Fig. 11 Flow length versus wall thickness predicted by Diskflow mold-filling analysis. Material, unfilled PC; mold temperature, 82 °C (180 °F); melt temperature, 335 °C (635 °F); maximum injection pressure, 103.4 MPa (15 ksi) More

Fig. 12 In-mold cooling time versus wall thickness predicted from one-dimensional, transient mold cooling analysis Material Unfilled PC Thickness, mm 1.62–3.81 Thermal conductivity, W/m · K 0.270 Specific heat, W · s/kg · K 1791 Melt temperature, °C 300 Mold More

Fig. 16 Cooling time versus wall thickness. ABS, acrylonitrile-butadiene-styrene; PC, polycarbonate; M-PPO, modified polyphenylene oxide More

Fig. 22 Dimensions of a ring gear shape. Shape limitation: length/wall thickness, ≤1.5; inside diameter/outside diameter (ID/OD), >0.4. Minimum wall thickness (WT) is defined by: WT ≥ 2.25 × module + 0.4 × mod × L × OD 3 5 . Source: Ref 18 More

Fig. 36 Axle wall thickness, discolored region dimensions, and fracture location More

Fig. 3.2 Microstructure of alloy AlSi7Mg, sand mold. (a, b) Wall thickness 3 cm. (c, d) Wall thickness 1 cm. Light microscopy (LM), etch. 1HF(1). Source: Ref 3 More

Fig. 3.3 Microstructure of alloy AlSi7Mg, sand mold, wall thickness 3 cm. (a–e) Silicon in the interdendritic eutectic. (f) Enlarged microregion visible in (e), showing silicon lamellae in the interdendritic eutectic. Scanning electron microscopy (SEM), deep etch More

Fig. 3.5 Microstructure of alloy AlSi7Mg, metal mold, wall thickness 2 cm. (a–f) Silicon in the interdendritic eutectic, lamellae and rods of eutectic silicon. (e) Enlarged microregion visible in (d). SEM, deep etch More

Fig. 3.6 Microstructure of alloy AlSi7Mg, metal mold, wall thickness 1 cm. (a–f) Silicon in the interdendritic eutectic, lamellae and rods of eutectic silicon particles. SEM, deep etch More

Fig. 3.12 Microstructure of alloy AlSi10Mg, sand mold. (a, b) Wall thickness 3 cm. (c, d) Wall thickness 1 cm. LM, etch. 1HF(1). Source: Ref 3 More

Fig. 3.18 Microstructure of alloy AlSi11, sand mold, wall thickness 3 cm. (a–e) Silicon in the interdendritic eutectic, eutectic silicon lamellae. (f) Hypereutectic silicon precipitate, eutectic silicon lamellae. SEM, deep etch More

Fig. 3.20 Microstructure of alloy AlSi11, metal mold, wall thickness 2 cm. (a–f) Silicon in the interdendritic eutectic, lamellae of eutectic silicon. SEM, deep etch More

Fig. 3.21 Microstructure of alloy AlSi11, metal mold, wall thickness 1 cm. (a–f) Silicon in the interdendritic eutectic, lamellae and rods of eutectic silicon. SEM, deep etch More

Fig. 8.24 Comparison of predicted and measured wall thickness. FE, finite-element More

Fig. 9.14 Tube wall thickness distribution on the middle cross section (A-B) of a 90° bend. Source: Ref 9.15 More

Fig. 9.4 Relationship between manganese-silicon and wall thickness. Source: Ref 1 More

Fig. 9.18 Relationship between pouring temperature and wall thickness. Source: Ref 5 More

Fig. 12.42 Minimum wall thickness of steel castings recommended. Source: Ref 4 More

Fig. 6.28 Welding speed as a function of wall thickness and input power for fabrication of 25-mm- (1-in.-) diam steel tubing. For other outer diameters, the welding speed should be multiplied by the correction factor given in the inset. For other metals, the speed should be multiplied by 1.4 More

Figure 9.14: Change in wall thickness in tube sinking with 15% reduction in diameter, in dies with 9° half angle. More