After the failure analysis team hypothesizes failure causes, prepares a failure mode assessment and assignment, and evaluates all potential failure causes, it may find in some cases that several causes are still suspect but cannot be confirmed. In this situation, an experiment is necessary to confirm or rule out suspected causes. This chapter discusses two predominant methods for doing this, namely analysis of variance (ANOVA) and Taguchi methods (a more powerful technique based on ANOVA).

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

At the conclusion of a systems failure analysis, the people involved should have a much more in-depth understanding of how the system is supposed to work. The analysis should help understand shortfalls in the design, production, testing, and use of the system. The failure analysis team will have identified other potential failure causes and actions required to preclude future failures. This is valuable knowledge, and it should not be set aside or ignored when the failure analysis team concludes its activities. This chapter is a brief account of the creation of failure analysis libraries, of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure.

This chapter presents various case histories that illustrate a variety of failure mechanisms experienced by the high-strength steel components in aerospace applications. The components covered are catapult holdback bar, AISI 420 stainless steel roll pin, main landing gear (MLG) lever, inboard flap hinge bolt, nose landing gear piston axle, multiple-leg aircraft-handling sling, aircraft hoist sling, internal spur gear, and MLG axle. In addition, the chapter provides information on full-scale fatigue testing, nondestructive testing, and failure analysis of fin attach bolts.

This chapter provides information on various contributors to failure of carburized and carbonitrided components, with the primary focus on carburized components. The most common contributors covered include component design, selection of proper hardenability, increased residual stress, dimensional stability, and generation of quenching and grinding cracks. They also include insufficient case hardness and improper core hardness, influence of surface carbon content and grain size, internal oxidation, structure of carbides, and inclusion of noncarbide. Details on micropitting, macropitting, case crushing, pitting corrosion, and partial melting are also provided.

This chapter is a detailed account of various factors pertinent to the development and launch of a product. It begins by describing the five phases in the product launch process, namely product design and development, process design and development, product and process validation, product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements are then reviewed. Details on product validation requirements and definitions of parameters related to the launch process are also provided. The chapter discusses the purpose of manufacturing control plan, along with an illustration of a manufacturing control plan outlined for a safety-critical suspension casting. It ends with an overview of the contents of a program launch manual.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This article describes the most common, general-purpose analog design-for-test (DFT) methods, analog test buses and loopback, and shows their advantages and limitations in diagnosability and automatability. It also describes DFT and built-in self-test (BIST) techniques for the most common analog functions, namely phase-locked loop, serializer-deserializer, analog/digital converters, and radio frequency. Lastly, the challenges of creating BIST for analog functions are summarized, along with seven principles that must be exploited to meet these challenges. These principles show how the design constraints for analog BIST circuitry can be more relaxed than for the circuit under test, while delivering the required test accuracy and speed.

This chapter discusses various factors pertinent to the applications of low-pressure permanent mold casting process, namely decorative automotive wheels, critical safety structural components, and chassis components.

This chapter discusses the basic differences between direct and indirect extrusion, the application of plastic theory, the significance of strain and strain rate, friction, and pressure, and factors such as alloy flow stress and extrusion ratio, which influence the quality of material exiting the die and the amount of force required.

This chapter reviews the basic chemistry of beryllium metals and compounds, including beryllium hydroxide, beryllium carbonates, beryllium fluoride, and beryllium chloride. It discusses the uses as well as application challenges of various forms of beryllium and includes information on their chemical properties and reactions.

This chapter discusses the various factors pertinent to gravity permanent mold (GPM) castings, along with their advantages, limitations, and significance. The discussion covers the geometric factors, process and manufacturing elements, gating practices, and feeding principles of and pouring systems in GPM. The influences of mold coatings on GPM and low pressure permanent mold castings are described. The chapter also discusses various processes involved in the engineering of core boxes and cooling of GPM for casting integrity and cycle time control. It provides information on some of the processes involved in post-casting operations, namely de-coring and de-gating. The key design aspects for consideration in water quenching during the T6 heat treatment are reviewed. The chapter also provides information on two critical cycle events important in engineering at the manufacturing facility: tipper cycle planning and table or cell cycle planning.

This chapter presents a fracture-mechanics-based approach to damage tolerance, accounting for mechanical, metallurgical, and environmental factors that drive crack development and growth. It begins with a review of stress-intensity factors corresponding to a wide range of crack geometries, specimen configurations, and loading conditions. The discussion covers two- and three-dimensional cracks as well as the use of correction factors and problem-simplification techniques for dealing with nonstandard configurations. The chapter goes on to describe how fatigue loading affects crack growth rates in each of the three stages of progression. Using images, diagrams, and data plots, it reveals how cracks advance in step with successive stress cycles and explains how fatigue crack growth rates can be determined by examining striations on fracture specimens and correlating their widths with stress profiles. It also describes how material-related factors, load history, corrosion, and temperature affect crack growth rates, and discusses the steps involved in life assessment.

This chapter discusses the principles of corrosion of metals in aqueous environments. The thermodynamics of aqueous corrosion is the subject of the first half of this chapter, which addresses concepts such as corrosion reactions and free-energy change, the relationship between free energy and electrochemical potential, the effect of ionic concentration on electrode potential, and the corrosion behavior of a metal based on its potential-pH diagram. The corrosion (potential-pH) behavior of iron, gold, copper, zinc, aluminum, and titanium are described. Understanding the kinetics of corrosion and the factors that control the rates of corrosion reactions requires examination of the concepts of polarization behavior and identification of the various forms of polarization in an electrochemical cell. These concepts, addressed in the remaining of this chapter, include anodic and cathodic reactions, the mixed-potential theory, and the exchange currents.

This chapter addresses the challenge of selecting an appropriate stress-corrosion cracking (SCC) test to evaluate the serviceability of a material for a given application. It begins by establishing a generic model in which SCC is depicted in two stages, initiation and propagation, that further subdivide into several zones plus a transition region. It then discusses SCC test standards before describing basic test objectives and selection criteria. The chapter explains how to achieve the required loading conditions for different tests and how to prepare test specimens to determine elastic strain, plastic strain, and residual stress responses. It also describes the difference between smooth and precracked specimens and how they are used, provides information on slow-strain-rate testing and how to assess the results, and discusses various test environments and procedures, including tests for weldments. The chapter concludes with a section on how to interpret time to failure, threshold stress, percent survival, stress intensity, and propagation rate data, and assess the precision of the associated tests.

This chapter takes a practical approach to the problem of stress-corrosion cracking (SCC) in stainless steels, explaining how different application environments affect different grades of stainless steel. It describes the causes of stress-corrosion cracking in chloride, caustic, polythionic acid, and high-temperature environments and the correlating effects on austenitic, ferritic, duplex, martensitic, and precipitation hardening stainless steels and nickel-base alloys. It also discusses the contributing effects of sensitization and hydrogen embrittlement and the role of composition, microstructure, and thermal history. Sensitization is particularly detrimental to austenitic stainless steels, and in many cases, eliminating it will eliminate the susceptibility to SCC. The chapter includes an extensive amount of data and illustrations.

This article describes key processing methods and related design, manufacturing, and application considerations for plastic parts and includes a discussion on materials and process selection methodology for plastics. The discussion covers the primary plastic processing methods and how each process influences part design and the properties of the plastic part. It also includes a brief description of functional requirements in process selection; an overview of various process effects and how they affect the functions and properties of the part; and the selection of processes for size, shape, and design detail factors.

Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.