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H cross-section-type parts

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130087
EISBN: 978-1-62708-284-6
... layer revealed by the cross section. The inset shows a higher-magnification view of the seam detail. There is a rounded particle that is totally covered by a heavy, rounded oxide layer. The crack surface does not have blue or brown temper colors but was found to be a dark charcoal black. This type of...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310079
EISBN: 978-1-62708-326-3
... quench severity ( H -value), as shown in Fig. 6(d) . Fig. 6 Jominy hardenability curves of two steels with different hardenabilities and cross-sectional hardness curve for a 100 mm (4 in.) diameter quenched round bar of the same steel This process can be extended to develop the Jominy...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
.... Figure 16 Transmission electron images showing voiding in (a) second via interconnect (cross section) and (b) third metal layers (top view). In principle, a 1064 nm continuous laser incident on toggling scan chains would cause the flops to be stuck-at high [17] . Based on this phenomenon, the...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2012
DOI: 10.31399/asm.tb.lmub.t53550621
EISBN: 978-1-62708-307-2
... the development due to Ashby ( Ref 12.12 ), it is desired that the material for a solid cylindrical tie-rod of length L to carry a tensile force P with a safety factor S be of a minimum mass. The mass is given by: (Eq 12.3) m = A L ρ where A is the cross-sectional area, and ρ is...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110323
EISBN: 978-1-62708-247-1
... Signal Image Mapping (ESIM), and E-beam Device Perturbation (EDP) [1] . Both cross-section and plan view TEM samples can be prepared from backside silicon removed units with no impact on throughput or degradation in image quality. Large scale semiconductor manufacturing companies...
Series: ASM Technical Books
Publisher: ASM International
Published: 31 December 2020
DOI: 10.31399/asm.tb.phtbp.t59310127
EISBN: 978-1-62708-326-3
... at least 28 °C (50 °F) above the upper critical temperature. The general characteristics of each of these three major types of steel annealing are described in specific sections in this chapter, including the process of normalization, which is a process that refines or “normalizes” the microstructure...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720321
EISBN: 978-1-62708-305-8
... welded together in spots. Seams may be continuous or intermittent, as indicated in Fig. 2(h) . A micrograph of a typical seam is shown in Fig. 3 . Fig. 3 Micrograph of a seam in a cross-section of a 19 mm (¾ in.) diameter medium carbon steel bar showing oxide and decarburization in the seam. 350...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.pht2.t51440055
EISBN: 978-1-62708-262-4
... 4340 steel. Fig. 11 Single-chamber batch-type pressure-quench vacuum furnace. Source: Ref 8 The technology has also been developed for carburizing (see Chapter 8 ) in a partial vacuum. The cross section of a typical vacuum furnace used for carburizing is shown in Fig. 12 . Fig...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110153
EISBN: 978-1-62708-247-1
... subsequent sections. A request is received as follows: How much will it cost to thin a BGA flat to 30 µm +/-5 µm with a mirror polish finish to < 5 nm RMS roughness? These types of requests lead to a great deal of miscommunication and grief for all involved...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.scm.t52870119
EISBN: 978-1-62708-314-0
...-rate commercial process used primarily to make long fiberglass/polyester parts of constant cross section. Liquid molding includes resin transfer molding, vacuum-assisted resin transfer molding, and resin film infusion. These processes use a dry preform that is then injected with a liquid resin to...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110391
EISBN: 978-1-62708-247-1
... section can be whatever the analyst needs it to be. A cross-section done on any kind of polishing wheel is referred to a “polished section”. Cleaving is a type of sectioning done on brittle materials along one of its cleavage planes. Semiconductor wafers and bare dice can be cleaved but packaged...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110524
EISBN: 978-1-62708-247-1
... each type of sample are shown in figure 14 . Fig 14 Drawing of oxide VCSEL prepared by FIB for cross-sectioning (top) or plan-view imaging (bottom). Plan view image shows DLD network originating from the etch hole and traveling into emitting area. If a cross sectional view is appropriate...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
...) cross-sectioned, or by other means. At this point, the iterative nature of failure analysis takes over, and deprocessing and further fault isolation techniques are used in tandem to narrow the search area for a fault and eventually identify the point of failure. Should a defect be successfully...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110067
EISBN: 978-1-62708-247-1
... scanning the transducer over the entire X-Y sample area of interest (B), a C-scan image is obtained (C). The B-scan is often referred to as a “virtual cross-section”. Figure 5 shows that the B-scan is simply a grayscale representation of a series of A-scans plotted one after another ( Fig. 5(A...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... off until the desired layer at the area of interest (AOI). Figure 1 A die level image (National Semiconductor – NS16032) [4] Figure 2 A cross-sectioned image of a CMOS device Die delayering typically consists of different types of techniques, e.g. dry plasma etching, wet...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110613
EISBN: 978-1-62708-247-1
... technique using a power supply signature analysis. Figure 1 shows an n -channel transistor cross-section with heavily n + doped drain and source regions and a p -well. When the gate voltage ( V G ) is zero and the source and drain are grounded, only a few thermally generated free carriers...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110447
EISBN: 978-1-62708-247-1
... cross section is that the uniformity of the fluoride rich layer can be visualized. Further, one can see that the fluoride rich layer varies in thickness over different areas on bond pad: Three areas have been indicated and plotted that have a fluoride thickness of 3 (green), 42 (red) and > 70 nm...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110652
EISBN: 978-1-62708-247-1
... damage type, and location. The actual physical FA procedure will not be described here as this topic is addressed in other sections of this desk reference [5] . These failures can occur at anytime and are especially prevalent at burn-in. An EOS failure that...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... the standard approach. Even if frontside access is possible, there is a very important advantage of backside PE measurements over frontside results: The frontside result varies quantitatively from device to device. Figure 10 Schematic cross section of an IC with 5 metal layers and photon...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110666
EISBN: 978-1-62708-247-1
... because of limited margins. The Early Failure and Wearout Failure curves can be combined to give an indication of the total failure rate. The resulting curve thus has a shape similar to that of a bathtub viewed in cross section, and sums to represent the second (Stable Failure) phase of the curve...