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Copper

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170457
EISBN: 978-1-62708-297-6
... Abstract This article discusses the composition, properties, and behaviors of copper and its alloys. It begins with an overview of the characteristics, applications, and commercial grades of wrought and cast copper. It then discusses the role of alloying, explaining how zinc, tin, aluminum...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.tb.hpcspa.t54460253
EISBN: 978-1-62708-285-3
... Abstract The Nuclear Waste Management Organization (NWMO) investigates approaches for managing Canada's used nuclear fuel. As part of a larger program investigating concepts of copper coatings, NWMO has begun exploring copper cold spray in collaboration with the National Research Council...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240469
EISBN: 978-1-62708-251-8
... Abstract Copper is often used in the unalloyed form because pure copper is more conductive than copper alloys. Alloying elements are added to optimize strength, ductility, and thermal stability, with little negative effect on other properties such as conductivity, fabricability, and corrosion...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2017
DOI: 10.31399/asm.tb.sccmpe2.t55090221
EISBN: 978-1-62708-266-2
... Abstract This chapter describes the conditions under which copper-base alloys are susceptible to stress-corrosion cracking (SCC) and some of the environmental factors, such as temperature, pH, and corrosion potential, that influence crack growth and time to failure. It explains that, although...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850533
EISBN: 978-1-62708-260-0
... Abstract This appendix lists copper-containing macroetchants that are used on iron and steel. iron macroetchants steel Metallography Principles and Practice George F. Vander Voort, p 533-535 DOI: 10.31399/asm.tb.mpp.t67850533 Copyright © 1999 ASM International® All rights reserved...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 April 2021
DOI: 10.31399/asm.tb.tpsfwea.t59300163
EISBN: 978-1-62708-323-2
... Abstract This chapter covers the friction and wear behaviors of copper alloys. It describes the compositions and forms of copper available and their suitability for applications involving friction, different types of erosion, and adhesive and abrasive wear. alloy composition copper...
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Published: 01 January 2015
Fig. 19.7 Copper (copper-colored features) penetration adjacent to high temperature oxidized crack in a medium carbon steel. As polished surface, light micrograph More
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Published: 01 January 2000
Fig. 8 A copper/copper sulfate reference electrode More
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Published: 01 December 2015
Fig. 9 Copper-saturated copper sulfate reference electrode More
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Published: 01 October 2011
Fig. 14.10 The copper-rich side of the aluminum-copper equilibrium phase diagram. Source: Ref 14.7 More
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Published: 01 June 2016
Fig. 3.6 Calculated contours of a copper particle impacting onto a copper substrate at four different velocities. The dotted lines at the particle-substrate interfaces indicate the areas that undergo adiabatic shear instability. Source: Ref 3.50 More
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Published: 01 December 2001
Fig. 1 Effect of copper content on properties of silver-copper alloys More
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Published: 01 August 2005
Fig. 3.13 Tensile strength of copper-to-copper joints brazed with amorphous Cu-7P- x Ni- y Sn-7P-0.2RE braze by flame heating. The respective values of x and y are given alongside the bars on the chart. Maximum strength is achieved with 4% nickel and 6% tin. More
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Published: 01 March 2012
Fig. 9.3 Copper-rich section of copper-zinc phase diagram. Source: Ref 9.1 More
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Published: 31 December 2020
Fig. 33 Partial iron-copper phase diagram showing the solubility of copper in αFe (bcc) at temperatures below 910 °C (1670 °F) More
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Published: 01 April 2004
Fig. 2.45 Growth of copper-tin intermetallic compounds on a copper substrate wetted by lead-tin eutectic solder as a function of reaction time and temperature More
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Published: 01 April 2004
Fig. 2.46 Growth of copper-tin intermetallic compounds on a copper substrate in contact with lead-tin solder for 100 s at different process temperatures More
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Published: 01 July 2009
Fig. 14.9 Beryllium-copper equilibrium phase diagram in the copper-rich section More
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Published: 01 November 2013
Fig. 17 Properties of pure P/M copper. IACS, International Annealed Copper Standard. Source: Ref 7 More
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Published: 01 December 2006
Fig. 3.66 Stages in the extrusion of copper billets to copper wire (Source: ASEA) More