Large-scale yielding at the crack tip and time-dependent crack growth mechanisms, such as stress relaxation due to creep, are nonlinear behaviors requiring nonlinear analysis methods. This chapter presents two such methods, one based on elastic-plastic fracture mechanics, the other on time-dependent fracture mechanics. It also introduces two new fracture indices, the J-integral for handling large-scale yielding and the C*-integral for creep crack growth, providing close-form and handbook solutions for each.

This chapter reviews the concepts of fracture mechanics and their application to materials evaluation and the design of cryogenic structures. Emphasis is placed on an explanation of technology, a review of fracture mechanics testing methods, and a discussion on the many factors contributing to the fracture behavior of materials at cryogenic temperatures. Three approaches of elastic-plastic fracture mechanics are covered, namely the crack opening displacement, the J-integral, and the R-curve methods. The chapter also discusses the influence of thermal and metallurgical effects on toughness at low temperatures.

Fracture mechanics is the science of predicting the load-carrying capabilities of cracked structures based on a mathematical description of the stress field surrounding the crack. The fundamental ideas stem from the work of Griffith, who demonstrated that the strain energy released upon crack extension is the driving force for fracture in a cracked material under load. This chapter provides a summary of Griffith’s work and the subsequent development of linear elastic and elastic-plastic fracture mechanics. It includes detailed illustrations and examples, familiarizing readers with the steps involved in determining strain energy release rates, stress intensity factors, J-integrals, R-curves, and crack tip opening displacement parameters. It also covers fracture toughness testing methods and the effect of measurement variables.

This article briefly describes the historical development of fracture resistance testing of polymers and reviews several test methods developed for determining the fracture toughness of polymeric materials. The discussion covers J-integral testing, the methods for determining linear elastic fracture toughness, testing of thin sheets and films, normalization methods, and hysteresis methods.

The toughness of a material is its ability to absorb energy in the form of plastic deformation without fracturing. It is thus a measure of both strength and ductility. This chapter describes the fracture and toughness characteristics of metals and their effect on component lifetime and failure. It begins with a review of the ductile-to-brittle transition behavior of steel and the different ways to measure transition temperature. It then explains how to predict fracture loads using linear-elastic fracture mechanics and how toughness is affected by temperature and strain rate as well as grain size, inclusion content, and impurities. It also presents the theory and use of elastic-plastic fracture mechanics and discusses the causes, effects, and control of temper embrittlement in various types of steel.

This chapter is an account of the various events that led to the decline of the integrated steel industry during the 1950s. These include the steel strike of 1959, the improvements in technology and increase in imports since 1950s, widespread closures of steel companies, the decline of the minimill industry, and the rapid growth of Mittal Steel.

This chapter provides a detailed overview of the creep behavior of metals and how to account for it when determining the remaining service life of components. It begins with a review of creep curves, explaining how they are plotted and what they reveal about the operating history, damage mechanisms, and structural integrity of the test sample. In the sections that follow, it discusses the effects of stress and temperature on creep rate, the difference between diffusional and dislocation creep, and the use of time-temperature-stress parameters for data extrapolation. It explains how to deal with time dependent deformation in design, how to estimate cumulative damage under changing conditions, and how to assess the effect of multiaxial stress based on uniaxial test data. It also includes information on rupture ductility, creep fracture, and creep-crack growth and their effect on component life and performance.

Recent trends in electronic packaging, including the growing use of 3D designs and heterogeneous integration, are greatly adding to the complexity of isolating faults in semiconductor products. This chapter reviews the latest IC packaging and integration solutions and assesses the readiness level of fault isolation tools and techniques. It examines the capabilities, limitations, and optimization potential of x-ray tomography and magnetic field imaging, describes various approaches for optical fault isolation, and compares and contrasts pre-OFI sample preparation methods. The chapter also explains how time-domain and electro-optical terahertz pulse reflectometry are used to find shorts and opens in ICs and how challenges related to heterogenous integration may be met through design for testability (DFT) and built-in self-test (BIST) accommodations and the use of passive interposers.

This chapter assesses the capabilities and limitations of electric fault isolation (EFI) technology, the measurement challenges associated with new device architectures, and the pathways for improvement in emission microscopy, laser stimulation, and optical probing. It also assesses the factors that influence signal strength, spatial and timing resolution, and alignment accuracy between signal response images and the physical layout of the IC.

Depending on the operating environment and the nature of the applied loading, a structure can fail by a number of different modes, including brittle fracture, ductile fracture, plastic collapse, fatigue, creep, corrosion, and buckling. These failure modes can be broken down into the categories of fracture, fatigue, environmental cracking, and high-temperature creep. This article discusses each of these categories, as well as the benefits of a fitness-for-service approach.

This chapter discusses the application of high-pressure cold spray to the automotive industry field, with special attention to three applications: additive manufacturing, fabrication methods, and protective coatings. Various studies on the automotive application of cold spray are reviewed. The background and purpose of each application are presented and practical cases are discussed.

This chapter discusses some of the more advanced methods and procedures used in failure analysis, including in-service material sampling, in situ microstructure analysis, and a form of punch testing that can determine the fracture toughness of any material from a tiny specimen. The chapter also covers quantitative fractography, fracture surface topography analysis, and the use of oxide dating as well as fault tree and failure modes and effects analysis (FMEA) and computational techniques.