Search Results for amp

In the Semiconductor I/C industry, it has been well documented that the proportion of factory and customer field returns attributed to device damage resulting from electrical over-stress (EOS) and electro-static discharge (ESD) can amount to 40 to 50%. This study entailed EOS and ESD simulation using a variety of models, namely the Human Body Model (HBM), the Charged Device Model (CDM) and the so-called Machine Model (MM), and then conducting electrical and physical failure analysis and comparing the results with documented analyses performed on customer field returns and factory failures. It is shown that a distinction can be made between EOS and ESD failures and between the characteristic failure signatures produced by the ESD models. The CDM physical failure location is at the input buffer and in the gate oxide, where as both HBM and MM failures occur mostly in the contacts at the input protection structures.

Nickel and nickel-base alloys are specified for many applications, such as oil and gas production, power generation, and chemical processing, because of their resistance to stress-corrosion cracking (SCC). Under certain conditions, however, SCC can be a concern. This chapter describes the types of environments and stress loads where nickel-base alloys are most susceptible to SCC. It begins with a review of the physical metallurgy of nickel alloys, focusing on the role of carbides and intermetallic phases. It then explains how SCC occurs in the presence of halides (such as chlorides, bromides, iodides, and fluorides), sulfur-bearing compounds (such as H2S and sulfur-oxyanions), high-temperature and supercritical water, and caustics (such as NaOH), while accounting for temperature, composition, microstructure, properties, environmental contaminants, and other factors. The chapter also discusses the effects of hydrogen embrittlement and provides information on test methods.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This chapter presents an overview of microprocessor and application specific integrated circuit (IC) testing. It begins with a description of key industry trends that will impact how ICs will be tested in the future. Next, it provides a brief description of the most common tests applied in the IC industry, where technical issues that are causing methodology changes are emphasized. These include functional testing, structural testing, scan-based delay testing, built-in self-testing, memory testing, analog circuit testing, system-on-a-chip testing, and reliability testing. Trends discussed have driven the development of novel focus areas in test and the chapter discusses several of those areas, including test data volume containment, test power containment, and novel methods of defect-based test.

This article describes the most common, general-purpose analog design-for-test (DFT) methods, analog test buses and loopback, and shows their advantages and limitations in diagnosability and automatability. It also describes DFT and built-in self-test (BIST) techniques for the most common analog functions, namely phase-locked loop, serializer-deserializer, analog/digital converters, and radio frequency. Lastly, the challenges of creating BIST for analog functions are summarized, along with seven principles that must be exploited to meet these challenges. These principles show how the design constraints for analog BIST circuitry can be more relaxed than for the circuit under test, while delivering the required test accuracy and speed.

This chapter provides a basis for understanding the influence of stainless steel alloy composition and metallurgy on the welding process, which involves complex dynamics associated with melting, refining, and thermal processing. It begins with an overview of the welding characteristics of the categories of stainless steels, namely austenitic, duplex, ferritic, martensitic, and precipitation-hardening stainless steels. This is followed by a discussion of the selection criteria for materials to be welded. Various welding processes used with stainless steel are then described. The chapter ends with a section on some of the practices to ensure safety and weld quality.

This chapter describes the methods and equipment applicable to metallographic studies and discusses the preparation of specimens for examination by light optical microscopy. Five major operations for preparation of metallographic specimens are discussed: sectioning, mounting, grinding, polishing, and etching. The discussion covers their basic principles, advantages, types, and applications, as well as the equipment setup. The chapter includes tables that list etchants used for microscopic examination. It also provides information on microscopic examination, microphotography, and the effects of grain size on the structural properties of the material.

Post-mortem analysis of photovoltaic modules that have degraded performance is essential for improving the long term durability of solar energy. This article focuses on a general procedure for analyzing a failed module. The procedure includes electrical characterization followed by thermal imaging such as forward bias, reverse bias, and lock-in, and emission imaging such as electroluminescence and photoluminescence imaging.

Induction heating is a rapid, efficient technique for producing localized or through heating in a wide range of industries. The economics as well as the technical feasibility of induction heating should be important considerations prior to investing in such a system. A number of cost elements enter into the analysis. These include equipment and energy costs, production lot size and ease of automation, material savings, labor costs, and maintenance requirements. This chapter discusses each of these factors. It compares the cost elements of induction heating with those of its main competitor, gas-fired furnace heating. Several typical examples are provided to illustrate the economic considerations in design and application of induction heating processes.

This appendix is a glossary of terms related to induction heat treating.

This chapter discusses the functions of surface treatments important for stainless steel, namely the removal of oxide scale and cleaning, brightening, and coloring of the stainless surface. Details on the main methods of producing aesthetic surface finishes are also provided.

This chapter covers the practical aspects of machining, particularly for turning, milling, drilling, and grinding operations. It begins with a discussion on machinability and its impact on quality and cost. It then describes the dimensional and surface finish tolerances that can be achieved through conventional machining methods, the mechanics of chip formation, the factors that affect tool wear, the selection and use of cutting fluids, and the determination of machining parameters based on force and power requirements. It also includes information on nontraditional machining processes such as electrical discharge, abrasive jet, and hydrodynamic machining, laser and electron beam machining, ultrasonic impact grinding, and electrical discharge wire cutting.

This appendix includes a temperature conversion table, a table containing equivalent hardness numbers, and a unit conversion table.

This chapter discusses the melting and conversion of superalloys and the solidification challenges they present. Superalloys have high solute content which can lead to untreatable defects if they solidify too slowly. These defects, called freckles, are highly detrimental to fatigue life. The chapter explains how and why freckles form as well as how they can be prevented. It describes the criteria for selecting the proper melting method for specific alloys based on melt segregation and chemistry requirements. It compares standard processes, including electric arc furnace/argon oxygen decarburization melting, vacuum induction melting, vacuum arc remelting, and electroslag remelting. It also addresses related issues such as consumable remelt quality, control anomalies, melt pool characteristics, and melt-related defects, and includes a section that discusses the processes involved in converting cast ingots into mill products.

High-pressure cold spray repair process has been used on a number of different applications in the defense industry. This chapter describes various applications for cold spray systems that have operating pressures greater than 2.4 MPa (350 psi) and operating temperatures greater than 500 deg C (930 deg F).

Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.

This chapter addresses in-service monitoring and corrosion testing of weldments. Three categories of corrosion monitoring are discussed: direct testing of coupons, electrochemical techniques, and nondestructive testing techniques. The majority of the test methods for evaluating corrosion of weldments are used to assess intergranular corrosion of stainless steels and high-nickel alloys. Other applicable tests evaluate pitting and crevice corrosion, stress-corrosion cracking, and microbiologically influenced corrosion. Each of these test methods is reviewed in this chapter.

This chapter addresses the implications for increased aluminum usage on major issues such as climate change and solid waste management. The chapter also considers three approaches for decarbonizing aluminum-product production.