Skip Nav Destination
Close Modal
Search Results for
Conductors (devices)
Update search
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
Filter
- Title
- Authors
- Author Affiliations
- Full Text
- Abstract
- Keywords
- DOI
- ISBN
- EISBN
- Issue
- ISSN
- EISSN
- Volume
- References
NARROW
Format
Topics
Book Series
Date
Availability
1-20 of 101 Search Results for
Conductors (devices)
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Sort by
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110196
EISBN: 978-1-62708-247-1
... image (a) localizing a short circuit site on a 1MB SRAM and backside reflected light (b) image of the same field of view. Note that the shorting particle on top of metal-1 is not visible from the backside in (b). Figure 17 Backside SEI image (a) showing an open conductor resulting from an FIB...
Abstract
This article reviews the basic physics behind active photon injection for local photocurrent generation in silicon and thermal laser stimulation along with standard scanning optical microscopy failure analysis tools. The discussion includes several models for understanding the local thermal effects on metallic lines, junctions, and complete devices. The article also provides a description and case study examples of multiple photocurrent and thermal injection techniques. The photocurrent examples are based on Optical Beam-Induced Current and Light-Induced Voltage Alteration. The thermal stimulus examples are Optical Beam-Induced Resistance Change/Thermally-Induced Voltage Alteration and Seebeck Effect Imaging. Lastly, the article discusses the application of solid immersion lenses to improve spatial resolution.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110485
EISBN: 978-1-62708-247-1
.... Figure 9 AFM image of slip lines (dislocations) at the silicon surface of a fabricated device. The green arrows point to the slip lines. Figure 10 System schematic of a SKPM [8] . Figure 13 Locally induced capacitance variation in a p-doped semiconductor substrate; a) a negative...
Abstract
Scanning Probe Microscope (SPM) has an increasing important role in the development of nanoscale semiconductor technologies. This article presents a detailed discussion on various SPM techniques including Atomic Force Microscopy (AFM), Scanning Kelvin Probe Microscopy, Scanning Capacitance Microscopy, Scanning Spreading Resistance Microscopy, Conductive-AFM, Magnetic Force Microscopy, Scanning Surface Photo Voltage Microscopy, and Scanning Microwave Impedance Microscopy. An overview of each SPM technique is given along with examples of how each is used in the development of novel technologies, the monitoring of manufacturing processes, and the failure analysis of nanoscale semiconductor devices.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... a board or individual components. It is based on the principle of using a high-temperature (72K) superconducting quantum interference device (SQUID) to measure the vertical components of the magnetic fields surrounding conductors carrying current through short circuits or current arising from standing...
Abstract
In embedded systems, the separation between system level, board level, and individual component level failure analysis is slowly disappearing. In order to localize the initial defect area, prepare the sample for root cause analysis, and image the exact root cause, the overall functionality has to be maintained during the process. This leads to the requirement of adding additional techniques that help isolate and image defects that are buried deeply within the board structure. This article demonstrates an approach of advanced board level failure analysis by using several non-destructive localization techniques. The techniques considered for advanced fault isolation are magnetic current imaging for shorts and opens; infrared thermography for electrical shorts; time-domain-reflectometry for shorts and opens; scanning acoustic microscopy; and 2D/3D X-Ray microscopy. The individual methods and their operational principles are introduced along with case studies that will show the value of using them on board level defect analysis.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110111
EISBN: 978-1-62708-247-1
... spot at the center of the image. Figure 1 (Left) Magnetic field around a current element. The vertical component as detected by a sensor above the conductor is shown. Note opposite signs of the field on each side of the conductor (image courtesy of D. Vallett, Peaksource). (Right) 2D false...
