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J-integral

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Published: 01 August 2005
Fig. 6.1 Definition of the J-integral More
Image
Published: 01 December 1989
Fig. 2.14. Definition of the J-integral. More
Image
Published: 01 December 1989
Fig. 2.16. Interpretation of the J-integral ( Ref 53 ). More
Image
Published: 01 November 2012
Fig. 10 Definition of the J -integral. Source: Ref 5 More
Image
Published: 01 December 2003
Fig. 5 J -Integral and hysteresis energy (HE) vs. displacement ( D ) for a polycarbonate/polybutylene terephthalate blend. Test rate, 2 mm/min (0.08 in./min) J IC-HE and D C-HE are critical values of J and D for initation of crack propagation. Source: Ref 41 More
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.t69540281
EISBN: 978-1-62708-309-6
..., the other on time-dependent fracture mechanics. It also introduces two new fracture indices, the J-integral for handling large-scale yielding and the C*-integral for creep crack growth, providing close-form and handbook solutions for each. C*-integral creep crack growth rate J-integral nonlinear...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860269
EISBN: 978-1-62708-348-5
... factors contributing to the fracture behavior of materials at cryogenic temperatures. Three approaches of elastic-plastic fracture mechanics are covered, namely the crack opening displacement, the J-integral, and the R-curve methods. The chapter also discusses the influence of thermal and metallurgical...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610101
EISBN: 978-1-62708-303-4
... readers with the steps involved in determining strain energy release rates, stress intensity factors, J-integrals, R-curves, and crack tip opening displacement parameters. It also covers fracture toughness testing methods and the effect of measurement variables. crack tip opening displacement...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2003
DOI: 10.31399/asm.tb.cfap.t69780211
EISBN: 978-1-62708-281-5
...Abstract Abstract This article briefly describes the historical development of fracture resistance testing of polymers and reviews several test methods developed for determining the fracture toughness of polymeric materials. The discussion covers J-integral testing, the methods for determining...
Image
Published: 01 December 1989
Fig. 2.17. Procedure for experimental J Ic measurement based on energy interpretation of the J-integral (after Ref 54 ). More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1989
DOI: 10.31399/asm.tb.dmlahtc.t60490021
EISBN: 978-1-62708-340-9
...: σ y = 345 to 483 MPa    K Jd = 20(DVN) 1/2 Dynamic J-integral initiation    K Jc = 2.1(σ y CVN) 1/2 or (K Jc /σ y ) 2 = 4.41(CVN/σ y ) All loading rates with appropriate σ y Lawrence Livermore Laboratory:    (K Jc /E) 2 = CVN(9.66 + 0.04σ y ) K Jc = (EJ Ic ) 1/2 ; K Jc...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 May 2018
DOI: 10.31399/asm.tb.hma.t59250207
EISBN: 978-1-62708-287-7
.... The first integrated steel company to be affected by the new market with increasing imports was J&L. They sold an interest in the company in 1968 to a Texas conglomerate called Ling-Temco-Vought (LTV). It had no experience in owning steel mills. A few years later, LTV took over total ownership of J...
Image
Published: 01 September 2008
) Stress caused by the presence of an integral collar of considerable width. (h) Decrease in stress concentration that accompanies a decrease in collar width. (i) Stress flow at the junction of a bolt head and a shank. (j) Effect of a single sharp notch. (k) Effect of a continuous thread. (l) Effect More
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1989
DOI: 10.31399/asm.tb.dmlahtc.t60490059
EISBN: 978-1-62708-340-9
... − C 8 ) σ *     [ mixed rule  ( Ref  61 ) ] (Eq 3.36) σ = C 9 σ max + C 10 J 1 + C 11   J 2 1 / 2   [ Ref 62 ] where C 8 ,   C 9 ,   C 10     and  C...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460209
EISBN: 978-1-62708-285-3
... Process and Technology: Part I—Intellectual Property , J. Therm. Spray Technol. , Vol 17 ( No. 4 ), 2008 , p 495 – 516 10.1007/s11666-008-9203-3 8.11 Singh H. , Sidhu T.S. , and S. Kalsi B.S. , Cold Spray Technology: Future of Coating Deposition Processes , Fratt. Integr...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110563
EISBN: 978-1-62708-247-1
...Abstract Abstract This chapter discusses the various failure analysis techniques for microelectromechanical systems (MEMS), focusing on conventional semiconductor manufacturing processes and materials. The discussion begins with a section describing the advances in integration and packaging...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110634
EISBN: 978-1-62708-247-1
... to acknowledge Brian Kessler for providing information related to embedded memory testing. References References [1] The International Technology Roadmap for Semiconductors , 2010 Edition. Semiconductor Industry Association . ( www.itrs.net ) [2] Hawkins C. and Soden J...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 July 1997
DOI: 10.31399/asm.tb.wip.t65930163
EISBN: 978-1-62708-359-1
... to evaluate the intensity of the stress and strain field near the tip of the defect. The parameters that are most used are the crack tip stress intensity factor K , for linear elastic loading (LEFM), and the J -integral, or crack tip opening displacement (CTOD) for elastic-plastic loading (EPFM...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
.../adnd.1993.1013 [2] Colangelo J. , Microelectronic Failure Analysis Desk Reference , Fourth Edition , ASM International , 2002 . [3] Effects of x-ray irradiation on the channel hot-carrier reliability of thin-oxide re-channel MOSFETs ,” J. Y. C. Sunet al., Conf. Solid State Devices...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... of crack propagation in a thermally embrittled stainless steel. Source: Ref 14 , 15 The fracture toughness J -integral or stress intensity factor K of the material for crack initiation can be computed from the crack tip opening displacement, using the relations: J = σ 0 δ and K...