Search Results for analysi

This article introduces procedures an engineer or materials scientist can use to investigate failures. It provides a brief survey of polymer systems and key properties that need to be measured during failure analysis. The article begins with an overview of the problem-solving approach pertinent to structure analysis. This is followed by a review of the characterization of plastics by infrared and nuclear magnetic resonance spectroscopy. The article then provides information on the distribution of molecular weight of an engineering plastic. It further discusses the methods used in thermal analysis, namely differential thermal analysis, thermogravimetric analysis, thermal-mechanical analysis, and dynamic mechanical analysis. The following sections provide details on X-ray diffraction for analyzing crystalline phases and on a minimal scheme for polymer analysis and characterization to assist the design engineer. The article ends with a discussion on the thermal-analytical scheme for analyzing the milligram quantities of polymer samples.

This article covers common techniques for surface characterization, including the modern scanning electron microscopy and methods for the chemical characterization of surfaces by Auger electron spectroscopy, X-ray photoelectron spectroscopy, and time-of-flight secondary ion mass spectrometry. The principles of surface analysis and some of the applications of the technique in polymer failure studies are also provided.

A product pedigree describes its design and how it was built and shows that it was built in accordance with the drawings and other documentation defining the product configuration. Evaluating the pedigree of a failed product can help to rule in or rule out hypothesized failure causes. This chapter describes various areas that can be examined by the failure analysis team to assess the pedigree of the failed system. If the failure analysis team suspects product pedigree anomalies it should confirm conformance through independent means.

This chapter targets areas that determine if a change occurred and if the change induced the failure: change or what's different analysis. It describes the different sources of changes that induce process deficiencies: design, process, test and inspection, environmental, supplier lot, aging, and supplier changes. The chapter presents an example of a cluster bomb failure to explain how the failure analysis team found and corrected the failure cause.

In some cases, the failure analysis team finds that all components meet their requirements, the system was properly assembled, and it was not operated or tested in an out-of-specification manner, yet it still failed. When this occurs, the only conclusion the failure analysis team can reach is that it missed something in its analysis or that the design is defective. This chapter focuses on the latter possibility by discussing the various factors that a failure analysis team should consider to identify the causes of defects in system design. These include requirements identification and verification, circuit performance, mechanical failures, materials compatibility, and environmental factors. Examples that illustrate the value of design analysis are also presented.

This chapter explains how to take the known facts of a specific failure, place them in a systematic context to arrive at a logical conclusion, and point to a corrective measure. It presents example examinations to describe a systematic approach to failure examination.

This chapter discusses some of the challenges associated with the analysis of composite structures. It begins with a review of lamina fundamentals and the stress-strain relationships in a single ply under various types of loads. It demonstrates the use of classical lamination theory, discusses the effects of interlaminar free-edge stresses, and explains how to predict the failure of composites using stress and strain criteria as well as the Azzi-Tsai-Hill maximum work theory and the Tsai-Wu failure criterion.

Weldment failures may be divided into two classes: those identified during inspection and mechanical testing and those discovered in service. Failures in service arise from fracture, wear, corrosion, or deformation. In this article, major attention is directed toward the analysis of service failures. The discussion covers various factors that may lead to the failure of arc welds, electroslag welds, electrogas welds, resistance welds, flash welds, upset butt welds, friction welds, electron beam welds, and laser beam welds.

Fault-tree analysis is a graphical technique that identifies all events and combinations of events that can produce an undesired event. This chapter emphasizes several fault-tree analysis concepts, examining with examples how all three categories of charting symbols (events, gates, and transfer symbols) come together to generate a fault-tree analysis.

Failure analysis is a systematic investigative procedure using the scientific method to identify the causes of a failure. This chapter begins by exploring what failure analysis is followed by a section describing the sequence of stages in the investigation and analysis of failure and the three principles that must be carefully followed during the analysis. It then provides information on the normal location of fracture and concludes with a list of questions to ask about fractures.

This article addresses the ancillary issues regarding the nanoprobing and characterization of transistors, probing copper metallization layers, and the various imaging techniques. The discussion includes several characterization examples of known transistor failure types, namely four probe transistor characterization, two probe transistor characterization, and probing and characterizing metallization issues. The imaging techniques discussed are those that are specific to atomic force nanoprober or scanning electron microscope based tools. They are current contrast imaging, scanning capacitance imaging, e-beam absorbed current imaging, e-beam induced current imaging, e-beam induced resistance change imaging, and active voltage contrast imaging.

Electronics spans a number of devices, their configurations, and properties. A challenge is to identify those electronic subjects essential for failure analysis. This article reviews the normal operation and terminal characteristics of MOSFET. It describes the electronic behavior of bridges, opens, and parametric delay defects, which is essential for understanding the symptoms of a failing IC. These electronic principles are then applied to a CMOS failure analysis technique using a power supply signature analysis.

This chapters discusses the basic steps in the failure analysis process. It covers examination procedures, selection and preservation of fracture surfaces, macro and microfractography, metallographic analysis, mechanical testing, chemical analysis, and simulated service testing.

This chapter discusses the basic steps of a failure investigation. It explains that the first step is to gather and document information about the failed component and its operating history. It advises investigators to visit the failure site as soon as possible to record damages and collect test specimens for subsequent examination and chemical analysis. It also discusses the role of mechanical property testing, the use of nondestructive evaluation, and the final step of generating a report.

This chapter discusses the role of failure analysis in cases involving product liability, property damage, and personal injury litigation. It also explains how material science and technology shed light on criminal activities such as smuggling, counterfeiting, theft, and the willful destruction of property.

This chapter discusses some of the ways that the lessons learned from failures have benefitted society, leading to improved product designs, better materials, safer industrial processes, and more robust codes and standards. It also provides several examples of how the technology and procedures associated with aviation security have been upgraded in the wake of air disasters.

Analyzing the structure of composite materials is essential for understanding how the part will perform in service. Assessing fiber volume variations, void content, ply orientation variability, and foreign object inclusions helps in preventing degradation of composite performance. This chapter describes the optical microscopy and bright-field illumination techniques involved in analyzing ply terminations, prepreg plies, splices, and fiber orientation to provide the insight necessary for optimizing composite structure and performance.

Microstructural analysis of the composite matrix is necessary to understand the performance of the part and its long-term durability. This chapter focuses on the microstructural analysis of engineering thermoplastic-matrix composites and the influence of cooling rate and nucleation on the formation of spherulites in high-temperature thermoplastic-matrix carbon-fiber-reinforced composites. It also describes the microstructural analysis of a bio-based thermosetting-matrix natural fiber composite system.