Search Results for acknowledgment

This article is a compilation of terms and definitions related to failure analysis that have been addressed in the proceedings of the International Symposium for Testing and Failure Analysis.

Abradable coatings (such as Ni-4Cr-4Al/bentonite) are used throughout jet engines, primarily as sacrificial coatings into which moving components wear. This article presents the Accepted Practice for sample preparation of abradable coatings for metallographic analysis, based on round robin testing by several laboratories.

A fluidized-bed furnace system can be used for the gas nitriding process. This chapter focuses on fluidized-bed nitriding. It discusses the methods of heating a fluidized bed. The heating system can be electrical or gas, and internal or external. The chapter describes nitriding and oxynitriding processes in the fluidized-bed furnace. It also explains how to operate the fluid bed for nitriding. The chapter provides a discussion on the measurement of the gas dissociation.

This appendix explains how to calculate atomic packing factors, lattice parameters, and coordination numbers for cubic crystal structures, including simple, body-centered, and face-centered cubic systems. It also addresses hexagonal close-packed systems.

This article addresses critical aspects in bond testing of thermal spray coatings and provides step-by-step guidance for obtaining representative and reproducible test results based on ASTM C633 and other applicable industry standards. It clarifies details of ASTM C633 requirements and provides examples of the best practice confirmed by hundreds of tests performed worldwide, adopted by numerous industrial standards, and requested to comply with international technical standardization and certification organizations such ISO, AS, SAE, and Nadcap.

Transistors are the most important active structure of any semiconductor component. Performance characteristics of such devices within the specifications are key to ensuring proper functionality and long-term reliability of the product. In this article, a summary of the semiconductor technology from design to manufacturing and the characterization methods are discussed. The focus is on two prominent MOS structures: planar MOS device and FinFET device. The article covers the device parameters and device properties that determine the design criteria and the device tuning procedures. The discussion includes the effects of drain induced barrier lowering, velocity saturation, hot carrier degradation, and short channel on these devices.

Molybdenum thermal spray coatings are used in aerospace and other industries for wear resistance applications. Metallographic sample preparation of molybdenum coatings presents unique challenges. The purpose of the investigation described in this article is to determine Accepted Practices for sample preparation to better understand the process related microstructures of thermal spray molybdenum powders. The committee followed a round robin approach to assess metallographic sample preparation by a variety of laboratories. The article summarizes the results of the committee’s work.

This chapter provides a brief overview of monotectic alloy systems and reactions. It begins by presenting a monotectic phase diagram and identifying important points, lines, and regions. It then describes the monotectic reactions that occur in copper-lead systems and the associated solidification structures. It also discusses the morphology of the microstructure produced during directional solidification and the classification criteria of low- and high-dome alloys.

Carbonitriding is a modified form of gas carburizing. It is performed in a closed furnace chamber with an atmosphere enriched with a gaseous compound of carbon and nitrogen. This chapter provides information on the carbonitriding of steels, the applications of carbonitriding, the typical case depths, and the hardenability of carbonitrided parts. In addition, the chapter also discusses the processes involved in quenching, tempering, and distortion of carbonitrided steels.

This appendix contains sample problems with worked solutions pertaining to the use of binary phase diagrams. The problems require the determination of favorable temperatures and compositions, the amount and composition of phases in an alloy at a given temperature, the amount of a certain phase in different steels, and the microstructure developed in different alloys.

This chapter provides an introduction to various forms of corrosion, namely uniform corrosion, localized corrosion, mechanically assisted degradation, environmentally induced cracking, microbiologically influenced corrosion, and metallurgically influenced corrosion.

Cross-sectioning refers to the process of exposing the internal layers and printed devices below the surface by cleaving through the wafer. This article discusses in detail the steps involved in common cross-sectioning methods. These include sample preparation, scribing, indenting, and cleaving. The article also provides information on options for mounting, handling, and cleaning of samples during and after the cleaving process. The general procedures, tools required, and considerations that need to be taken into account to perform these techniques are considered.

Since the introduction of chip scale packages (CSPs) in the early 90s, they have continuously increased their market share due to their advantages of small form factor, cost effectiveness and PCB optimization. The reduced package size brings challenges in performing failure analysis. This article provides an overview of CSPs and their classification as well as their advantages and applications, and reveals some of the challenges in performing failure analysis on CSPs, particularly for CSPs in special package configurations such as stacked die multi-chip-packages (MCPs) and wafer level CSPs (WLCSPs). The discussion covers special requirements of CSPs such as precision decapsulation for fine ball grid array packages, accessing the failing die for MCP packages, and careful handling for WLCSP. Solutions and best practices are shared on how to overcome these challenges. The article also presents a few case studies to demonstrate how failure analysis work on CSPs can be successfully completed.

Gas-metal reactions can have a significant impact on metals and alloys, affecting their properties (during processing) and accelerating service failures, particularly in hot, corrosive environments. This chapter discusses the kinetics of gas-metal reactions and how they are driven by Gibbs energy changes. It plots the energy of formation for many important metal oxides and explains how to construct isothermal stability diagrams to analyze complex reactions involving metals, alloys, and gases containing more than one reactive component.

This article summarizes the results of work completed by the ASM Thermal Spray Society Advisory Committee to identify key research challenges and opportunities in the thermal spray field. It describes and prioritizes research priorities related to emerging process methods, thermal spray markets and applications, and process robustness, reliability, and economics.

Stainless steels and nickel-base alloys are recognized for their resistance to general corrosion and other categories of corrosion. This chapter examines the effects of specific alloying elements, metallurgical structure, and mechanical conditioning on the corrosion resistance of these alloys. Some categories of corrosion covered are pitting, crevice, intergranular, stress-corrosion cracking, general, and high-temperature corrosion.

This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

Cross-sectioning is a technique used for process development and reverse engineering. This article introduces novice analysts to the methods of cross-sectioning semiconductor devices and provides a refresher for the more experienced analysts. Topics covered include encapsulated (potted) device sectioning techniques, non-encapsulated device techniques, utilization of the focused ion beam (FIB) making a cross-section and/or enhancing a physically polished one. Delineation methods for revealing structures are also discussed. These can be chemical etchants, chemo-mechanical polishing, and ion milling, either in the FIB or in a dedicated ion mill.

The formation of defects in materials that have been fusion welded is a major concern in the design of welded assemblies. This article describes four types of defects that, in particular, have been the focus of much attention because of the magnitude of their impact on product quality. Colloquially, these four defect types are known as hot cracks, heat-affected zone microfissures, cold cracks, and lamellar tearing.