapter discusses the application of investment casting to nickel- and cobalt-base superalloys. It describes the production of polycrystalline and single crystal castings, the materials normally used, and the part dimensions and tolerances typically achieved. It explains how patterns, molds, and shells are produced, discusses the practice of directional solidification, and examines an assortment of turbine components cast from nickel- and cobalt-base alloys. The chapter also addresses casting problems such as inclusions, porosity, distortion, core shift, and leaching and explains how to avoid them.

To ensure the proper application of plastics, one must keep in mind three factors that determine the appropriate end-use: material selection, processing, and design. This article begins by providing information on various factors pertinent to the anticipated use conditions of the article to be designed. This is followed by a discussion on several stages necessary to define the geometry of plastic parts. Details on the strength of and cost estimation for plastic parts are then provided. The article ends with a section providing information on the structure, properties, processing, and end-use applications of plastics.

This article reviews various analytical techniques most commonly used in plastic component failure analysis. The description of the techniques is intended to make the reader familiar with the general principles and benefits of the methodologies. The descriptions of the analytical techniques are supplemented by a series of case studies that include pertinent visual examination results and the corresponding images that aided in the characterization of the failures. The techniques covered include Fourier transform infrared spectroscopy, differential scanning calorimetry, thermogravimetric analysis, thermomechanical analysis, and dynamic mechanical analysis. The article also discusses various analytical methods used to characterize the molecular weight distribution of a polymeric material. It provides information on a wide range of mechanical tests that are available to evaluate plastics and polymers, covering the various considerations in the selection and use of test methods.

This article provides a high-level overview of thermal spray technologies and their applications and benefits. It is intended to educate members of government, industry, and academia to the benefits of thermal spray technology. The article describes the value of thermal spray technology with examples of application success stories. A few applications critical to thermal spray and market growth are briefly discussed. The article also summarizes the key research areas in thermal spray technology.

This chapter discusses the factors influencing the corrosion resistance of bulk materials, namely alloying, metallurgical factors, and mechanical treatments.

This chapter presents the usefulness of martensitic chromium stainless steels discovered in England and America, the usefulness of ferritic chromium stainless steels discovered in America, and the usefulness of chromium-nickel stainless steels discovered in Germany. It also provides a short note on the usefulness of chromium-silicon steels.

As semiconductor feature sizes have shrunk, the technology needed to encapsulate modern integrated circuits has expanded. Due to the various industry changes, package failure analyses are becoming much more challenging; a systematic approach is therefore critical. This article proposes a package failure analysis flow for analyzing open and short failures. The flow begins with a review of data on how the device failed and how it was processed. Next, non-destructive techniques are performed to document the condition of the as-received units. The techniques discussed are external optical inspection, X-ray inspection, scanning acoustic microscopy, infrared (IR) microscopy, and electrical verification. The article discusses various fault isolation techniques to tackle the wide array of failure signatures, namely IR lock-in thermography, magnetic current imaging, time domain reflectometry, and electro-optical terahertz pulse reflectometry. The final step is the step-by-step inspection and deprocessing stage that begins once the defect has been imaged.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This article describes the general aspects of and practical problems of failure analysis of creep, stress relaxation, and yielding for homogeneous polymers. The effect of temperature and strain rate on the relationship between yield point and elastic modulus and the aging effect that polymers often undergo at room temperature are also discussed.

This article is a compilation of terms and definitions related to failure analysis that have been addressed in the proceedings of the International Symposium for Testing and Failure Analysis.

Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis is performed. This chapter describes why failure analysis is conducted and outlines the responsibilities of the failure analyst.

In this overview of diagnosis of scan logic and diagnosis driven failure analysis, the authors explore the world of diagnosis of digital semiconductors devices. After shortly outlining the technology behind diagnosis, the main part of this article describes key improvements to the basic diagnosis tools, discussing their merits for the failure analysis engineer. The article also describes the various requirements and other considerations that typically need to be taken into account to set up a full working scan diagnosis system. It summarizes the principles of design with embedded compression technologies. Finally, several successful industrial applications of diagnosis are presented.

This article provides a brief description of commercially important thermal spray processes and gives examples of applications and application requirements. The processes covered are flame, wire arc, plasma, high-velocity oxyfuel processes, detonation gun, and cold spray methods. Examples are provided of the applications in aerospace, automotive, and medical device industries as well as the use of thermal spray as an additive manufacturing technique.

Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.