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Published: 01 August 1999
Fig. 16 Filiform attack in a nitrocellulose-coated aluminum foil laminated to paperboard showing a tendency to follow both the gravure imprint and the rolling direction of the sheet. Light microscopy. 75× More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610377
EISBN: 978-1-62708-303-4
..., damage tolerance, and testing and certification. composite laminates continuous carbon-fiber composites continuous-fiber polymer-matrix composites damage tolerance fatigue failure mechanisms A COMPOSITE MATERIAL can be defined as a combination of two or more materials that results...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2004
DOI: 10.31399/asm.tb.tt2.t51060183
EISBN: 978-1-62708-355-3
... Abstract This chapter presents the fundamentals of tensile testing of fiber-reinforced polymer composites. Basic tensile testing of polymer composites is divided into lamina and laminate testing. The chapter focuses on tensile testing of laminates. It discusses the most common tensile test...
Book Chapter

By M. B. Kasen
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860413
EISBN: 978-1-62708-348-5
... laminate composites. This is followed by a section providing an overview of the materials in modern cryogenic technology. Then, the chapter describes the effect of cryogenic temperatures on materials properties; it also introduces the various joining techniques developed for composite materials...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.t69540319
EISBN: 978-1-62708-309-6
... Abstract This chapter discusses the failure mechanisms associated with fiber-reinforced composites. It begins with a review of fiber-matrix systems and the stress-strain response of unidirectional lamina and both notched and unnotched composite laminate specimens. It then explains how cyclic...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.t52860095
EISBN: 978-1-62708-338-6
... characteristics of composites. This chapter describes suitable static mechanical test techniques for characterizing laminated composite materials. The approach is to provide recommended techniques, based on consensus opinions of fabricators and users of filament-wound composites, and to survey available...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870333
EISBN: 978-1-62708-314-0
... potential flaws and damage is shown in Fig. 12.1 . During ply collation, foreign objects are the most serious issue. These include the backing paper or plastic liner on the prepreg, lay-up materials such as release films and tapes, and tools such as knife blades. Since these can cause serious delaminations...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870001
EISBN: 978-1-62708-314-0
..., and orthotropic materials, the orientation of plies in unidirectional (lamina) and quasi-isotropic (laminate) lay-ups, and the dominant role of fibers in determining strength, stiffness, and other lamina properties. The chapter also compares the engineering attributes of composites with those of metals...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.tb.atia.t59340339
EISBN: 978-1-62708-427-7
... at acceptable cost. In addition to the barrier properties, aluminum foil has good corrosion resistance, is nontoxic, and can be easily laminated to paper, cardboard, or plastic to increase package strength and reduce cost. Figure 15.2 and Table 15.1 show the compositions of the major alloys used...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... Abstract The complexity of semiconductor chips and their packages has continuously challenged the known methods to analyze them. With larger laminates and the inclusion of multiple stacked die, methods to analyze modern semiconductor products are being pushed toward their limits to support...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870373
EISBN: 978-1-62708-314-0
.... For the same number of cycles to failure, Kevlar 49/epoxy composites can operate at a significantly larger percentage of their static strength than glass fiber composites. Fiber-dominated laminates of aramid composites exhibit very little creep. In general, creep strain increases with increasing...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870517
EISBN: 978-1-62708-314-0
.... Bolted repairs are usually done on thick, highly loaded composite laminates, whereas bonded repairs are often required for thin-skin honeycomb assemblies. Fig. 19.1 Typical composite repairs. Source: Ref 1 All repairs of composite or bonded aircraft assemblies should be conducted...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870119
EISBN: 978-1-62708-314-0
... and removing excess resin and entrapped air. The laminate is built up layer by layer until the required thickness is obtained. E-glass is the most prevalent material, but S-2 glass, carbon, or aramid can be used where the improved properties justify the higher costs. Heavy glass woven rovings (500 g/m 2 ) can...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780383
EISBN: 978-1-62708-281-5
... (polystyrene or polypropylene are common), glass containers, and even plain white typing paper are all acceptable ways of storing or shipping samples that will later be analyzed by one or more surface analysis methods. If tape must be used to secure samples during shipping, avoid using tapes that are laden...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050317
EISBN: 978-1-62708-311-9
... of the nonlaminate concentrators enhances early coil failure. Installation Installation depends upon the type of concentrating material that is used. Laminates of various shapes and thicknesses can be purchased to various sizes and shapes ( Ref 7 ). Laminates must be securely fastened to the coil...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050057
EISBN: 978-1-62708-311-9
..., which retain no magnetic fields on power turn-off, are used. The soft materials are machinable and formable. Three groups of magnetic materials are used for intensifiers: laminations, ferrite, and magnetodielectic materials. The formability and machinability can be important in the decision of which...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780164
EISBN: 978-1-62708-281-5
... Opposing cylinders 51 mm (2 in.) in diameter, 25 mm (1 in.) thick with edges rounded to 6.4 mm (0.25 in.) radius Flat sheets of paper, films, fabrics, rubber, molded plastics, laminates, boards, glass, mica, and ceramic 2 Opposing cylinders 25 mm (1 in.) in diameter, 25 mm (1 in.) thick with edges...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550385
EISBN: 978-1-62708-307-2
... exceeds the flatwise tensile (through-the-thickness) strength of the composite, the laminate will delaminate. Composites are susceptible to delaminations (ply separations) during fabrication, assembly, and in service. During fabrication, foreign materials, such as prepreg backing paper, can...
Book

Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.9781627083386
EISBN: 978-1-62708-338-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110016
EISBN: 978-1-62708-247-1
... be encountered during failure analysis on CSPs devices. In this paper, an overview of CSPs and their applications will be provided, and some challenges in performing failure analysis on CSPs will be revealed, particularly for CSPs in special package configurations such as stacked die Multi-Chip-Packages (MCP...