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Alignment

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Image
Published: 01 November 2019
Figure 6 Alignment of mounted sample from Figure 5 for flat lap process. More
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Published: 01 September 2008
Fig. 38 Alignment of the elongated inclusions (oriented in the longitudinal direction of the part) act as an easy propagation path in the 52100 steel axle. The main fracture direction, that is, longitudinal, corresponds exactly to the elongation and inclusion alignments. The arrows point More
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Published: 01 August 2018
Fig. 12.49 Longitudinal cross section of a nut, close to the thread. The alignment of the structure, which is deformed, indicates that the central hole of the nut was made by punching (in the image, from right to left). Afterward, the thread was machined (cut). Etchant: nital. More
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Published: 30 April 2020
Fig. 11.1 A powder-binder system with embedded fibers or whiskers undergoes alignment during flow through a constricted channel. More
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Published: 30 April 2020
Fig. 11.2 Two examples of alignment in powder-binder systems. (a) Whiskers in a sintered alumina matrix. (b) Fibers in a sintered nickel aluminide matrix More
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Published: 01 November 2010
Fig. 10.6 Strength and modulus as functions of load alignment. Source: Ref 3 , 4, 5 More
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Published: 01 June 1983
Figure 6.1 (a) Diamagnetic alignment of atomic magnetic moments. (b) Magnetization vs. field for a diamagnet. (c) Susceptibility vs. temperature for a diamagnet. More
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Published: 01 June 1983
Figure 6.3 (a) Paramagnetic alignment of atomic magnetic moments. (b) Magnetization vs. field for a paramagnet. (c) Susceptibility and reciprocal susceptibility vs. temperature for a paramagnet. More
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Published: 01 June 1983
Figure 6.5 (a) Ferromagnetic alignment of atomic magnetic moments. (b) Magnetization vs. temperature showing saturation magnetization, M s . (c) Saturation magnetization vs. temperature below the Curie temperature, T C (d) Susceptibility and reciprocal susceptibility vs. temperature above More
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Published: 01 June 1983
Figure 6.8 (a) Antiferromagnetic alignment of atomic magnetic moments. (b) Susceptibility and reciprocal susceptibility vs. temperature showing antiferromagnetic (AF) and paramagnetic (P) intervals. More
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Published: 01 June 1983
Figure 6.10 (a) Ferrimagnetic alignment of atomic magnetic moments. (b–e) Saturation magnetization vs. temperature for ferrimagnets. (f) Reciprocal susceptibility vs. temperature for a ferrimagnet. More
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Published: 01 June 1983
Figure 6.12 (a) Cluster magnetic moment alignment for a superparamagnetic ensemble. (b) Magnetization, M , vs. field, H , scaled by temperature, T . The data all fall on a single curve characterized by the Langevin function. (c) Susceptibility vs. temperature for a superparamagnetic More
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Published: 01 December 2004
Fig. 10 Improper (left) and proper (right) alignment of specimen attachment areas with axis of specimen More
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Published: 01 December 2004
Fig. 11 Improper (left, center) and proper (right) alignment of specimen in wedge grips More
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Published: 01 June 2008
Fig. 17.11 Domain alignment of magnetically hard and soft materials. Source: Ref 5 More
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Published: 01 November 2019
Figure 12 LADA sites with the aligned CAD overlay. The sites may be large relative to the transistors, but it is possible to deduce the affected transistor by looking for an interconnected path. Only the green shaded nets traverse all 3 sites; the purples nets intersect only some of the sites. More
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Published: 01 August 2005
Fig. 6.9 Patterned, plated, and stacked sheets, aligned in a jig ready for application of the compressive load and diffusion brazing in a vacuum oven. The diffusion brazing conditions were a compressive stress of 3 MPa (440 psi) and a process temperature of 820 °C (1510 °F), sustained for 10 h. More
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Published: 01 August 2012
Fig. 15.3 Strain gages aligned in a Wheatstone bridge circuit. Source: Ref 15.6 More
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Published: 01 March 2006
Fig. A.51 Typical hydraulically operated self-aligning grip system installed on testing machine. Source: Ref A.55 More
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Published: 01 April 2004
Fig. 5.9 Flip-chip interconnect schemes. The prepared components are aligned and joined by either applying pressure (solid-state compression bonding) or heat (soldering). More