Abstract
Magnetic field imaging (MFI), generally understood as mapping the magnetic field of a region or object of interest using magnetic sensors, has been used for fault isolation (FI) in microelectronic circuit failure analysis for almost two decades. Developments in 3D magnetic field analysis have proven the validity of using MFI for 3D FI and 3D current mapping. This article briefly discusses the fundamentals of the technique, paying special attention to critical capabilities like sensitivity and resolution, limitations of the standard technique, sensor requirements and, in particular, the solution to the 3D problem, along with examples of its application to real failures in devices.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860465
EISBN: 978-1-62708-348-5
..., size, and weight can be substantial and is the main motivating force for the use of superconducting magnets in a number of devices. 13.1.1 Applications Superconducting composites are used extensively today in many applications (a) where high magnetic fields must be generated economically or (b...
Abstract
The chapter presents an overview of the properties and operational limits of superconductive materials, as well as techniques used to fabricate practical superconducting wires. It introduces six properties: critical temperature, critical magnetic field, critical current density, stability, ac loss, and mechanical characteristics; for each property, typical data are provided and the experimental methods used to measure it are briefly described. The properties of the superconducting composites are tied together in the chapter to summarize their effect on superconductor material selection and the geometrical design of superconducting composites. The chapter also contains a reference guide to composite-design factors with links to the relevant chapter sections where each design consideration is addressed.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2015
DOI: 10.31399/asm.tb.piht2.9781627083119
EISBN: 978-1-62708-311-9
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110351
EISBN: 978-1-62708-247-1
... and Ga ion sputtering into Si and Cu samples at a range of energies from 9 KeV to 35 keV. [95] Figure 48 A neon beam was used to machine a trench through Si and stop on transistor diffusion fins and poly (metal-gate) regions from the backside of a 22 nm device. [99] Figure 41...
Abstract
Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720345
EISBN: 978-1-62708-305-8
... to reveal the presence of the flaw. Various means are used to magnetize the tube. A current carrying conductor inside the tube produces a circular magnetic field, magnetizing the tube in a circumferential direction. The magnetic flux is diverted by the longitudinal component of any flaws in its path...
Abstract
Wrought tubular products are nondestructively inspected chiefly by eddy current techniques (including the magnetic flux leakage technique) and by ultrasonic techniques. The methods discussed in this chapter include eddy current inspection, flux leakage inspection, ultrasonic inspection, magnetic particle inspection, liquid penetrant inspection, and radiographic inspection of resistance welded tubular products, seamless steel tubular products, and nonferrous tubular products. This chapter discusses the fundamental factors that should be considered in selecting a nondestructive inspection method and in selecting from among the commercially available inspection equipment. The factors covered are product characteristics, nature of the flaws, extraneous variables, rate of inspection, end effect, mill versus laboratory inspection, specification requirements, equipment costs, and operating costs.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720183
EISBN: 978-1-62708-305-8
... by placing the contact surfaces of the yoke next to and on either side of the bead (rotating yoke about 90° from position shown here). Source: Ref 2 Fig. 8 Use of central conductors for circular magnetization of (a) long hollow cylindrical parts and (b) short hollow cylindrical and ring-like...
Abstract
Liquid penetrant, magnetic particle, and eddy current inspection are used to detect surface flaws. This chapter is a detailed account of the physical principles, process description, equipment requirements, selection criteria, advantages, limitations, and applications of these surface flaw detection techniques.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860163
EISBN: 978-1-62708-348-5
... commercial components is described by Clark and Fickett (1969) . An extensive discussion of techniques using SQUID (Superconducting Quantum Interference Devices) detectors is given by Gifford, Webb, and Wheatley (1972) . Other devices, which convert the low-level dc voltage to ac in the cryostat...
Abstract
This chapter presents topics pertaining to resistance at cryogenic temperatures: measurement, the resistive mechanisms, and available data. The chapter also presents brief descriptions of the various mechanisms that are operative in producing resistance at low temperatures. The alloys discussed are the nondilute mixtures of metals. An introduction to low-temperature electrical properties of specific metals and alloys is included.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ems.t53730037
EISBN: 978-1-62708-283-9
.... It discusses the significance of energy bands, intrinsic and extrinsic conduction, and the properties of compound semiconductors. It also covers semiconductor devices, including p-n junctions, light emitting diodes, transistors, and piezoelectric crystals. electrical behavior light emitting diodes...
