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Arsenical tough-pitch copper

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Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 2008
DOI: 10.31399/asm.tb.emea.t52240469
EISBN: 978-1-62708-251-8
... of the copper is oxidized to Cu 2 O. Next, the blister copper is fire refined, which converts most of the Cu 2 O back into elemental copper, with approximately 0.5% Cu 2 O still remaining. The copper is now called tough pitch copper, which is used for some applications. The remainder of the tough pitch copper...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.t61170457
EISBN: 978-1-62708-297-6
... requiring the highest electrical conductivity. Their conductivity is at least 100% IACS (International Annealed Copper Standard, as described in the section “ Effects of Impurities and Alloying Elements on Electrical Conductivity .”) Electrolytic tough pitch (ETP) copper (C11000) is commonly used...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 October 2011
DOI: 10.31399/asm.tb.mnm2.t53060315
EISBN: 978-1-62708-261-7
.... Alloyed with antimony or calcium, lead is used as both castings and sheet in automotive and standby storage batteries. Bearing alloys include lead alloyed with combinations of antimony, arsenic, and copper to yield suitable hardness and embeddability (the ability of a bearing material to embed harmful...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2001
DOI: 10.31399/asm.tb.aub.9781627082976
EISBN: 978-1-62708-297-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910363
EISBN: 978-1-62708-250-1
..., silicates, carbonates, phosphates, and arsenates. (It should be noted that environmental concerns have significantly impacted the use of chromates.) The organic inhibitors are many and include amines, heterocyclic nitrogen compounds, sulfur compounds (such as thioethers, thioalcohols, thioamides, thiourea...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 2015
DOI: 10.31399/asm.tb.cpi2.9781627082822
EISBN: 978-1-62708-282-2
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.9781627083485
EISBN: 978-1-62708-348-5
Series: ASM Technical Books
Publisher: ASM International
Published: 01 August 2005
DOI: 10.31399/asm.tb.mmfi.t69540047
EISBN: 978-1-62708-309-6
... detailed images, diagrams, and explanations. It discusses the various factors that influence strength and ductility, including grain size, loading rate, and temperature. It also provides information on the origin of residual stresses, the concept of toughness, and the damage mechanisms associated...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.tb.cub.t66910099
EISBN: 978-1-62708-250-1
... and galvanic corrosion that can occur in a liquid environment when ions of more cathodic metal (e.g., copper) are plated out of solution onto a more anodic metal surface (e.g., aluminum). Despite its shortcomings, the classification of corrosion forms based on physical appearance or attack mechanism allows...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850001
EISBN: 978-1-62708-260-0
... of the refining process by fracture examination. A small sample was poured and cooled rapidly. The sample was broken, and the fracture “read.” Obviously, some experience was required. The approximate carbon content was assessed by the degree of brittleness or toughness of the fracture. High oxygen content could...
Book Chapter

Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.t67850165
EISBN: 978-1-62708-260-0
... of a minor amount of ammonium bifluoride (NH 4 FHF) (see App. I ). Beraha also developed a complex aqueous thiosulfate solution containing lead acetate and citric acid, which has wide applicability. This reagent deposits a lead sulfide film and is very useful for copper-based alloys, for preferential...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.mgppis.9781627082587
EISBN: 978-1-62708-258-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 June 1983
DOI: 10.31399/asm.tb.mlt.t62860515
EISBN: 978-1-62708-348-5
... . Dauphinee T. M. and Preston-Thomas H. ( 1954 ). A copper resistance temperature scale . Rev. Sci. Instrum . 25, 884 – 886 . 10.1063/1.1771200 Denner H. ( 1969 ). Thermal conductivity of adhesives at low temperatures . Cryogenics 9, 282 – 283 . 10.1016/0011-2275(69)90235-5...
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2006
DOI: 10.31399/asm.tb.fdsm.9781627083447
EISBN: 978-1-62708-344-7
Series: ASM Technical Books
Publisher: ASM International
Published: 01 December 1984
DOI: 10.31399/asm.tb.mpp.9781627082600
EISBN: 978-1-62708-260-0
Series: ASM Technical Books
Publisher: ASM International
Published: 01 September 2011
DOI: 10.31399/asm.tb.cfw.9781627083386
EISBN: 978-1-62708-338-6
Series: ASM Technical Books
Publisher: ASM International
Published: 01 March 2002
DOI: 10.31399/asm.tb.stg2.9781627082679
EISBN: 978-1-62708-267-9