Distortion failures are readily identified by the inherent change in size and/or shape. They are serious because they can lead to other types of failure or may even cause complete collapse of structures, such as bridges, ladders, beams, and columns. Distortion failures may be classified in different ways. One way is to consider them either as dimensional distortion (growth or shrinkage) or as shape distortion (such as bending, twisting, or buckling). They may also be classified as being either temporary or permanent in nature. This chapter discusses the nature, causes, and effects of all of these types of failures as well as the methods to manage them.

Semiconductor memories are superb drivers for process yield and reliability improvement because of their highly structured architecture and use of aggressive layout rules. This combination provides outstanding failure signature analysis possibilities for the entire design, manufacturing, and test process. This article discusses five key disciplines of the signature analysis process that need to be orchestrated within the organization: design for test practices, test floor data collection methodology, post-test data analysis tools, root cause theorization, and physical failure analysis strategies.

The coordinate measuring machine (CMM) is used for three-dimensional inspection of both in-process and finished parts. This chapter provides a detailed account of the operating principles, measurement techniques, capabilities, and applications of CMMs. The types of CMMs are described. Vertical CMMs include cantilever-type, bridge-type, and gantry CMMs; horizontal CMMs, such as the horizontal-arm type, are also covered. The CMM application for geometric measurement, contour measurement, and specialized surface measurement are discussed.

With the commercialization of heavier and lighter ion beams, adoption of focused ion beam (FIB) use for analysis of challenging regions of interest (ROI) has grown. In this chapter, the authors focus on highlighting commercially available and complementary FIB technologies and their implementation challenges and application trends.

The ultimate goal of the failure analysis process is to find physical evidence that can identify the root cause of the failure. Transmission electron microscopy (TEM) has emerged as a powerful tool to characterize subtle defects. This article discusses the sample preparation procedures based on focused ion beam milling used for TEM sample preparation. It describes the principles behind commonly used imaging modes in semiconductor failure analysis and how these operation modes can be utilized to selectively maximize signal from specific beam-specimen interactions to generate useful information about the defect. Various elemental analysis techniques, namely energy dispersive spectroscopy, electron energy loss spectroscopy, and energy-filtered TEM, are described using examples encountered in failure analysis. The origin of different image contrast mechanisms, their interpretation, and analytical techniques for composition analysis are discussed. The article also provides information on the use of off-axis electron holography technique in failure analysis.

This chapter discusses the composition, properties, microstructure, grain formation, and fracture behavior of gray, white, ductile, and malleable cast iron and how these critical factors are affected when iron is heated to different temperatures prior to or during solidification.

This article focuses on characterization techniques used for analyzing the physical behavior and chemical composition of thermoset resins, namely chromatography and infrared spectroscopy. The main purpose is to give sufficient detail to permit the reader understand a particular test technique and its value to the thermoset resin field. Epoxy resins are emphasized in the examples because they dominate the airframe and aerospace industries. The article also provides information on two categories of characterization of the processing behavior of thermoset. The first studies the thermal properties of reactive thermoset systems, while the second utilizes these thermal characteristics as the basis for monitoring and control during processing.

Beryllium, despite its relatively simple atomic structure, possesses a wide range of useful engineering properties. It has the highest strength-to-weight ratio and modulus of elasticity among structural metals and is an important alloy addition in copper, nickel, and aluminum alloys. It also has excellent thermal properties, low atomic mass, a small x-ray absorption cross section, and a large neutron scattering cross section. This brief introductory chapter provides an overview of the unique qualities of beryllium along with typical applications and uses.

This chapter describes three approaches for 3D hot-spot localization of thermally active defects by lock-in thermography (LIT). In the first section, phase-shift analysis for analyzing stacked die packages is performed. The second example employs defocusing sequences for the localization of resistive electrical shorts in 3D architectures, and the third operates in cross sectional LIT mode to investigate defects in the insulation liner of Through Silicon Vias. All three approaches allow for a precise localization of thermally active defects in all three spatial dimensions to guide subsequent high-resolution physical analyses.