Abstract
This chapter examines some of the behaviors that suit materials for electrical and electronic applications. It begins by explaining how charge carriers move in metals and semiconductors and how properties such as conductivity, mobility, and resistivity are derived. It discusses the significance of energy bands, intrinsic and extrinsic conduction, and the properties of compound semiconductors. It also covers semiconductor devices, including p-n junctions, light emitting diodes, transistors, and piezoelectric crystals.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.9781627082501
EISBN: 978-1-62708-250-1
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220241
EISBN: 978-1-62708-341-6
... times, the high heating rates of induction are needed for processing nonconductors. This chapter describes broad methods of accomplishing such objectives: modification of the field of magnetic induction, use of devices to prevent auxiliary equipment or certain portions of a workpiece from being heated...
Abstract
To a large extent, the induction coil and its coupling to the workpiece determine the precise heating pattern that is developed. However, it is often desirable to modify this pattern in order to produce a special heating distribution or to increase energy efficiency. At other times, the high heating rates of induction are needed for processing nonconductors. This chapter describes broad methods of accomplishing such objectives: modification of the field of magnetic induction, use of devices to prevent auxiliary equipment or certain portions of a workpiece from being heated, and techniques to apply heating to electrically nonconductive materials. These methods make use of devices such as flux concentrators, shields, and susceptors. The chapter provides a description of the materials for these devices and guidelines for their application.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1988
DOI: 10.31399/asm.tb.eihdca.t65220281
EISBN: 978-1-62708-341-6
... increases. Coating thickness is therefore limited by the properties of the plastic itself. Similar techniques are employed in insulating electrical conductors using polyemide film or tape. The high-temperature resistance of the polyemide film, which is applied in the form of high-integrity tape heat...
Abstract
Induction heating has found widespread use as a method to raise the temperature of a metal prior to forming or joining, or to change its metallurgical structure. However, induction heating has specialized capabilities that make it suitable for applications outside of metal treatment and fabrication. This chapter summarizes some of the special applications of induction heating, including those in the plastics, packaging, electronics, glass, chemical, and metal-finishing industries. The chapter concludes with a discussion of the application of induction heating for vacuum processes.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860515
EISBN: 978-1-62708-348-5
... the practical use of all thermometers is associated with some approximation of the thermodynamic temperature scale. A short section is devoted to types of temperature measuring devices. The characteristics of commercially available resistance-type strain gauges at low temperatures are stressed. greases...
Abstract
This chapter discusses three measurements parameters: temperature, strain, and magnetic field strength. It stresses the measurement of temperature because it is the primary variable in nearly all low-temperature material properties. The chapter contains information on methods and auxiliary materials. Areas of frequent concern, such as thermal contact, heat leak, thermal anchoring, thermal conductivity of greases, insulators, lead wires, ground loops, and feedthroughs are also reviewed. The chapter provides an overview and historical development of temperature scales because the practical use of all thermometers is associated with some approximation of the thermodynamic temperature scale. A short section is devoted to types of temperature measuring devices. The characteristics of commercially available resistance-type strain gauges at low temperatures are stressed.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 April 2013
DOI: 10.31399/asm.tb.imub.t53720063
EISBN: 978-1-62708-305-8
.... Therefore, a machine vision system includes both visual sensing and interpretive capabilities. An image sensing device, such as a vidicon camera or a charge-coupled device (CCD) image sensor, is nothing more than a visual sensor that receives light through its lens and converts this light into electrical...
