High-pressure cold spray repair process has been used on a number of different applications in the defense industry. This chapter describes various applications for cold spray systems that have operating pressures greater than 2.4 MPa (350 psi) and operating temperatures greater than 500 deg C (930 deg F).

This chapter elucidates the indispensable role of characterization in the development of cold-sprayed coatings and illustrates some of the common processes used during coatings development. Emphasis is placed on the advanced microstructural characterization techniques that are used in high-pressure cold spray coating characterization, including residual-stress characterization. The chapter includes some preliminary screening of tool hardness and bond adhesion strength, as well as a distinction between surface and bulk characterization techniques and their importance for cold spray coatings. The techniques covered are optical microscopy, X-Ray diffraction, scanning electron microscopy, focused ion beam machining, electron probe microanalysis, transmission electron microscopy, and electron backscattered diffraction. The techniques also include electron channeling contrast imaging, X-Ray photoelectron spectroscopy, X-ray fluorescence, Auger electron spectroscopy, Raman spectroscopy, oxygen analysis, and nanoindentation.

This chapter focuses on high-pressure cold spray applications pertaining to repair and refurbishment in the aerospace, oil and gas, and power-generation industries, the last specifically involving repair of gas turbine components. Advantages of cold spray coating in the repair and refurbishment of structural engineering components are also discussed.

This chapter explains how to join beryllium parts using adhesive bonding and mechanical fastening techniques and discusses the advantages and disadvantages of each method. It describes the stresses that need to be considered when designing adhesive bonds, the benefits and limitations of different adhesives, and surface preparation requirements. It explains how adhesives are applied and cured and how curing times and temperatures affect bonding strength. It also discusses the use of bolts and rivets and the different types of joints that can be made with them.

Adhesive bonding is a widely used industrial joining process in which a polymeric material is used to join two separate pieces (the adherends or substrates). This chapter begins with a discussion on the advantages and disadvantages of adhesive bonding, followed by a section providing information on the theory of adhesion. The chapter then describes the considerations for designing adhesively bonded joints and for testing or characterizing adhesive materials. The following section covers the characteristics of the most important synthetic adhesive systems and five groups of adhesives, namely structural, hot melt, pressure sensitive, water based, and ultraviolet and electron beam cured. The chapter ends with a discussion on some general guidelines for adhesive bonding and the basic steps in the adhesive bonding process.

This chapter discusses the use of mechanical fastening and adhesive bonding, the primary methods for joining polymer matrix composites. It describes and analyzes the basic types of mechanically fastened joints, including single-hole and multirow bolted composite joints. It then reviews the advantages and disadvantages of adhesively bonded joints and compares and contrasts the long-term performance of various joint designs. The chapter also discusses the merits of stepped-lap and bonded-bolted joints.

This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures.

This chapter discusses composite testing procedures, including tension, compression, shear, flexure, and fracture toughness testing as well as adhesive shear, peel, and honeycomb flatwise tension testing. It also discusses specimen preparation, environmental conditioning, and data analysis.