Several components from the tail boom of a helicopter were found fractured at a crash site, including gusset plates, the hat section near the lower yoke, and a cable that controls the pitch of the tail rotor. The components were recovered from the wreckage and taken to a lab for closer examination. Based on their observations and the results of SEM fractography, failure analysts concluded that the gusset plates failed due to a downward bending overload in tension and that the tail rotor control cable snapped due to tensile overload. There were no indications of delayed failure in any of the areas examined.

Joining comprises a large number of processes used to assemble individual parts into a larger, more complex component or assembly. The selection of an appropriate design to join parts is based on several considerations related to both the product and the joining process. Many product design departments now improve the ease with which products are assembled by using design for assembly (DFA) techniques, which seek to ensure ease of assembly by developing designs that are easy to assemble. This chapter discusses the general guidelines for DFA and concurrent engineering rules before examining the various joining processes, namely fusion welding, solid-state welding, brazing, soldering, mechanical fastening, and adhesive bonding. In addition, it provides information on several design considerations related to the joining process and selection of the appropriate process for joining.

Boiler tube failures associated with material defects are often the result of poor quality control, whether in primary production, on-site fabrication, storage and handling, or installation. This chapter examines quality-related failures stemming from compositional and structural defects, forming and welding defects, design defects, improper cleaning methods, and ineffective maintenance. It also includes case studies and illustrations.

Weldment failures may be divided into two classes: those identified during inspection and mechanical testing and those discovered in service. Failures in service arise from fracture, wear, corrosion, or deformation. In this article, major attention is directed toward the analysis of service failures. The discussion covers various factors that may lead to the failure of arc welds, electroslag welds, electrogas welds, resistance welds, flash welds, upset butt welds, friction welds, electron beam welds, and laser beam welds.

This chapter provides basic concepts and background for customer-related manufacturing processes applied to aluminum products including forming, joining and welding, surface treatments, and machinability. It reviews the selection criteria, key testing regimes, and original equipment manufacturer (OEM) requirements. The chapter also presents examples that demonstrate the importance of choosing the correct alloy and temper to successfully meet the OEM fabrication criteria.

Brazing and soldering jointly represent one of several methods for joining solid materials. This chapter summarizes the principal characteristics of the various joining methods. It then discusses key parameters of brazing including surface energy and tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials, new phase formations, significance of the joint gap, and the strength of metals. The chapter also describes issues in processing aspects that must be considered when designing a joint, and the health, safety, and environmental aspects of brazing.

The first step in die-level failure analysis is to narrow the search to a specific circuit or transistor group. Then begins the post-isolation process which entails further localizing the defect, determining its electrical, physical, and chemical properties, and examining its microstructure in order to identify the root cause of failure. This chapter assesses the tools and techniques used for those purposes and the challenges brought on by continued transistor scaling, advanced 3D packages, and new IC architectures. The areas covered include sample preparation, nanoprobing, microscopy, FIB circuit edit, and scanning probe microscopy.

This chapter considers the role of materials in brazing operations and the manner in which they impact on the choice of processing conditions and their optimization. The concepts covered are metallurgical and mechanical constraints, and constraints imposed by the components and their solutions as well as service environment considerations.

Soldering and brazing represent one of several types of methods for joining solid materials. These methods may be classified as mechanical fastening, adhesive bonding, soldering and brazing, welding, and solid-state joining. This chapter summarizes the principal characteristics of these joining methods. It presents a comparison between solders and brazes. Further details on pressure welding and diffusion bonding are also provided. Key parameters of soldering are discussed, including surface energy and surface tension, wetting and contact angle, fluid flow, filler spreading characteristics, surface roughness of components, dissolution of parent materials and intermetallic growth, significance of the joint gap, and the strength of metals. The chapter also examines the principal aspects related to the design and application of soldering processes.

This chapter assesses the benefits of using a solid immersion lens (SIL) to detect faults in ICs via optical imaging and laser-stimulation techniques. It discusses the advantages and limitations of different types of SILs and their effect on spatial resolution, spot size, focus depth, and collection efficiency. It also provides a brief overview of technical challenges at the die level.

This chapter considers the materials and processing aspects of soldering and the manner in which these interrelate in the development of joining processes. It discusses the processes involved in eliminating or suppressing metallurgical and mechanical constraints as well as constraints imposed by the components.

Root cause of failure in automotive electronics cannot be explained by the failure signatures of failed devices. Deeper investigations in these cases reveals that a superimposition of impact factors, which can never be represented by usual qualification testing, caused the failure. This article highlights some of the most frequent early life failure types in automotive applications. It describes some of the critical things to be considered while handling packages and printed circuit board layout. The article also provides information on failure anamnesis that shows how to use history, failure signatures, environmental conditions, regional failure occurrences, user profile issues, and more in the failure analysis process to improve root cause findings.

This chapter discusses the processes involved in the wetting, spreading, and chemical interaction of a braze on a nonmetal. The chapter reviews the key materials and process issues relating to the joining of nonmetals using active brazing. Emphasis is placed on the differences in brazing to metals by established methods. The chapter also describes the designing process and properties of metal/nonmetal joints.

Ceramics normally have high melting temperatures, excellent chemical stability and, due to the absence of conduction electrons, tend to be good electrical and thermal insulators. They are also inherently hard and brittle, and when loaded in tension, have almost no tolerance for flaws. This chapter describes the applications, properties, and behaviors of some of the more widely used structural ceramics, including alumina, aluminum titanate, silicon carbide, silicon nitride, zirconia, zirconia-toughened alumina (ZTA), magnesia-partially stabilized zirconia (Mg-PSZ), and yttria-tetragonal zirconia polycrystalline (Y-TZP). It also provides information on materials selection, design optimization, and joining methods, and covers every step of the ceramic production process.

Beryllium has been successfully joined by fusion welding, brazing, solid-state bonding, and soldering. This chapter describes these processes in detail along with their advantages and disadvantages. It also addresses application considerations such as surface preparation, joint design, and testing.

This chapter briefly outlines some of the basic aspects of failure analysis, describing some of the basic steps and major concerns in conducting a failure analysis. A brief review of failure types from fracture, distortion, wear-assisted failure, and environmentally assisted failure (corrosion) is also provided.