Abstract
Machine vision is a means of simulating the image recognition and analysis capabilities of the human eye/brain system with electronic and electromechanical techniques. This chapter discusses four basic steps in the machine vision process, namely image formation, image preprocessing, image analysis, and image interpretation. Details of the processes involved, equipment used, and the factors to be considered are also presented. In addition, the applications of machine vision are discussed.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 1999
DOI: 10.31399/asm.tb.caaa.t67870001
EISBN: 978-1-62708-299-0
... such as chemical processing equipment. Also for nameplates, fan blades, flue lining, sheet metal work, spun holloware, and fin stock 1350 Electrical conductors 2011 Screw machine products. Appliance parts and trim, ordnance, automotive, electronic, fasteners, hardware, machine parts 2014 Truck frames...
Abstract
Aluminum is the second most widely used metal in the world. It is readily available, offers a wide range of properties, and can be shaped, coated, and joined using a variety of methods. This chapter discusses some of the key attributes of wrought and cast aluminum alloys and the classifications, designations, and grades of available product forms. It also explains how aluminum alloys are used in aerospace, automotive, rail, and marine applications as well as in building and construction, electrical products, manufacturing equipment, packaging, and consumer durables such as appliances and furniture.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110132
EISBN: 978-1-62708-247-1
...] Searls Damion , Don Anura , Dy Emilie , Goyal Deepak , “ Time Domain Reflectometry as a Device Packaging Level Failure Analysis and Failure Localization Tool ”, ISTFA 2000: Proceedings of the 26th International Symposium for Testing and Failure Analysis , Pp. 285 – 291 . [3...
Abstract
Time-domain based characterization methods, mainly time-domain reflectometry (TDR) and time-domain transmissometry (TDT), have been used to locate faults in twisted cables, telegraph lines, and connectors in the electrical and telecommunication industry. This article provides a brief review of conventional TDR and its application limitations to advanced packages in semiconductor industry. The article introduces electro optical terahertz pulse reflectometry (EOTPR) and discusses how its improvements of using high frequency impulse signal addressed application challenges and quickly made it a well-adopted tool in the industry. The third part of this article introduces a new method which combines impulse signal and the TDT concept, and discusses a combo TDR and TDT method. Cases studies and application notes are shared and discussed for each technique. Application benefits and limitations of these techniques (TDR, EOTPR, and combo TDR/TDT) are summarized and compared.
Book Chapter
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240303
EISBN: 978-1-62708-251-8
.... Fig. 17.4 Density of state-energy curves and band structures Although all metals are relatively good conductors of electricity, they exhibit a range of resistivities. There are a number of reasons for this variability. The resistivity of a metal depends on the density of states of the most...
Abstract
The physical properties of a material are those properties that can be measured or characterized without the application of force and without changing material identity. This chapter discusses in detail the common physical properties of metals, namely density, electrical properties, thermal properties, magnetic properties, and optical properties. Some physical properties for a number of metals are given in a table.
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110180
EISBN: 978-1-62708-247-1
... FinFET 10nm and Smaller Band Gap Engineering Strain and Channel Mobility Forward Bias Reverse Bias Leaky pn Junction Avalanche Breakdown As discussed in the introduction, light emission phenomena are very unlikely in commercial passive devices built from conductor and insulator...
Abstract
Photon emission (PE) is one of the major optical techniques for contactless isolation of functional faults in integrated circuits (ICs) in full electrical operation. This article describes the fundamental mechanisms of PE in silicon based ICs. It presents the opportunities of contactless characterization for the most important electronic device, the MOS - Field Effect Transistor, the heart of ICs and their basic digital element, the CMOS inverter. The article discusses the specification and selection of detectors for proper PE applications. The main topics are image resolution, sensitivity, and spectral range of the detectors. The article also discusses the value and application of spectral information in the PE signal. It describes state of the art IC technologies. Finally, the article discusses the applications of PE in ICs and also I/O devices, integrated bipolar transistors in BiCMOS technologies, and parasitic bipolar effects like latch up.