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J-integral testing

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780211
EISBN: 978-1-62708-281-5
... Abstract This article briefly describes the historical development of fracture resistance testing of polymers and reviews several test methods developed for determining the fracture toughness of polymeric materials. The discussion covers J-integral testing, the methods for determining linear...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860269
EISBN: 978-1-62708-348-5
... data are used with the design curves to evaluate the critical flaw size and to compare material toughnesses [Methods for Crack Opening Displacement ( COD) Testing , 19791. 8.3.2 J-Integral The J -integral developed by Rice (1968) is a characterization of the elastic–plastic field...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610101
EISBN: 978-1-62708-303-4
... with the steps involved in determining strain energy release rates, stress intensity factors, J-integrals, R-curves, and crack tip opening displacement parameters. It also covers fracture toughness testing methods and the effect of measurement variables. crack tip opening displacement elastic-plastic...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1989
DOI: 10.31399/asm.tb.dmlahtc.t60490021
EISBN: 978-1-62708-340-9
... by some fixed level of impact energy E 1 —e.g., the 20-J (15-ft·lb) transition temperature. The specific energy level is usually determined by correlations with other types of tests or service performance. Occasionally, it is defined by what can be expected from commercially available material. This fixed...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.t69540281
EISBN: 978-1-62708-309-6
... on time-dependent fracture mechanics. It also introduces two new fracture indices, the J-integral for handling large-scale yielding and the C*-integral for creep crack growth, providing close-form and handbook solutions for each. C*-integral creep crack growth rate J-integral nonlinear fracture...
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Published: 01 December 2003
Fig. 5 J -Integral and hysteresis energy (HE) vs. displacement ( D ) for a polycarbonate/polybutylene terephthalate blend. Test rate, 2 mm/min (0.08 in./min) J IC-HE and D C-HE are critical values of J and D for initation of crack propagation. Source: Ref 41 More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090021
EISBN: 978-1-62708-462-8
... also explains how time-domain and electro-optical terahertz pulse reflectometry are used to find shorts and opens in ICs and how challenges related to heterogenous integration may be met through design for testability (DFT) and built-in self-test (BIST) accommodations and the use of passive interposers...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... to acknowledge Brian Kessler for providing information related to embedded memory testing. References References [1] The International Technology Roadmap for Semiconductors , 2010 Edition. Semiconductor Industry Association . ( www.itrs.net ) [2] Hawkins C. and Soden J...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090003
EISBN: 978-1-62708-462-8
... (Cat. No.98CH36173) 129 – 136 ( 1998 ). 10.1109/RELPHY.1998.670462 . 5. Bruce M. , Bruce V. , Eppes D. , Wilcox J. , Cole E. , Tangyunyong P. , Hawkins C. , Soft Defect Localization (SDL) on ICs . in Proceedings of the International Symposium for Testing...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.9781627084628
EISBN: 978-1-62708-462-8
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
... Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging technologies...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... , pp. 424 – 428 . [3] Cardoso A. et al. , “ Development of Novel High Density System Integration Solutions in FOWLP - Complex and Thin Wafer-Level SiP and Wafer-Level 3D Packages ”, in Proc. ECTC , Orlando, FL, USA , 2017 , pp. 14 – 21 . 10.1109/ECTC.2017.163 [4] Colonna J...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
.... , Thayer M. , Pabbisetty S. , Shreeve R. , Ash B. , Serpiello J. , Huffman K. , Wagner L. , Kazmi S. , “ The SEMATECH Failure Analysis Roadmap ”, Proc Int’l Symp for Testing and Failure Analysis , 1995 , pp. 1 – 5 . [3] Vallet D.P. , “ IC Failure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2023
DOI: 10.31399/asm.tb.edfatr.t56090063
EISBN: 978-1-62708-462-8
.... , Analog and Mixed Signal Diagnosis Flow Using Fault Isolation Techniques and Simulation . in Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis. Event canceled . 91 – 99 ( 2020 ). 10.31399/asm.cp.istfa2020p0091 . 3. Sarson P. , Rearick J...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... A. , Capria E. , Cloetens P. , Da Silva J. , Jouve A. , Lhostis S. , Lorut F. , Mourier T. , Bleuet P. , High resolution X-ray computed tomography: what synchrotron sources can bring to 3Di devices failure analysis , 42nd International Symposium on Testing and Failure...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.t61280353
EISBN: 978-1-62708-267-9
... are infrequently generated. Superalloys: A Technical Guide, Second Edition Matthew J. Donachie and Stephen J. Donachie DOI: 10.31399/asm.tb.stg2.t61280353 Copyright © 2002 ASM International® All rights reserved. www.asminternational.org Appendix A Source Information Some Superalloy Information/Product Sources...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110101
EISBN: 978-1-62708-247-1
.... , Lewin D.W. , “ Fault Diagnosis of Digital systems – a review ,” Computer July/August 1971 . 10.1109/C-M.1971.216811 2. Waicukauski J. , Lindbloom E. , “ Failure Daignosis of Structured VLSI ,” IEEE Design & Test of Computers , August 1989 . 10.1109/54.32421 3...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
...) B ( r ) = ∫ ∫ ∫ τ J ( r ′ ) × ( r − r ′ ) ‖ r − r ′ ‖ 3 d 3 r ′ where B ( r ) is the magnetic field produced at point r by the current density distribution at location r ′, J ( r ′), integrated over the problem...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
... Administration under contract DE-NA0003525. References References [1] Elliott C. T. , Day D. , Wilson D. J. , “ An Integrating Detector for Serial Scan Thermal Imaging ”, Infrared Physics , Vol. 22 ( 1982 ). pp. 31 - 42 . 10.1016/0020-0891(82)90016-1 [2] Pote D. , Thome...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110244
EISBN: 978-1-62708-247-1
.... The subsequent section provides information on the use of Visible Laser Probing. The article closes with some common LVP observations/considerations and limitations and future work concerning LVP. frequency mapping integrated circuits laser voltage probing laser voltage tracing visible laser probing...