Circuit edit has been instrumental to the development of focused ion beam (FIB) systems. FIB tools for advanced circuit edit play a major role in the validation of design and manufacture. This chapter begins with an overview of value, role, and unique capabilities of FIB circuit edit tools for first silicon debug. The etching capabilities of circuit edit FIB tools are then discussed, providing information on chemistry assisted etching in silicon oxides and low-k dielectrics. The chapter also discusses the requirements and procedures involved in edit operation: high aspect ratio milling, endpointing, and cutting copper. It then provides an introduction to FIB metal/conductor deposition and FIB dielectric deposition. Edit design rules that can facilitate prototype production from first silicon are also provided. The chapter concludes with a discussion on future trends in circuit edit technology.

This article provides an overview of how to use the scanning electron microscope (SEM) for imaging integrated circuits. The discussion covers the principles of operation and practical techniques of the SEM. The techniques include sample mounting, sample preparation, sputter coating, sample tilt and image composition, focus and astigmatism correction, dynamic focus and image correction, raster alignment, and adjusting brightness and contrast. The article also provides information on achieving ultra-high resolution in the SEM. It concludes with information on the general characteristics and applications of environmental SEM.

The solidification process has a major influence on the microstructure and mechanical properties of metal casting as well as wrought products. This appendix covers the fundamentals of solidification. It discusses the formation of solidification structures, the characteristics of planar, cellular, and dendritic growth, the basic freezing sequence for an alloy casting, and the variations in cooling rate, heat flow, and grain morphology in different areas of the mold. It also describes the types of segregation that occur during freezing, the effect of solidification rate on secondary dendrite arm spacing, and the factors that contribute to porosity and shrinkage.

Steel castings are produced in thousands of designs for different applications. They fill needs in many industries, including transportation, construction machinery, earthmoving equipment, rolling mills, mining, oil and gas exploration, and power generation. This chapter touches upon the variety of applications for which steel castings can be supplied and the ranges of casting size and complexity. Photographs in this chapter provide an understanding of these applications, their size and complexity, and the types of cast steels produced.

Steels contain a wide range of elements, including alloys as well as residual processing impurities. This chapter describes the chemical composition of low-alloy AISI steels, which are classified based on the amounts of chromium, molybdenum, and nickel they contain. It explains why manganese is sometimes added to steel and how unintended consequences, such as the development of sulfide stringers, can offset the benefits. It also examines the effect of alloying elements on the iron-carbon phase diagram, particularly their effect on transformation temperatures.

This chapter explains how polymeric adhesives are applied to composite as well as metal parts, forming bonded structures. It describes surface preparation practices and techniques, epoxy selection and use, and bonding procedures.

This chapter provides a comprehensive overview over all phenomena related to Voltage Contrast (VC) mechanisms in SEM and FIB. The multiple advantages, possibilities, and limits of active and passive VC failure localization are systemized and discussed. The knowledge of all facts influencing the VC generation (capacitance, leakage, doping, and circuitry) is very helpful for successful failure localization.

This article, prepared under the auspices of the ASM Thermal Spray Society Committees on Accepted Practices, describes a procedure for evaluating residual stresses in thermal spray coatings, which is an extension of the well-known layer removal method to include the Young’s modulus and Poisson’s ratio properties of the thermal spray coating material and the substrate. It presents questions and answers that were selected to introduce residual stresses in thermal spray coatings. The article describes equipment and the laboratory procedure for the modified layer removal method and provides the description of the residual stress specimen. It also describes the procedures for applying or installing bonded resistance strain gages, the dimensions of the test specimen, the procedure for removing layers, and the method for interpreting the data to evaluate residual stresses. The spreadsheet program, “ MLRM for Residual Stresses ,” is available as a supplement to this document.

This appendix is a compilation of tables helpful to metallographers in characterizing irons and steels. The tables include AISI/SAE designations and specific composition ranges for various steels and irons, listings of companies that sell metallographic equipment and supplies, and compositions and usage guidance for etchants, chemical polishing solutions, and coatings.

This chapter examines the microstructure of special bar quality (or engineering) steels and how it is influenced by carbon content, tempering temperature, and prior austenitic grain size. It explains how some of the changes are difficult to detect and require special etching and/or measurement techniques. It provides information on many types of engineering steel, including medium and high-carbon steels used in rail applications. It also examines the effect of nickel-phosphorus coatings on stainless steel and phosphate coatings used to reduce friction during thread rolling and other such procedures.