Skip Nav Destination
Close Modal
Search Results for
Defects
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 925 Search Results for
Defects
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110209
EISBN: 978-1-62708-247-1
... Abstract Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock...
Abstract
Many defects generate excessive heat during operation; this is due to the power dissipation associated with the excess current flow at the defect site. There are several thermal detection techniques for failure analysis and this article focuses on infrared thermography with lock-in detection, which detects an object's temperature from its infrared emission based on blackbody radiation physics. The basic principles and the interpretation of the results are reviewed. Some typical results and a series of examples illustrating the application of this technique are also shown. Brief sections are devoted to the discussion on liquid-crystal imaging and fluorescent microthermal imaging technique for thermal detection.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2012
DOI: 10.31399/asm.tb.ffub.t53610585
EISBN: 978-1-62708-303-4
... Abstract This appendix provides detailed information on design deficiencies, material and manufacturing defects, and service-life anomalies. It covers ingot-related defects, forging and sheet forming imperfections, casting defects, heat treating defects, and weld discontinuities. It shows how...
Abstract
This appendix provides detailed information on design deficiencies, material and manufacturing defects, and service-life anomalies. It covers ingot-related defects, forging and sheet forming imperfections, casting defects, heat treating defects, and weld discontinuities. It shows how application life is affected by the severity of service conditions and discusses the consequences of using inappropriate materials.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.t55050175
EISBN: 978-1-62708-311-9
... Abstract This chapter explains how to recognize decarburization and related defects. It includes images showing how decarburization appears in various steels, discusses stock removal practices, and describes common defects and flaws such as quench cracks and where they are typically found...
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2021
DOI: 10.31399/asm.tb.ciktmse.t56020001
EISBN: 978-1-62708-389-8
... and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects...
Abstract
Alloying, heat treating, and work hardening are widely used to control material properties, and though they take different approaches, they all focus on imperfections of one type or other. This chapter provides readers with essential background on these material imperfections and their relevance in design and manufacturing. It begins with a review of compositional impurities, the physical arrangement of atoms in solid solution, and the factors that determine maximum solubility. It then describes different types of structural imperfections, including point, line, and planar defects, and how they respond to applied stresses and strains. The chapter makes extensive use of graphics to illustrate crystal lattice structures and related concepts such as vacancies and interstitial sites, ion migration, volume expansion, antisite defects, edge and screw dislocations, slip planes, twinning planes, and dislocation passage through precipitates. It also points out important structure-property correlations.
Image
in An Overview of Integrated Circuit Testing Methods[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 2 Photographs of two defects that behaved as “IDDQ-only” failures. (a) Extra polysilicon that shorted two input to a NOR gate. (b) Gate oxide short on the input of an XOR gate.
More
Image
in Non-destructive Techniques for Advanced Board Level Failure Analysis
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 6 Virtual cross section examples of package-level defects that are commonly imaged with 3D X-ray Microscopy tools [21] .
More
Image
Published: 01 November 2019
Figure 23 The left image of crystal defects is darkfield illuminated, the right image is brightfield. Light scattering objects show up well against the dark background.
More
Image
in X-Ray Imaging Tools for Electronic Device Failure Analysis[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 3 Virtual cross section examples of package-level defects that are commonly imaged with 3D X-ray Microscopy tools [13] .
More
Image
in Acoustic Microscopy of Semiconductor Packages
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 38 Flip chip images showing bump defects. (A) UHF PE-SAM image. Defective bumps have a “snowman” appearance (arrows). (B) SEM image of cross-sectioned bumps corresponding to the bumps outlined by the box in “A”. Arrows point to the same bumps in both “A” and “B”. The cross-section
More
Image
in 3D Hot-Spot Localization by Lock-in Thermography
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Figure 8 (A) Schematic of a two-die stacked device with thermal defects “A” and “B” at different die levels, (B) amplitude images of a defect at the upper die at the indicated frequencies extracted from the data of a 1 Hz LIT-TRTR measurement, and (C) related phase shift to frequency
More
Image
in Failure Analysis and Reliability of Optoelectronic Devices[1]
> Microelectronics Failure Analysis: Desk Reference
Published: 01 November 2019
Fig 22 Plan view EBIC shows a top view of a stripe after aging. Defects originate at cleaving cracks at the bottom, and travel up and to the left. Once the defects cross the stripe, they quickly cause catastrophic failure. A drawing of this laser is also shown in figure 4 (after [4] ).
More
Image
in Crystalline Imperfections and Plastic Deformation
> Elements of Metallurgy and Engineering Alloys
Published: 01 June 2008
Fig. 2.4 Foreign atom point defects. Source: Ref 1
More
Image
Published: 01 December 2015
Fig. 5 Optical micrographs showing defects on the inner surface of type 304 stainless steel pipe near weld root (a) and near through crack (b). Both 670×
More
Image
Published: 01 December 2015
Fig. 14 Magnetic flux leakage tool for detection and sizing of corrosion defects in a pipeline. Courtesy of PII
More
Image
in Steel Heat Treatment Failures due to Quenching
> Failure Analysis of Heat Treated Steel Components
Published: 01 September 2008
Fig. 34 View of the identified seam defects in a bar sample of AISI 4140. Unetched. Original magnification: 100×
More
Image
Published: 01 October 2011
Fig. 2.12 Point defects: A, interstitial atom; B, vacancy; C, foreign atom in lattice site
More
Image
in Failures Due to Lack of Quality Control or Improper Quality Control
> Failure Investigation of Boiler Tubes: A Comprehensive Approach
Published: 01 December 2018
Fig. 6.166 Microstructural defects in weld, (a) 200×, (b) 100×, (c) 200×. (d) Microstructure of the weld, 100×. (e) Microstructure of outer surface near weld, 200×. (f) Puncture contours showing corrosion damage, 200×
More
Image
Published: 01 January 2000
Fig. 6 Examples of common paint defects. (a) Sags. (b) Orange peel. (c) Wrinkling. (d) Checking. (e) Cracking. (f) Mudcracking. Table 2 provides a general description of these defects as well as their causes and remedies. Courtesy of J. Lederer, Department of the Navy, Port Hueneme, CA
More
Image
Published: 01 December 1984
Figure 2-7 Typically encountered compression molding defects and their causes and remedies (Courtesy of Buehler Ltd.) Bakelite and Diallyl Phthalate: DEFECT CAUSE REMEDY Radial Split Too large a section in the given mold area. Increase mold size. Sharp cornered
More
1