After the failure analysis team hypothesizes failure causes, prepares a failure mode assessment and assignment, and evaluates all potential failure causes, it may find in some cases that several causes are still suspect but cannot be confirmed. In this situation, an experiment is necessary to confirm or rule out suspected causes. This chapter discusses two predominant methods for doing this, namely analysis of variance (ANOVA) and Taguchi methods (a more powerful technique based on ANOVA).

At the conclusion of a systems failure analysis, the people involved should have a much more in-depth understanding of how the system is supposed to work. The analysis should help understand shortfalls in the design, production, testing, and use of the system. The failure analysis team will have identified other potential failure causes and actions required to preclude future failures. This is valuable knowledge, and it should not be set aside or ignored when the failure analysis team concludes its activities. This chapter is a brief account of the creation of failure analysis libraries, of process guidelines based on previous failure analyses, and of troubleshooting and repair guidelines. Also provided is a listing of the various steps that should be included in a failure analysis procedure.

This chapter is a detailed account of various factors pertinent to the development and launch of a product. It begins by describing the five phases in the product launch process, namely product design and development, process design and development, product and process validation, product launch, and continuous improvement. This is followed by sections covering product-process flow diagrams and also the process elements considered for process failure mode and effects analysis. Some of the aspects covered by the engineering specifications to meet the product performance requirements are then reviewed. Details on product validation requirements and definitions of parameters related to the launch process are also provided. The chapter discusses the purpose of manufacturing control plan, along with an illustration of a manufacturing control plan outlined for a safety-critical suspension casting. It ends with an overview of the contents of a program launch manual.

This chapter provides an introduction to statistical process control and the concept of total quality management. It begins with a review of quality improvement efforts in the extrusion industry and the considerations involved in developing sampling plans and interpreting control charts. It then lays out the steps that would be followed in order to implement statistical testing for billet casting, die performance, or any other process or variable that impacts extrusion quality. The chapter concludes with an overview of the fundamentals of total quality management.

Failure analysis can sometimes involve considerations of statistics and probability. This chapter reviews some of the basic types of statistical distributions in order to understand some basic principles in their use. The main focus is on the uses of the normal distribution, which is the most commonly used statistical distribution. The chapter also includes a section discussing the reliability and probability of passing.

This chapter reviews the tests and procedures used for measuring hardness of plastics and elastomers. The conventional testing methods (Rockwell, Vickers, Brinell, and Knoop) used for testing of metals are based on the idea that hardness represents the resistance against permanent plastic deformation of the material to be tested. However, elastic deformation must be considered in hardness measurement of elastomers. This chapter discusses the equipment and processes involved in the durometer (Shore) test, the International Rubber Hardness Degree test, and other specialized tests. It presents the criteria that can be used to select a suitable hardness testing method for elastomers or plastics and describes processes involved in specimen preparation and equipment calibration.

The casting engineer contributes to a successful component design by offering expertise in molding, core making, and material characteristics and by recommending the most suitable casting process to use to meet quality and cost targets. The casting engineer's responsibilities include recommending locator positioning; advising about lugs, hooks, or holes for casting handling through all processes; determining the choice of a parting plane and pouring orientation; designing cores for accurate positioning, suitable venting, and proper cleaning; guiding decisions about wall thicknesses and junctions; making suggestions about casting design to eliminate distortion; optimizing the gating design for slag-free metal; and establishing the feeding techniques to eliminate shrink porosity. This chapter provides the guidelines for these responsibilities. In addition, the guidelines for the use of chaplets and chills in cast iron castings; guidelines for drafts, machine stock, tolerances, and contraction or shrink rule; and guidelines for pattern layouts and nesting are also covered.

The need for precise targeted interactive surgery on boards or modules is the main driver of backside preparation technology. This article assists the analyst in making decisions on backside thinning and polishing requirements. Thinning of the substrates can be accomplished by flat lapping, laser assisted chemical etch, plasma reactive ion etch, and CNC based milling and polishing. The article discusses the general characteristics, key principles, advantages, and disadvantages of these processes. It also contains case studies that illustrate the application of these processes to ceramic cavity devices, injection molded parts, and ball grid arrays.

This chapter provides an overview of how the disciplines of design, material, and manufacturing contribute to engineering for functional performance. It describes the interaction of product designers and casting engineers in product development. It discusses the consequences of component failure, uncertainty in data and assumptions, and selection of the factor of safety. The chapter also presents an overview of the functional requirements for product performance and provides an overview of product design development. It also presents a partial list of the different tests that are performed on prototypes and examples of product testing. The chapter describes the requirements of a traceability system.

This chapter presents a step-by-step approach for analyzing the causes of nonconforming workpieces and determining potential solutions. The discussion covers a wide range of issues, including testing errors, latent and process-related defects, examination and testing techniques, defect characterization, and effective remedial actions.

This appendix is a compilation of terms, definitions, abbreviations, and symbols associated with the mechanics and mechanisms of fracture.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

This chapter surveys both basic quality and basic reliability concepts as an introduction to the failure analysis professional. It begins with a section describing the distinction between quality and reliability and moves on to provide an overview of the concept of experiment design along with an example. The chapter then discusses the purposes of reliability engineering and introduces four basic statistical distribution functions useful in reliability engineering, namely normal, lognormal, exponential, and Weibull. It also provides information on three fundamental acceleration models used by reliability engineers: Arrhenius, Eyring, and power law models. The chapter concludes with information on failure rates and mechanisms and the two techniques for uncovering reliability issues, namely burn-in and outlier screening.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This chapter provides an overview of key elements in controlling the casting process, systems to confirm the quality of outgoing components, and the steps needed to launch a novel product. The discussion also provides information on process control tools and techniques; incoming material control; process control of sand preparation and system maintenance; metallic charge materials; product quality control; and melting, metallurgical, and mechanical testing.

Diagnosing the root cause of a failure is particularly challenging if the symptom of the failure is not consistently observable. This article focuses on Laser Assisted Device Alteration/Soft Defect Localization (LADA/SDL), a global fault isolation technique, for detecting such failures. The discussion begins with a section describing the three steps in LADA/SDL analysis setup: create the test loop with the fail flag and loop trigger, select the laser dwell time, and select the shmoo bias point. An overview of LADA/SDL workflow is then presented followed by a brief section on time-resolved LADA. The closing pages of the article consider in detail SDL laser interaction physics and LADA laser interaction physics.