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Complex failures

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Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2008
DOI: 10.31399/asm.tb.fahtsc.t51130087
EISBN: 978-1-62708-284-6
.... The classical organization for types of damage (failures) is as follows: deformation, fracture, wear, corrosion or other environmental damage, and multiple or complex damage. The chapter also provides some examples of lack of conformance to specification that may at first look like the heat treater did...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630237
EISBN: 978-1-62708-270-9
... Abstract Elevated-temperature failures are the most complex type of failure because all of the modes of failures can occur at elevated temperatures (with the obvious exception of low-temperature brittle fracture). Elevated-temperature problems are real concerns in industrial applications...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110550
EISBN: 978-1-62708-247-1
... these 2.5D and 3D packages. This article focuses on these methods of fault isolation, non-destructive imaging, and destructive techniques through an iterative process for failure analysis of complex packages. 2.5D packaging 3D packaging destructive techniques failure analysis fault isolation non...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180029
EISBN: 978-1-62708-256-3
... Abstract Many companies conduct only metallurgical evaluations in the wake of failures, discovering nothing more than the physical mechanism by which the failure occurred. The origin of failures, however, is often complex, involving not only physical mechanisms, but also human behavior...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110673
EISBN: 978-1-62708-247-1
... activities Introduction The design, fabrication, reliability, and analysis of semiconductor components has become an increasingly complex task. Today’s engineer is called on to pull “a rabbit out of a hat.” Every year, the feature sizes get smaller, the designs get bigger, and the customer wants...
Series: ASM Technical Books
Publisher: ASM International
Published: 30 November 2013
DOI: 10.31399/asm.tb.uhcf3.t53630xvi
EISBN: 978-1-62708-270-9
... Abstract Designs and materials continue to become more complex, with novel technologies developed to create them, and novel instruments invented to analyze them. Engineers at all stages of the design and manufacturing process should appreciate the reasons why formal failure analysis...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110062
EISBN: 978-1-62708-247-1
... are small and are typically obscured by other feature in the packaging when viewed from almost any angle. Therefore, as the complexity of packaging components increases, 3D X-ray micro-CT imaging technique starts to play an increasingly important role in the failure analysis laboratory. Figure 7...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780019
EISBN: 978-1-62708-268-6
... systems work: Interviewing the system designers and development engineers is a great place to start. Most systems are complex, and it may be that no single engineer knows how the entire system is supposed to work. The failure analysis team may have to interview mechanical, electrical, and software...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2005
DOI: 10.31399/asm.tb.faesmch.t51270031
EISBN: 978-1-62708-301-0
... fractography failure mode and effect analysis WITH THE EVOLUTION of the methodology of failure analysis, and keeping pace with the complexities of failures in modern intricate machines and structures, newer techniques have been established for carrying out the various stages of failure analysis. Some...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.horfi.t51180151
EISBN: 978-1-62708-256-3
... all the primary parts of the aircraft were aboard at the time that it crashed. Providing an inventory, although painstaking, is often invaluable. The cause of a complex aircraft accident was determined by an experienced investigator when he observed that a portion of one wing tip was missing from...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2022
DOI: 10.31399/asm.tb.isceg.t59320049
EISBN: 978-1-62708-332-4
... deteriorate because of prolonged exposure to the environment. The assumption made in the analysis is approximate. Geometry changes that can cause stress concentration affect the assumed value of the yield stress. Even the failure criteria assumptions and the finite element analysis (FEA) of complex...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110001
EISBN: 978-1-62708-247-1
... Abstract This article introduces the wafer-level fault localization failure analysis (FA) process flow for an accelerated yield ramp-up of integrated circuits. It discusses the primary design considerations of a fault localization system with an emphasis on complex tester-based applications...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110379
EISBN: 978-1-62708-247-1
... Abstract With semiconductor device dimension continuously scaling down and increasing complexity in integrated circuits, delayering techniques for reverse engineering is becoming increasingly challenging. The primary goal of delayering in semiconductor failure analysis is to successfully remove...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2012
DOI: 10.31399/asm.tb.smfpa.t53500249
EISBN: 978-1-62708-317-1
... Abstract Sheet metal spinning is a forming technique that produces axially symmetric hollow bodies with nearly any contour. It is often used in combination with flow forming and shear spinning to manufacture a wide range of complex parts. This chapter describes the operating principles, stress...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.tb.omfrc.t53030223
EISBN: 978-1-62708-349-2
... The honeycomb sandwich structure composite is a very efficient and complex structure widely used in the aircraft industry. Honeycomb-cored sandwich panels increase part stiffness at a lower weight than monolithic composite materials. This chapter describes the analysis of the intermingling of the film adhesive...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2012
DOI: 10.31399/asm.tb.pdub.t53420231
EISBN: 978-1-62708-310-2
... by Gibbs energy changes. It plots the energy of formation for many important metal oxides and explains how to construct isothermal stability diagrams to analyze complex reactions involving metals, alloys, and gases containing more than one reactive component. gas-metal systems isothermal stability...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.t53700107
EISBN: 978-1-62708-279-2
... maximum stress versus number of cycles to failure for a tension-tension loading ratio R = 0.1. Fig. 6.3 E ngineering stress-strain curves for a series of CP steel types. Source: Ref 6.3 Fig. 6.4 T rue stress-strain curves for a series of CP steel types. Source: Ref 6.3 Chapter 6: Complex-Phase Steels...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.tb.ahsssta.9781627082792
EISBN: 978-1-62708-279-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.tb.sfa.t52780057
EISBN: 978-1-62708-268-6
... ) * ( 3.2 × 10 − 6 ) = 3.64 × 10 − 6 The situation becomes more complex when considering more than two inputs into an OR gate. As stated previously, the probability of the command event occurring above an OR gate is equal to the sum of the probabilities of each event...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 November 2019
DOI: 10.31399/asm.tb.mfadr7.t91110025
EISBN: 978-1-62708-247-1
... complexity of layers and a multitude of materials. This limits access to the defect site, making it difficult to determine a failure’s root cause. Figure 1 also demonstrates the trends within packaging technologies towards shrinking dimensions. The integration of individual components into the board layer...