This chapter discusses the properties and applications of beryllium intermetallic compounds. It describes the crystal structure of key beryllides, the metals they contain, and important properties such as high-temperature strength, thermal conductivity and expansion, oxidation resistance, and density. It explains how beryllide intermetallics are formed using sputter deposition, diffusion, and powder metal methods.

This chapter provides a brief overview of phase diagrams, explaining what they represent and how and why they are used. It identifies key points, lines, and features on a binary nickel-copper phase diagram and explains what they mean from a practical perspective. It also discusses the concept of equilibrium, the significance of Gibb’s phase rule, the theorem of Le Chatelier, and the use of the lever rule.

Containment materials used in power generating applications are subject to molten salt corrosion. This chapter reviews the data relevant to corrosion problems in molten salt environments. It describes the corrosion behavior of steel, aluminum, nickel, and titanium alloys in molten chlorides, molten nitrates, molten fluorides, molten carbonates, and molten sodium hydroxide.

This chapter discusses joining atmospheres that are used for brazing, along with their advantages and disadvantages. It discusses the processes, advantages, and disadvantages of chemical fluxing, self-fluxing, and fluxless brazing. Information on stop-off compounds that are considered as the antithesis of fluxes is also provided.

This chapter presents several materials and processes related to soldering technology. It first provides information on lead-free solders, followed by sections devoted to flip-chip processes, diffusion soldering, and modeling. Scanning acoustic microscopy and fine-focus x-ray techniques are also discussed. The chapter describes several evaluation procedures and tests developed to measure solderability and standards for process calibration. The chapter also describes the characteristics of reinforced solders, amalgams used as solders, and other strategies to boost the strength of solders. Further, the chapter considers methods for quantifying the mechanical integrity of joints and predicting their dimensional stability under specified environmental conditions. It discusses the effects of rare earth elements on the properties of solders. The chapter concludes with information on advanced joint characterization techniques.

Specific heat and thermal expansion are closely related. Following a discussion on thermal expansion theory, methods of measurement techniques are presented along with their advantages and disadvantages. The results of the measurements are then summarized for three classes of materials: metallics, nonmetallics, and composites. Because predicting thermal expansion values for unmeasured or novel materials is useful, the chapter also describes the means of making educated guesses for low-temperature values. A short discussion on how thermal expansion data can be used is followed by a section describing where such data can be found.

This appendix provides supplemental information on the metallurgical aspects of atomic structure, the use of dislocation theory, heat treatment processes and procedures, important engineering materials and strengthening mechanisms, and the nature of elastic, plastic, and creep strain components. It also provides information on mechanical property and fatigue testing, the use of hysteresis energy to analyze fatigue, a procedure for inverting equations to solve for dependent variables, and a method for dealing with the statistical nature of failure.