This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This chapter presents the theory and practice associated with the application of thin films. The first half of the chapter describes physical deposition processes in which functional coatings are deposited on component surfaces using mechanical, electromechanical, or thermodynamic techniques. Physical vapor deposition (PVD) techniques include sputtering, e-beam evaporation, arc-PVD, and ion plating and are best suited for elements and compounds with moderate melting points or when a high-purity film is required. The remainder of the chapter covers chemical vapor deposition (CVD) processes, including atomic layer deposition, plasma-enhanced and plasma-assisted CVD, and various forms of vapor-phase epitaxy, which are commonly used for compound films or when deposit purity is less critical. A brief application overview is also presented.

This chapter introduces the key powder fabrication attributes to assist in the identification of the right powders for an application. First, it describes the characteristics of engineering powders such as particle size distribution, powder shape and packing density, surface area, powder flow and rheology, and chemical analysis. The chapter then describes the general categories of powder fabrication methods, namely mechanical comminution, electrochemical precipitation, thermochemical reaction, and phase change and atomization. It provides information on the two largest contributors to powder price, namely raw material cost and conversion cost. The applicability of various processes to specific material systems is mentioned throughout this chapter.

Most iron and steel castings are produced by casting into sand molds. Sand cores are needed primarily to form hollow cavities in castings for collapsibility and ease of cleaning. This chapter begins with an overview of the classification of molding and core-making systems. This is followed by a section discussing the process involved in shell molding, along with its applications. A brief description of the special casting processes is then presented. Next, the chapter discusses the processes involved in core making. Further, it provides an overview of casting manufacturing. Finally, the chapter provides information on the factors that influence a casting facility layout.

This chapter is a detailed account of various attributes related to mixing and testing of powder-binder feedstocks. Mixing parameters and their effects on feedstock properties is discussed. The attributes reviewed include mixture homogeneity, wetting, powder-binder ratio, feedstock density, elastic modulus, rheological behavior, particle size, formulation control, feedstock mixing, and feedstock properties. The chapter also provides information on the processes involved in feedstock preparation and testing.

Steel is broadly classified as plain-carbon steels, low-alloy steels, and high-alloy steels. This chapter begins by describing microconstituents of low- and medium-carbon steel, including bainite and martensite. This is followed by a section discussing the effect of alloying elements on steel. Then, it provides an overview of steel casting applications. Next, the chapter reviews engineering guidelines for steel castings and feeder design. The following section provides information on feeding aids. Further, the chapter describes the elements of gating systems for steel castings. It also describes the alloys, properties, applications, and engineering details of steel. Finally, the chapter explains defects in steel castings and presents guidelines for problem solving with examples.

This chapter covers the emerging practice of quantitative microscopy and its application in the study of the microstructure of metals. It describes the methods used to quantify structural gradients, volume fraction, grain size and distribution, and other features of interest. It provides examples showing how the various features appear, how they are measured, and how the resulting data are converted into usable form. The chapter also discusses the quantification of fracture morphology and its correlation with material properties and behaviors.

This chapter discusses the processes and procedures involved in tribotesting, the significance of test parameters and conditions, and practical considerations including test metrics and measurements and the interpretation of wear damage. It also describes the different types of erosion tests in use and common approaches for adhesive wear and abrasion testing.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

The susceptibility of plastics to environmental failure, when exposed to organic chemicals, limits their use in many applications. Environmental factors can be classified into two categories: chemical and physical effects. This article discusses the effects of these environmental factors on the mechanical properties of plastics.

This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications. The article presents examples that demonstrate the benefits of the enhanced wafer-level FA process. It also introduces the setup of the wafer-level fault localization system. The application of the wafer-level FA process on a 22 nm technology device failing memory test is studied and some common design limitations and their implications are discussed. The article presents a case study and finally introduces a different value-add application flow capitalizing on the wafer-level fault localization system.

This chapter includes a comprehensive set of definitions used in powder-binder processing.

Rough grinding and polishing of mounted specimens are required to prepare the composite sample for optical analysis. This chapter describes these techniques for preparing composite materials. First, it provides information on grinding and polishing equipment and describes the processes and process variables for sample preparation. Then, the chapter discusses the processes of abrasive sizing for grinding and rough polishing. Next, it provides a summary of grinding methods, rough polishing, and final polishing. Finally, information on common polishing artifacts that can result from any of the steps is provided.

This chapter familiarizes readers with the many and varied thermoset composite fabrication processes and the types of applications for which they were developed. It describes wet lay-up, prepreg lay-up, and low-temperature vacuum bag curing prepreg processes, which are best suited for low-volume, medium-sized and larger parts. It also discusses filament winding and preforming processes (including weaving, knitting, stitching, and braiding) in addition to resin-transfer molding, resin film infusion, and pultrusion.